FR2638051B1 - WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD - Google Patents

WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD

Info

Publication number
FR2638051B1
FR2638051B1 FR8813471A FR8813471A FR2638051B1 FR 2638051 B1 FR2638051 B1 FR 2638051B1 FR 8813471 A FR8813471 A FR 8813471A FR 8813471 A FR8813471 A FR 8813471A FR 2638051 B1 FR2638051 B1 FR 2638051B1
Authority
FR
France
Prior art keywords
implementing
machine
welding process
wave welding
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR8813471A
Other languages
French (fr)
Other versions
FR2638051A1 (en
Inventor
Roland Philippe
Denis Olivier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Priority to FR8813471A priority Critical patent/FR2638051B1/en
Publication of FR2638051A1 publication Critical patent/FR2638051A1/en
Application granted granted Critical
Publication of FR2638051B1 publication Critical patent/FR2638051B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
FR8813471A 1988-10-13 1988-10-13 WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD Expired - Lifetime FR2638051B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8813471A FR2638051B1 (en) 1988-10-13 1988-10-13 WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8813471A FR2638051B1 (en) 1988-10-13 1988-10-13 WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD

Publications (2)

Publication Number Publication Date
FR2638051A1 FR2638051A1 (en) 1990-04-20
FR2638051B1 true FR2638051B1 (en) 1990-12-28

Family

ID=9370981

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8813471A Expired - Lifetime FR2638051B1 (en) 1988-10-13 1988-10-13 WAVE WELDING PROCESS AND MACHINE FOR IMPLEMENTING THE METHOD

Country Status (1)

Country Link
FR (1) FR2638051B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19512902A1 (en) * 1995-04-06 1996-10-10 Philips Patentverwaltung Process for wave soldering of assemblies
JP7141001B1 (en) * 2021-05-14 2022-09-22 千住金属工業株式会社 jet soldering machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0058766B1 (en) * 1981-02-23 1985-08-07 Matsushita Electric Industrial Co., Ltd. Soldering apparatus
US4530457A (en) * 1982-01-12 1985-07-23 Electrovert Ltd. Wave-soldering of printed circuit boards
JPS60227969A (en) * 1984-04-26 1985-11-13 Matsushita Electric Ind Co Ltd Soldering treatment

Also Published As

Publication number Publication date
FR2638051A1 (en) 1990-04-20

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Legal Events

Date Code Title Description
ST Notification of lapse