FR2639154B1 - CONNECTOR FOR TRANSFORMING A SPECIFIC HOUSING OF INTEGRATED CIRCUIT WITH CONNECTION PLOTS INTO A STANDARD HOUSING WITH CONNECTING PIN - Google Patents
CONNECTOR FOR TRANSFORMING A SPECIFIC HOUSING OF INTEGRATED CIRCUIT WITH CONNECTION PLOTS INTO A STANDARD HOUSING WITH CONNECTING PINInfo
- Publication number
- FR2639154B1 FR2639154B1 FR8814803A FR8814803A FR2639154B1 FR 2639154 B1 FR2639154 B1 FR 2639154B1 FR 8814803 A FR8814803 A FR 8814803A FR 8814803 A FR8814803 A FR 8814803A FR 2639154 B1 FR2639154 B1 FR 2639154B1
- Authority
- FR
- France
- Prior art keywords
- housing
- transforming
- connector
- integrated circuit
- connecting pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8814803A FR2639154B1 (en) | 1988-11-15 | 1988-11-15 | CONNECTOR FOR TRANSFORMING A SPECIFIC HOUSING OF INTEGRATED CIRCUIT WITH CONNECTION PLOTS INTO A STANDARD HOUSING WITH CONNECTING PIN |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8814803A FR2639154B1 (en) | 1988-11-15 | 1988-11-15 | CONNECTOR FOR TRANSFORMING A SPECIFIC HOUSING OF INTEGRATED CIRCUIT WITH CONNECTION PLOTS INTO A STANDARD HOUSING WITH CONNECTING PIN |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2639154A1 FR2639154A1 (en) | 1990-05-18 |
FR2639154B1 true FR2639154B1 (en) | 1990-12-21 |
Family
ID=9371845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8814803A Expired - Lifetime FR2639154B1 (en) | 1988-11-15 | 1988-11-15 | CONNECTOR FOR TRANSFORMING A SPECIFIC HOUSING OF INTEGRATED CIRCUIT WITH CONNECTION PLOTS INTO A STANDARD HOUSING WITH CONNECTING PIN |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2639154B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399982A (en) * | 1989-11-13 | 1995-03-21 | Mania Gmbh & Co. | Printed circuit board testing device with foil adapter |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
US5297967A (en) * | 1992-10-13 | 1994-03-29 | International Business Machines Corporation | Electrical interconnector with helical contacting portion and assembly using same |
GB9301321D0 (en) * | 1993-01-23 | 1993-03-17 | Chemring Ltd | Dispenser |
DE29500428U1 (en) * | 1995-01-12 | 1995-03-30 | Hewlett-Packard GmbH, 71034 Böblingen | Connecting component |
FR2940521B1 (en) | 2008-12-19 | 2011-11-11 | 3D Plus | COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524649A1 (en) * | 1982-04-02 | 1983-10-07 | Thomson Csf | Multiple contact printed circuit board testing system - uses set of feeler probes to form electrical contact with circuit board and second set of removable feeler probes |
GB2139019A (en) * | 1983-04-29 | 1984-10-31 | Gen Electric Co Plc | Printed circuit board testers |
-
1988
- 1988-11-15 FR FR8814803A patent/FR2639154B1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
Also Published As
Publication number | Publication date |
---|---|
FR2639154A1 (en) | 1990-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |