FR2609820B1 - ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE - Google Patents

ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE

Info

Publication number
FR2609820B1
FR2609820B1 FR8700578A FR8700578A FR2609820B1 FR 2609820 B1 FR2609820 B1 FR 2609820B1 FR 8700578 A FR8700578 A FR 8700578A FR 8700578 A FR8700578 A FR 8700578A FR 2609820 B1 FR2609820 B1 FR 2609820B1
Authority
FR
France
Prior art keywords
electromagnetic
producing
electrostatic protection
electronic boards
protection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8700578A
Other languages
French (fr)
Other versions
FR2609820A1 (en
Inventor
Francis Steffen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Semiconducteurs SA
Original Assignee
Thomson Semiconducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Semiconducteurs SA filed Critical Thomson Semiconducteurs SA
Priority to FR8700578A priority Critical patent/FR2609820B1/en
Publication of FR2609820A1 publication Critical patent/FR2609820A1/en
Application granted granted Critical
Publication of FR2609820B1 publication Critical patent/FR2609820B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR8700578A 1987-01-20 1987-01-20 ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE Expired - Fee Related FR2609820B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8700578A FR2609820B1 (en) 1987-01-20 1987-01-20 ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8700578A FR2609820B1 (en) 1987-01-20 1987-01-20 ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE

Publications (2)

Publication Number Publication Date
FR2609820A1 FR2609820A1 (en) 1988-07-22
FR2609820B1 true FR2609820B1 (en) 1991-04-19

Family

ID=9347057

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8700578A Expired - Fee Related FR2609820B1 (en) 1987-01-20 1987-01-20 ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE

Country Status (1)

Country Link
FR (1) FR2609820B1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
JP2559849B2 (en) * 1989-05-23 1996-12-04 三菱電機株式会社 IC card
JPH04153096A (en) * 1990-10-18 1992-05-26 Mitsubishi Electric Corp Portable memory device
CA2290184A1 (en) * 1999-11-22 2001-05-22 David Perron Improvements in authentication cards
DE10003112C1 (en) * 2000-01-13 2001-07-26 Infineon Technologies Ag Chip with all-round protection of sensitive circuit parts against access by unauthorized persons by means of shielding arrangements (shields) using an auxiliary chip
GB2382469A (en) * 2001-11-23 2003-05-28 Marconi Optical Components Ltd Shielding for electromagnetic interference
CN118471832A (en) * 2024-07-12 2024-08-09 威海嘉瑞光电科技股份有限公司 Integrated circuit device and manufacturing method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480008A1 (en) * 1980-04-04 1981-10-09 Flonic Sa IMPROVEMENTS TO MEMORY CARDS
JPS5785866A (en) * 1980-11-18 1982-05-28 Mitsubishi Metal Corp Antistatic transparent paint
DE3118298A1 (en) * 1981-05-08 1982-12-02 Gao Ges Automation Org ID CARD WITH STORED IC BLOCK
FR2512990B1 (en) * 1981-09-11 1987-06-19 Radiotechnique Compelec METHOD FOR MANUFACTURING AN ELECTRONIC PAYMENT CARD, AND CARD REALIZED ACCORDING TO THIS METHOD
FR2517165A1 (en) * 1981-11-20 1983-05-27 Radiotechnique Compelec METHOD FOR PROVIDING A SCREEN AN ELECTRONIC CIRCUIT, AND PAYMENT CARD HAVING A SCREEN
US4409471A (en) * 1981-12-17 1983-10-11 Seiichiro Aigo Information card

Also Published As

Publication number Publication date
FR2609820A1 (en) 1988-07-22

Similar Documents

Publication Publication Date Title
FR2648667B1 (en) METHOD AND DEVICE FOR PRODUCING WIRING COMPONENTS
DE3366810D1 (en) Mounting structure for electronic apparatus or the like
FR2486685B1 (en) ELECTRONIC PAYMENT CARD AND REALIZATION METHOD
FR2610214B1 (en) FILTRATION METHOD AND DEVICE
DE69227066D1 (en) Electronic device
FR2535498B1 (en) PLASMA DISPLAY METHOD AND DEVICE
DE69033207D1 (en) Cashless electronic system
NO180095C (en) Electronic surveillance system for objects
DE69333123D1 (en) Electronic device
PT78815B (en) DEVICE AND METHOD FOR COOLING SHEETS
DE3152626D2 (en) Electronic device for the energization of an electromagnetic element
DE69027359D1 (en) Electronic device
DE3475125D1 (en) Electronic identification device
FR2622596B1 (en) DECOKAGE PROCESS AND DEVICE
FR2609820B1 (en) ELECTROMAGNETIC AND ELECTROSTATIC PROTECTION DEVICE FOR ELECTRONIC BOARDS AND METHOD FOR PRODUCING THE DEVICE
FR2589278B1 (en) ELECTRONIC DEVICE FOR PROTECTING INTEGRATED CIRCUITS FROM ELECTROSTATIC CHARGES AND METHOD FOR MANUFACTURING THE SAME
DE69132791D1 (en) Electronic device
BR8403774A (en) ELECTRONIC SURVEILLANCE SYSTEM ON ARTICLES
EP0406895A3 (en) An electronic apparatus
FR2545974B1 (en) ELECTROMAGNETIC DEVICE
FR2496328B1 (en) METHOD AND DEVICE FOR PRODUCING EXTERIOR SURFACES OF INSULATORS
FR2555336B1 (en) ELECTRONIC AGENDA DEVICE AND OPERATING METHOD
FR2529911B1 (en) METHOD AND DEVICE FOR PRODUCING METAL PROTECTIVE COATINGS
FR2619943B1 (en) CASING METHOD AND DEVICE
FR2579858B1 (en) ANTI-VIBRATION DEVICE FOR ELECTRONIC BOARDS

Legal Events

Date Code Title Description
ST Notification of lapse