FR2620736B1 - PROCESS FOR THE DEPOSITION OF TUNGSTEN OR MOLYBDENE SILICIDES - Google Patents
PROCESS FOR THE DEPOSITION OF TUNGSTEN OR MOLYBDENE SILICIDESInfo
- Publication number
- FR2620736B1 FR2620736B1 FR8713092A FR8713092A FR2620736B1 FR 2620736 B1 FR2620736 B1 FR 2620736B1 FR 8713092 A FR8713092 A FR 8713092A FR 8713092 A FR8713092 A FR 8713092A FR 2620736 B1 FR2620736 B1 FR 2620736B1
- Authority
- FR
- France
- Prior art keywords
- molybdene
- silicides
- tungsten
- deposition
- molybdene silicides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 229910021332 silicide Inorganic materials 0.000 title 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title 1
- 229910052721 tungsten Inorganic materials 0.000 title 1
- 239000010937 tungsten Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28097—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a metallic silicide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
- H01L21/32053—Deposition of metallic or metal-silicide layers of metal-silicide layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8713092A FR2620736B1 (en) | 1987-09-17 | 1987-09-17 | PROCESS FOR THE DEPOSITION OF TUNGSTEN OR MOLYBDENE SILICIDES |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8713092A FR2620736B1 (en) | 1987-09-17 | 1987-09-17 | PROCESS FOR THE DEPOSITION OF TUNGSTEN OR MOLYBDENE SILICIDES |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2620736A1 FR2620736A1 (en) | 1989-03-24 |
FR2620736B1 true FR2620736B1 (en) | 1990-01-19 |
Family
ID=9355115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8713092A Expired - Lifetime FR2620736B1 (en) | 1987-09-17 | 1987-09-17 | PROCESS FOR THE DEPOSITION OF TUNGSTEN OR MOLYBDENE SILICIDES |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2620736B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0648859B1 (en) * | 1993-10-14 | 1997-07-23 | Applied Materials, Inc. | Processes for the deposition of adherent tungsten silicide films |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4584207A (en) * | 1984-09-24 | 1986-04-22 | General Electric Company | Method for nucleating and growing tungsten films |
-
1987
- 1987-09-17 FR FR8713092A patent/FR2620736B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2620736A1 (en) | 1989-03-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |