FR2629008B1 - METHOD AND DEVICE FOR CLAVING A SILICON WAFER - Google Patents
METHOD AND DEVICE FOR CLAVING A SILICON WAFERInfo
- Publication number
- FR2629008B1 FR2629008B1 FR8803794A FR8803794A FR2629008B1 FR 2629008 B1 FR2629008 B1 FR 2629008B1 FR 8803794 A FR8803794 A FR 8803794A FR 8803794 A FR8803794 A FR 8803794A FR 2629008 B1 FR2629008 B1 FR 2629008B1
- Authority
- FR
- France
- Prior art keywords
- claving
- silicon wafer
- wafer
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8803794A FR2629008B1 (en) | 1988-03-23 | 1988-03-23 | METHOD AND DEVICE FOR CLAVING A SILICON WAFER |
DE8989400793T DE68901566D1 (en) | 1988-03-23 | 1989-03-21 | METHOD AND DEVICE FOR SPLITTING SILICON WAFERS. |
EP19890400793 EP0334751B1 (en) | 1988-03-23 | 1989-03-21 | Method and device for cleaving a silicon wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8803794A FR2629008B1 (en) | 1988-03-23 | 1988-03-23 | METHOD AND DEVICE FOR CLAVING A SILICON WAFER |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2629008A1 FR2629008A1 (en) | 1989-09-29 |
FR2629008B1 true FR2629008B1 (en) | 1991-10-11 |
Family
ID=9364560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8803794A Expired - Lifetime FR2629008B1 (en) | 1988-03-23 | 1988-03-23 | METHOD AND DEVICE FOR CLAVING A SILICON WAFER |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0334751B1 (en) |
DE (1) | DE68901566D1 (en) |
FR (1) | FR2629008B1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03181131A (en) * | 1989-12-11 | 1991-08-07 | Naoetsu Denshi Kogyo Kk | Method and apparatus for forming reinforcing material of semiconductor wafer |
US7262115B2 (en) | 2005-08-26 | 2007-08-28 | Dynatex International | Method and apparatus for breaking semiconductor wafers |
US10773420B2 (en) | 2011-11-10 | 2020-09-15 | LatticeGear, LLC | Device and method for cleaving a substrate |
US10065340B2 (en) | 2011-11-10 | 2018-09-04 | LatticeGear, LLC | Device and method for cleaving |
CN103713102B (en) * | 2013-12-30 | 2015-04-29 | 哈尔滨工业大学 | Two-dimensional large-stroke linkage device for repairing surface micro defects of large-caliber optical element |
CN105082385A (en) * | 2015-08-10 | 2015-11-25 | 浙江辉弘光电能源有限公司 | Positioning supporting base for silicon ingot clamp |
CN107527841A (en) * | 2017-08-25 | 2017-12-29 | 浙江羿阳太阳能科技有限公司 | A kind of silicon chip production processing unit (plant) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3790051A (en) * | 1971-09-07 | 1974-02-05 | Radiant Energy Systems | Semiconductor wafer fracturing technique employing a pressure controlled roller |
FR2192481A5 (en) * | 1972-07-13 | 1974-02-08 | Bosonnet Mauric | |
GB2063149B (en) * | 1979-11-13 | 1983-02-16 | Arndrove Fabrications Ltd | Pressure-applying hand tools for severing a scored ceramic tile |
US4498451A (en) * | 1983-08-05 | 1985-02-12 | At&T Technologies, Inc. | Cutting articles along known planes |
US4653680A (en) * | 1985-04-25 | 1987-03-31 | Regan Barrie F | Apparatus for breaking semiconductor wafers and the like |
-
1988
- 1988-03-23 FR FR8803794A patent/FR2629008B1/en not_active Expired - Lifetime
-
1989
- 1989-03-21 DE DE8989400793T patent/DE68901566D1/en not_active Expired - Lifetime
- 1989-03-21 EP EP19890400793 patent/EP0334751B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE68901566D1 (en) | 1992-06-25 |
EP0334751A1 (en) | 1989-09-27 |
FR2629008A1 (en) | 1989-09-29 |
EP0334751B1 (en) | 1992-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |