FR2623015A1 - Insert support strip for integrated circuits - Google Patents
Insert support strip for integrated circuits Download PDFInfo
- Publication number
- FR2623015A1 FR2623015A1 FR8715587A FR8715587A FR2623015A1 FR 2623015 A1 FR2623015 A1 FR 2623015A1 FR 8715587 A FR8715587 A FR 8715587A FR 8715587 A FR8715587 A FR 8715587A FR 2623015 A1 FR2623015 A1 FR 2623015A1
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- Prior art keywords
- support strip
- circuits
- strip according
- central part
- integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Bande de support intercalaire pour circuits intégrés.Intermediate support strip for integrated circuits.
La présente invention concerne une bande de support intercalaire pour circuits intégrés en vue de leur enroulement sur des bobines. The present invention relates to an intermediate support strip for integrated circuits for winding on coils.
Un circuit intégré est un produit de très faibles dimensions constitué d'une pastille principale et d'un certain nombre de petites pastilles périphériques posées en série sur un même support (généralement polyester). Les pastilles périphériques sont reliées à la pastille principale par deux fils d'aluminium et soudées par ultrasons. Les brins sont donc très fragiles. Lors de la soudure, il est nécessaire de prévoir un rayon de courbure pour éviter que les brins ne soient trop tendus. An integrated circuit is a very small product consisting of a main pad and a number of small peripheral pads placed in series on the same support (generally polyester). The peripheral pads are connected to the main pad by two aluminum wires and welded by ultrasound. The strands are therefore very fragile. When welding, it is necessary to provide a radius of curvature to prevent the strands from being too tight.
Les pastilles, une fois soudées entre elles, toujours fixées sur le support, sont ensuite enroulées sur des bobines. The pellets, once welded together, still attached to the support, are then wound on coils.
Il est évident que si le support garni des circuits intégrés est enroulé sans précaution, il y a un risque de rupture des petits brins d'aluminium, et par conséquent un risque de destruction des fonctions des circuits intégrés.It is obvious that if the support lined with integrated circuits is wound without care, there is a risk of breaking small strands of aluminum, and therefore a risk of destruction of the functions of integrated circuits.
Afin d'éviter les risques de détérioration des circuits intégrés, il est donc nécessaire de prévoir un élément intercalaire destiné à séparer et à protéger les enroulements successifs de circuits. In order to avoid the risks of deterioration of the integrated circuits, it is therefore necessary to provide an intermediate element intended to separate and protect the successive windings of circuits.
C'est ainsi qu'ont été développés des supports de circuits à base de polypropylène possédant des reliefs latéraux et une partie centrale plane sur laquelle sont placés les circuits intégrés. Les reliefs sont destinés a séparer deux enroulements successifs de la bobine et ont dans ce but une hauteur suffisante pour éviter que les brins d'aluminium des circuits placés dans la partie centrale de support ne soient écrasés par le tour d'enroulement situé immédiatement au-dessus. This is how polypropylene circuit supports were developed, having lateral reliefs and a flat central part on which the integrated circuits are placed. The reliefs are intended to separate two successive windings of the coil and have for this purpose a sufficient height to prevent the aluminum strands of the circuits placed in the central support part from being crushed by the winding turn located immediately above. above.
Cependant, les supports à base de polypropylène présentent un certain nombre d'inconvénients et notamment en ce que la partie plate de support qui doit être parfaitement parallèle aux reliefs latéraux peut parfois se déformer pour devenir convexe ou concave. However, polypropylene-based supports have a certain number of drawbacks and in particular that the flat support part which must be perfectly parallel to the lateral reliefs can sometimes deform to become convex or concave.
Cette dernière éventualité est catastrophique car dans ce cas les brins d'aluminium sont écrasés et déformés et par la suite peuvent se briser. This last possibility is catastrophic because in this case the aluminum strands are crushed and deformed and subsequently can break.
Ce phénomène s'explique par le fait que la plupart des matières plastiques fluent à chaud ou à froid. This phenomenon is explained by the fact that most plastics flow hot or cold.
Un autre inconvénient réside dans le fait que certaines matières telles que le propylène se chargent facilement par électricité statique. Il y a donc également un risque de détérioration par décharge électrostatique sur les circuits. Another drawback lies in the fact that certain materials such as propylene are easily charged by static electricity. There is therefore also a risk of damage by electrostatic discharge on the circuits.
En outre, certaines matières ne permettent pas des températures de service supérieures à 1000C. Lors des opérations d'assemblage, les utilisateurs des circuits intégrés sont donc limités quant au choix d'une colle réticulant à chaud. In addition, certain materials do not allow operating temperatures above 1000C. During assembly operations, users of integrated circuits are therefore limited as to the choice of a hot crosslinking adhesive.
Par ailleurs, d'autres inconvénients,comme le manque d'élasticité, se font sentir notamment lors de l'enroulement sur les bobines; ainsi les circuits ne peuvent-ils pas s'empiler correctement. Furthermore, other drawbacks, such as the lack of elasticity, are felt in particular during winding on the coils; thus the circuits cannot stack properly.
La présente invention permet de remédier aux inconvénients précédents pour la première fois et de manière satisfaisante en proposant une bande de support intercalaire pour circuits intégrés en vue de leur enroulement sur bobines,comportant des ondulations latérales et une partie centrale plane destinée à supporter lesdits circuits, caractérisée en ce que ladite partie centrale comporte une armature permettant un enroulement correct de la bande tout en évitant l'écrasement des circuits. The present invention overcomes the above drawbacks for the first time and in a satisfactory manner by proposing an intermediate support strip for integrated circuits with a view to their winding on coils, comprising lateral corrugations and a flat central part intended to support said circuits, characterized in that said central part includes a frame allowing correct winding of the strip while preventing the circuits from being crushed.
La bande de support intercalaire selon l'invention est realisée avec une matière plastique souple ayant une bonne résistance chimique aux agents corrosifs et capable de ne subir aucune déformation lorsqu'elle est soumise à des températures comprises entre - 900C et + 2600C ; l'armature étant par exemple constituée d'un ruban métallique (acier, alliages spéciaux ...) ou d'un ruban de matière thermostable (polyimides, époxy, polyester chargé de fibres de verre, phénol-formol ...) intégré dans la partie centrale et enrobé avec la matière plastique précédente. The intermediate support strip according to the invention is produced with a flexible plastic material having good chemical resistance to corrosive agents and capable of undergoing no deformation when it is subjected to temperatures between - 900C and + 2600C; the reinforcement being for example made up of a metallic ribbon (steel, special alloys, etc.) or a ribbon of thermostable material (polyimides, epoxy, polyester loaded with glass fibers, phenol-formaldehyde, etc.) integrated in the central part and coated with the preceding plastic material.
Cette matière plastique est de préférence à base de produits dérivés du fluor (par exemple polytétrafluoroéthylène (PTFE), perfluoroalcoxy (PFA), fluoroéthylène-propylène (FEP), éthylène-tétrafluoroéthylène (ETFE)) et est rendue antistatique au moyen d'une charge de produit semi-conducteur ou conducteur. This plastic material is preferably based on fluorine-derived products (for example polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluoroethylene-propylene (FEP), ethylene-tetrafluoroethylene (ETFE)) and is made antistatic by means of a filler semiconductor or conductive product.
L'invention sera mieux comprise à la lecture de la description qui va suivre accompagnée des dessins annexés sur lesquels
La figure 1 est une vue de dessus d'un circuit intégré.The invention will be better understood on reading the description which follows, accompanied by the appended drawings in which
Figure 1 is a top view of an integrated circuit.
La figure 2 est une vue de côté du circuit intégré de la figure 1. Figure 2 is a side view of the integrated circuit of Figure 1.
La figure 3 est une vue en perspective de la bande de support intercalaire selon l'invention. Figure 3 is a perspective view of the intermediate support strip according to the invention.
La figure 4 est une vue latérale d'un enroulement de la bande support de la figure 3 avec les circuits intégrés. Figure 4 is a side view of a winding of the support strip of Figure 3 with integrated circuits.
Les figures 1 et 2 sont respectivement des vues de dessus et de côté d'un circuit intégré avec une pastille principale 1 et des petites pastilles périphériques 2a, 2b ... Figures 1 and 2 are respectively top and side views of an integrated circuit with a main pad 1 and small peripheral pads 2a, 2b ...
Chaque petite pastille 2a, 2b est connectée à la pastille principale 1 par deux fils d'aluminium 3a, 3'a ... Le diamètre de ces fils est de seulement 30 micromètres, ce qui rend les brins 3 de fils très fragiles.Each small patch 2a, 2b is connected to the main patch 1 by two aluminum wires 3a, 3'a ... The diameter of these wires is only 30 micrometers, which makes the strands 3 of wires very fragile.
Pour éviter que les brins 3 ne soient trop tendus après avoir été soudés, on leur donne une certaine courbure, ce qui augmente légèrement l'épaisseur du circuit intégré. Lorsque les pastilles sont reliées entre elles, on fixe le circuit sur un support souple 4 puis on enroule l'ensemble sur des bobines dont le diamètre est d'environ 600 mm. C'est à ce moment là que le risque de détérioration des circuits est le plus grand car l'enroulement implique plusieurs tours de bobine et sans la présence d'un intercalaire entre chaque tour, les brins 3 seraient écrasés. To prevent the strands 3 from being too tight after being soldered, they are given a certain curvature, which slightly increases the thickness of the integrated circuit. When the pads are connected together, the circuit is fixed on a flexible support 4 and then the assembly is wound on coils whose diameter is approximately 600 mm. It is at this point that the risk of deterioration of the circuits is greatest because winding involves several turns of the coil and without the presence of an interlayer between each turn, the strands 3 would be crushed.
Ainsi, il faut que le support intercalaire soit suffisamment souple pour être enroulé mais également suffisamment rigide pour ne pas subir une quelconque déformation verticale de nature à écraser les brins de circuits placés en-dessous. Thus, it is necessary that the intermediate support is flexible enough to be wound but also rigid enough not to undergo any vertical deformation such as to crush the strands of circuits placed below.
Les figures 3 et 4 représentent respectivement des vues en perspective et de côté de la bande de support intercalaire de l'invention à l'état libre et à l'état enroulé. Figures 3 and 4 show respectively perspective and side views of the intermediate support strip of the invention in the free state and in the wound state.
La bande 5 comporte des ondulations latérales 6 et une partie centrale plane 7 destinée à supporter lesdits circuits intégrés. The strip 5 has lateral undulations 6 and a flat central part 7 intended to support said integrated circuits.
Compte tenu de l'épaisseur des circuits avec les brins 3 courbés, on considère qu'une hauteur des ondulations latérales 6 de l'ordre de 0,7 à 0,8 mm est suffisante pour éviter que les brins 3 ne soient écrasés ou déformés. Given the thickness of the circuits with the curved strands 3, it is considered that a height of the lateral undulations 6 of the order of 0.7 to 0.8 mm is sufficient to prevent the strands 3 from being crushed or deformed .
La partie centrale 7 comporte une armature 8 constituée de préférence d'un ruban métallique en acier qui est éventuellement inoxydable. The central part 7 comprises an armature 8 preferably made up of a metallic steel strip which is optionally stainless.
Dans un autre mode de réalisation de l'invention l'armature est réalisée avec un ruban de matière thermostable telle que par exemple : polyimides, époxy, polyester chargé de fibres de verre, et phénol-formol. In another embodiment of the invention, the frame is produced with a ribbon of thermostable material such as for example: polyimides, epoxy, polyester loaded with glass fibers, and phenol-formaldehyde.
La longueur et l'épaisseur de ce ruban dépendent de l'élasticité et de la rigidité requises en fonction de la taille des bobines d'enroulement et/ou du type de circuits intégrés à protéger. The length and thickness of this tape depend on the elasticity and the rigidity required as a function of the size of the winding coils and / or of the type of integrated circuits to be protected.
L'armature 8 sert non seulement à éviter que la partie centrale 7 ne devienne concave ou convexe lors d'un fluage à froid ou à chaud mais aussi à régler l'effet de ressort de l'intercalaire et donc le positionnement des enroulements les uns par rapport aux autres. The frame 8 is used not only to prevent the central part 7 from becoming concave or convex during a cold or hot creep but also to adjust the spring effect of the interlayer and therefore the positioning of the windings compared to others.
Le ruban métallique constituant l'armature 8 est intégré dans la partie centrale plane 7 et est enrobé par la matière constituant la bande 5. The metal ribbon constituting the frame 8 is integrated in the flat central part 7 and is coated with the material constituting the strip 5.
Cette matière sera de préférence une matière plastique souple, isolante, ayant une bonne résistance chimique aux agents corrosifs et ne subissant aucune déformation à des températures comprises entre - 900C et + 2600C. This material will preferably be a flexible plastic, insulating, having good chemical resistance to corrosive agents and not undergoing any deformation at temperatures between - 900C and + 2600C.
Selon un mode de réalisation préféré de l'invention, on utilisera des produits dérivés du fluor tels que par exemple
PTFE, PFA, FEP, ETFE.According to a preferred embodiment of the invention, products derived from fluorine will be used such as for example
PTFE, PFA, FEP, ETFE.
Compte tenu de ses propriétés thermiques, cette matière laisse aux transformateurs ou aux utilisateurs des circuits intégrés, la possibilité d'utiliser des colles qui demandent une réticulation à température élevée (par exemple,cas des époxy). Given its thermal properties, this material leaves transformers or users of integrated circuits the possibility of using adhesives which require crosslinking at high temperature (for example, in the case of epoxies).
En outre, cette matière sera rendue antistatique par inclusion ou mélange avec une charge de produits semi-conducteurs ou conducteurs (graphite, noir de carbone, fibres de carbone, d'inox, etc...); ceci afin d'éviter une éventuelle décharge électrostatique sur les circuits. In addition, this material will be made antistatic by inclusion or mixing with a load of semiconductor or conductive products (graphite, carbon black, carbon fibers, stainless steel, etc.); this is to avoid possible electrostatic discharge on the circuits.
La combinaison entre l'armature et la matière plastique d'enrobage donne à cette bande de support intercalaire d'excellentes propriétés mécaniques et thermiques et satisfait pleinement les utilisateurs ou les transformateurs des circuits en leur offrant des horizons nouveaux quant aux techniques de transformation effectuées directement sur la bande support. The combination of the frame and the plastic coating material gives this interlayer support strip excellent mechanical and thermal properties and fully satisfies the users or the transformers of the circuits by offering them new horizons as for the transformation techniques carried out directly. on the support strip.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8715587A FR2623015B1 (en) | 1987-11-10 | 1987-11-10 | INTERMEDIATE SUPPORT STRIP FOR INTEGRATED CIRCUITS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8715587A FR2623015B1 (en) | 1987-11-10 | 1987-11-10 | INTERMEDIATE SUPPORT STRIP FOR INTEGRATED CIRCUITS |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2623015A1 true FR2623015A1 (en) | 1989-05-12 |
| FR2623015B1 FR2623015B1 (en) | 1990-03-30 |
Family
ID=9356673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8715587A Expired - Fee Related FR2623015B1 (en) | 1987-11-10 | 1987-11-10 | INTERMEDIATE SUPPORT STRIP FOR INTEGRATED CIRCUITS |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2623015B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0409391A2 (en) * | 1989-06-01 | 1991-01-23 | Somar Corporation | Spacer tape for IC package |
| CN104245552A (en) * | 2012-05-31 | 2014-12-24 | 惠普发展公司，有限责任合伙企业 | Spooling process films |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2806685A1 (en) * | 1978-02-16 | 1979-08-23 | Siemens Ag | Stacked semiconductor structure using film mounting - comprises stack of substrates holding semiconductor chips connected to main substrate or circuit board with terminals |
| EP0015583A1 (en) * | 1979-03-12 | 1980-09-17 | International Business Machines Corporation | Vertical semiconductor integrated circuit chip packaging |
-
1987
- 1987-11-10 FR FR8715587A patent/FR2623015B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2806685A1 (en) * | 1978-02-16 | 1979-08-23 | Siemens Ag | Stacked semiconductor structure using film mounting - comprises stack of substrates holding semiconductor chips connected to main substrate or circuit board with terminals |
| EP0015583A1 (en) * | 1979-03-12 | 1980-09-17 | International Business Machines Corporation | Vertical semiconductor integrated circuit chip packaging |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0409391A2 (en) * | 1989-06-01 | 1991-01-23 | Somar Corporation | Spacer tape for IC package |
| EP0409391A3 (en) * | 1989-06-01 | 1991-12-11 | Somar Corporation | Spacer tape for ic package |
| CN104245552A (en) * | 2012-05-31 | 2014-12-24 | 惠普发展公司，有限责任合伙企业 | Spooling process films |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2623015B1 (en) | 1990-03-30 |
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