FR2585510A1 - Device for coupling several electric signal-input paths to the same electric output path with insulation of the earths - Google Patents
Device for coupling several electric signal-input paths to the same electric output path with insulation of the earths Download PDFInfo
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- FR2585510A1 FR2585510A1 FR8511250A FR8511250A FR2585510A1 FR 2585510 A1 FR2585510 A1 FR 2585510A1 FR 8511250 A FR8511250 A FR 8511250A FR 8511250 A FR8511250 A FR 8511250A FR 2585510 A1 FR2585510 A1 FR 2585510A1
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- 230000008878 coupling Effects 0.000 title claims abstract description 6
- 238000010168 coupling process Methods 0.000 title claims abstract description 6
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 6
- 238000009413 insulation Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims abstract description 5
- 238000002955 isolation Methods 0.000 claims description 13
- 239000008188 pellet Substances 0.000 claims description 7
- 108091008695 photoreceptors Proteins 0.000 claims description 5
- 230000001131 transforming effect Effects 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 230000010287 polarization Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/802—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections for isolation, e.g. using optocouplers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Communication System (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
Dispositif de couplage de plusieurs voies électriques d'entrée de signaux à une même voie électrique de sortie avec isolement des masses
La présente invention concerne un dispositif de couplage de plusieurs voies électriques d'entrée de signaux à une même voie électrique de sortie avec isolement des masses.Device for coupling several electrical signal input channels to the same electrical output channel with earth isolation
The present invention relates to a device for coupling several electrical signal input channels to the same electrical output channel with ground isolation.
Le besoin existe depuis longtemps, en matière de transmission et de traitement de signaux électriques porteurs d'information, de coupler plusieurs voies d'entrée à une même voie de sortie. Ce besoin est classiquement satisfait par des circuits que l'on peut appeler de manière générale "dispositifs mélangeurs" car ils réalisent une fonction de mélange. Dans le cas particulier où les signaux considérés sont porteurs de valeurs logiques binaires,-une des fonctions de mélange peut être la fonction OU. The need has existed for a long time, in terms of transmission and processing of electrical signals carrying information, to couple several input channels to the same output channel. This need is conventionally satisfied by circuits which can be generally called "mixing devices" because they perform a mixing function. In the particular case where the signals considered carry binary logic values, one of the mixing functions can be the OR function.
Il est par ailleurs souvent souhaitable de réaliser une fonction d'isolation sélective entre un circuit d'entrée et un circuit de sortie entre lesquels certains signaux électriques utiles doivent être transmis, cette isolation ayant pour fonction d'empêcher la transmission de signaux nuisibles qui peuvent apparaître dans les mêmes bandes de fréquence que les signaux utiles. Ces signaux utiles sont par exemple ceux qui sont appliqués entre un conducteur spécifique et un conducteur de masse avec une certaine polarité et avec une grandeur comprise entre deux seuils, inférieur et supérieur. Ces deux seuils peuvent être ajustés indépendamment entre l'entrée et la sortie.Les signaux nuisibles peuvent alors être, par exemple, des signaux en mode commun transitant à la fois sur le conducteur spécifique et le conducteur de masse, des signaux appliqués entre ces mêmes conducteurs mais avec la polarité incorrecte, des signaux parasites ou de bruit de faibles grandeurs, et des surtensions accidentelles contre lesquelles la voie de sortie doit être protégée. It is also often desirable to carry out a selective isolation function between an input circuit and an output circuit between which certain useful electrical signals must be transmitted, this isolation having the function of preventing the transmission of harmful signals which may appear in the same frequency bands as the useful signals. These useful signals are for example those which are applied between a specific conductor and a ground conductor with a certain polarity and with a quantity comprised between two thresholds, lower and upper. These two thresholds can be adjusted independently between the input and the output. The harmful signals can then be, for example, signals in common mode passing on both the specific conductor and the ground conductor, signals applied between these same conductors but with incorrect polarity, parasitic or noise signals of small magnitudes, and accidental overvoltages against which the output channel must be protected.
Divers dispositifs sont connus pour transmettre les signaux utiles et arrêter certains au moins de tels signaux nuisibles. On connatt par exemple des transformateurs qui empêchent la transmission des signaux en mode commun et protègent la voie de sortie contre les surpuissances. On connatt aussi des photocoupleurs dans lesquels le signal électrique d'entrée alimente une diode photoémettrice dont la lumière éclaire la base d'un phototransistor qui fournit le signal de sortie. La fonction d'isolation sélective réalisée par de tels dispositifs comporte le plus souvent la fonction d'isolation des conducteurs de masse, ou, plus bièvement, d'isolation des masses. Various devices are known for transmitting useful signals and stopping at least some of such harmful signals. Transformers are known, for example, which prevent the transmission of signals in common mode and protect the output channel against overpower. Photocouplers are also known in which the electrical input signal feeds a light emitting diode whose light illuminates the base of a phototransistor which supplies the output signal. The selective isolation function performed by such devices most often includes the function of isolating the ground conductors, or, more bluntly, isolating the masses.
Il est aussi connu, lorsque l'on doit réaliser à la fois une fonction de mélange et une fonction d'isolation sélective, de placer un dispositif d'isolation sélective sur chacune des voies d'entrée et de placer un dispositif mélangeur en sortie de ces dispositifs d'isolation. It is also known, when it is necessary to carry out both a mixing function and a selective isolation function, to place a selective isolation device on each of the input channels and to place a mixer device at the output of these isolation devices.
Par ailleurs encore, et de manière très générale, les concepteurs de circuits électroniques cherchent à minimiser le coût la complexité et 11 encombrement de ces circuits. Furthermore, and very generally, the designers of electronic circuits seek to minimize the cost, the complexity and the bulk of these circuits.
La présente invention a pour but d'associer lesdites fonctions de mélange et d'isolation sélective de manière simple, avec un coût et un encombrement diminués. The object of the present invention is to combine said mixing and selective isolation functions in a simple manner, with reduced cost and bulk.
Elle a pour objet un dispositif de couplage de plusieurs voies électriques d'entrée de signaux à une même voie électrique de sortie avec isolement des masses, ce dispositif comportant - un photo-émetteur pour chacune desdites voies d'entrée (14, 15, 19, 20) pour recevoir un signal électrique d'entrée transmis par cette voie et pour émettre un signal lumineux représentatif de ce signal d'entrée, - des moyens de transformation de tels signaux lumineux en signaux électriques pour réaliser une fonction d'isolation sélective, - et des moyens de mélange de signaux pour fournir un signal électrique de sortie sur ladite voie de sortie (17, 18), - ce dispositif étant caractérisé par le fait que lesdits moyens de transformation de signaux lumineux en signaux électriques sont constitués par un seul et même photo-récepteur (2) recevant les signaux lumineux émis par les divers dits photo-émetteurs (1, 3), de manière que ce photo-récepteur constitue en même temps lesdits moyens de mélange de signaux. It relates to a device for coupling several electrical signal input channels to the same electrical output channel with ground isolation, this device comprising - a photo-emitter for each of said input channels (14, 15, 19 , 20) for receiving an electrical input signal transmitted by this channel and for emitting a light signal representative of this input signal, - means for transforming such light signals into electrical signals to perform a selective isolation function, - and signal mixing means to supply an electrical output signal on said output channel (17, 18), - this device being characterized by the fact that said means for transforming light signals into electrical signals consist of a single and same photo-receiver (2) receiving the light signals emitted by the various said photo-emitters (1, 3), so that this photo-receiver constitutes at the same time said signal mixing means .
(Les numéros de référence entre parenthèses renvoient à simple titre d'exemple aux figures annexées).(The reference numbers in parentheses simply refer to the attached figures by way of example).
Selon la présente invention il est de plus apparu avantageux d'adopter, au moins dans certains cas, les dispositions plus particulierres suivantes - Lesdits photo-émetteurs (1, 3) et photo-récepteur (2) présentent la forme de pastilles semi-conductrices comportant chacune une face inférieure qui est fixée sur un substrat plan commun (7), et une face supérieure par laquelle lesdits signaux lumineux sont émis ou reçus, une surface réfléchissante (5) s'étendant au-dessus de ces pastilles pour réfléchir ces divers signaux lumineux vers ce photo-récepteur. According to the present invention, it has moreover appeared advantageous to adopt, at least in certain cases, the following more particular provisions - Said photo-emitters (1, 3) and photo-receiver (2) have the form of semiconductor pellets each comprising a lower face which is fixed on a common flat substrate (7), and an upper face by which said light signals are emitted or received, a reflecting surface (5) extending above these pellets to reflect these various light signals to this photo-receiver.
- La face supérieure dudit substrat (7) porte des plages métallisées (11, 12, 13) de fixation desdits photo-émetteurs (1, 3) et photo-récepteurs (2) et des pistes métallisées (14, 15, 16, 17, 18, 19, 20) de liaison électrique pour permettre la polarisation de ces photo-émetteurs et photo-récepteurs et la transmission desdits signaux électriques.- The upper face of said substrate (7) carries metallized areas (11, 12, 13) for fixing said photo-emitters (1, 3) and photo-receivers (2) and metallized tracks (14, 15, 16, 17 , 18, 19, 20) of electrical connection to allow the polarization of these photo-emitters and photo-receivers and the transmission of said electrical signals.
- Une entretoise (8) est interposée entre ledit substrat (7) et ladite surface réfléchissante (5) et présente la forme d'une plaquette percée d'un trou (8) qui contient lesdites pastilles (1, 2, 3) et dont la paroi est propre à rétrodiffuser la lumière pour augmenter la proportion de lumière transmise audit photorécepteur (2).- A spacer (8) is interposed between said substrate (7) and said reflecting surface (5) and has the shape of a plate pierced with a hole (8) which contains said pellets (1, 2, 3) and whose the wall is suitable for backscattering the light to increase the proportion of light transmitted to said photoreceptor (2).
A l'aide des figures schématiques ci-jointes on va décrire ci-après plus particulièrement, à titre d'exemple non limitatif, comment l'invention peut être mise en oeuvre. Il doit être compris que les éléments décrits et représentés peuvent, sans sortir du cadre de l'invention, être remplacés par d'autres éléments assurant les mêmes fonctions techniques. Lorsqu'un même élément est représenté sur plusieurs figures il y est désigné par le même signe de référence. Using the attached diagrammatic figures, a description will be given below more particularly, by way of nonlimiting example, of how the invention can be implemented. It should be understood that the elements described and shown can, without departing from the scope of the invention, be replaced by other elements ensuring the same technical functions. When the same element is represented in several figures, it is designated therein by the same reference sign.
La figure 1 représente une vue en perspective éclatée d'un dispositif selon l'invention comportant deux photoémetteurs, chacun pour une voie d'entrée. FIG. 1 represents an exploded perspective view of a device according to the invention comprising two photoemitters, each for an input channel.
La figure 2 représente une vue de ce dispositif en coupe par un plan perpendiculaire à ses faces parallèles à sa longueur et passant par les photoémetteurs et le photorécepteur de ce dispositif. FIG. 2 represents a view of this device in section through a plane perpendicular to its faces parallel to its length and passing through the photoemitters and the photoreceptor of this device.
La figure 3 représente une vue de dessus du substrat portant ces photoémetteurs, ce photo récepteur et les pistes de liaison électrique de ces derniers. FIG. 3 represents a top view of the substrate carrying these photoemitters, this photo receptor and the electrical connection tracks of the latter.
Le dispositif représenté à titre d'exemple comporte les éléments suivants désignés par leur numéro de référence. The device shown by way of example comprises the following elements designated by their reference number.
1 - premier photo émetteur : photodiode en pastille rapportée et
connectée sur le substrat (7) 2 - photorécepteur : phototransistor en pastille reporté et câblé
sur le substrat (7) 3 - deuxième photoémetteur : il est identique au premier (1) 4 - couvercle :plaquette céramique d'épaisseur 0,635 mm découpé par
laser aux dimensions (17 x 6 mm), et recouverte d'une couche de
métallisation (5) en face inférieure 5 - couche de métallisation destinée à jouer le rôle de surface
réfléchissante. Elle est constituée d'or.1 - first photo emitter: photodiode in added pellet and
connected to the substrate (7) 2 - photoreceptor: phototransistor in deferred and wired pellet
on the substrate (7) 3 - second photoemitter: it is identical to the first (1) 4 - cover: ceramic plate 0.635 mm thick cut by
laser dimensions (17 x 6 mm), and covered with a layer of
metallization (5) on the underside 5 - metallization layer intended to act as a surface
reflective. It is made of gold.
6 - entretoise : plaquette céramique d'épaisseur 1 mm, de mêmes
dimensions que le couvercle (4), percée par laser d'un trou (8)
de 4 mm de diamètre contenant les pastilles (1, 2, 3) et leurs
fils de connexion tels que 21.6 - spacer: ceramic plate 1 mm thick, similar
dimensions as the cover (4), laser pierced with a hole (8)
4 mm in diameter containing the pellets (1, 2, 3) and their
connection wires such as 21.
7 - substrat céramique d'épaisseur 0,635 mm découpé par laser aux
mêmes dimensions que le couvercle (4) plus 1,7 mm sur la largeur
pour permettre d'y disposer des plages de connexion externes 22.7 - ceramic substrate 0.635 mm thick cut by laser
same dimensions as the cover (4) plus 1.7 mm across the width
to allow there to have external connection pads 22.
Ce substrat est sérigraphié avec un alliage palladium-argent
pour y réaliser ces plages de connexion, des plages de report des
pastilles (1, 2, 3) et des pistes de liaison électriques (14,
15, 16, 17, 18, 19).This substrate is screen printed with a palladium-silver alloy
to carry out these connection periods there,
pads (1, 2, 3) and electrical connection tracks (14,
15, 16, 17, 18, 19).
8 - trou contenant de l'azote sec. 8 - hole containing dry nitrogen.
La liaison entre les éléments (4), (6) et (7) est assurée par de la colle isolante. The connection between the elements (4), (6) and (7) is provided by insulating adhesive.
On va maintenant donner une description du fonctionnement de ce dispositif
Un signal électrique est appliqué sur le premier photoémetteur (1) ou sur le deuxième (2) ou sur les deux. L'émetteur excité réagit en engendrant un signal lumineux qui est représenté par la flèche (24) sur la figure 2 et qui est transmis par le milieu ambiant sur les parois du trou de l'entretoise (6) et sur la couche de métallisation (5) du couvercle (4) où il se réfléchit. il vient alors exciter la base du phototransistor (2) qui réagit en émettant un signal électrique. Ce signal transmis est par exemple proportionnel à celui appliqué sur l'un des émetteurs ou à la somme des signaux appliqués si les deux émetteurs sont excités.En prenant la précaution d'isoler les masses électriques on réalise ainsi une liaison optique à plusieurs entrées isolées électriquement, entre elles et par rapport à la sortie. Les circuits électroniques extérieurs sont connectés aux plages (22). Leur réalisation dépend des conditions de leur emploi et est à la portée de l'homme du métier.We will now give a description of the operation of this device
An electrical signal is applied to the first photoemitter (1) or to the second (2) or both. The excited transmitter reacts by generating a light signal which is represented by the arrow (24) in FIG. 2 and which is transmitted by the ambient medium on the walls of the hole in the spacer (6) and on the metallization layer ( 5) of the cover (4) where it is reflected. it then excites the base of the phototransistor (2) which reacts by emitting an electrical signal. This transmitted signal is for example proportional to that applied to one of the transmitters or to the sum of the signals applied if the two transmitters are energized. By taking the precaution of isolating the electrical grounds, an optical link with several isolated inputs is thus produced electrically, between them and with respect to the output. The external electronic circuits are connected to the pads (22). Their realization depends on the conditions of their use and is within the reach of the skilled person.
De ce qui précède il apparait que le dispositif selon l'invention présente les avantages suivants a - il comporte plusieurs entrées (raisonnablement jusqu'à 4). On
peut ainsi l'utiliser soit pour réaliser la fonction "OU", soit
par économie pour relier deux dispositifs émetteurs optiques à
un seul récepteur, soit enfin pour constituer un mélangeur de
signaux analogiques, b - il peut être réalisé par implantation directe sur un substrat,
portant de nombreux autres éléments, ceci que ce substrat soit
fait de céramique comme dans le cas d'un circuit hybride, ou de
verre époxy comme dans le cas d'une carte de circuit imprimé. il
peut aussi être réalisé sous la forme d'un composant discret
comme celui précédemment décrit. From the above it appears that the device according to the invention has the following advantages a - it has several inputs (reasonably up to 4). We
can thus use it either to perform the "OR" function, or
by economy to connect two optical transmitting devices to
a single receiver, or finally to constitute a mixer of
analog signals, b - it can be realized by direct implantation on a substrate,
carrying many other elements, this that this substrate is
made of ceramic as in the case of a hybrid circuit, or
epoxy glass as in the case of a printed circuit board. he
can also be realized as a discrete component
like the one previously described.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8511250A FR2585510A1 (en) | 1985-07-23 | 1985-07-23 | Device for coupling several electric signal-input paths to the same electric output path with insulation of the earths |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8511250A FR2585510A1 (en) | 1985-07-23 | 1985-07-23 | Device for coupling several electric signal-input paths to the same electric output path with insulation of the earths |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2585510A1 true FR2585510A1 (en) | 1987-01-30 |
Family
ID=9321551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8511250A Withdrawn FR2585510A1 (en) | 1985-07-23 | 1985-07-23 | Device for coupling several electric signal-input paths to the same electric output path with insulation of the earths |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2585510A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001004963A1 (en) * | 1999-07-09 | 2001-01-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Encapsulation of a device |
| US6949825B1 (en) | 1999-07-09 | 2005-09-27 | Osram Opto Semiconductor Gmbh & Co. Ohg | Laminates for encapsulating devices |
| GB2441801A (en) * | 2006-09-15 | 2008-03-19 | Raymonde Gene Clifford Artus | Optical interconnection of components within a housing which has a reflective surface |
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| DE2111472A1 (en) * | 1971-03-10 | 1972-09-28 | Kdm Motoren K B Kindermann | Foil cutting machine - producing dust free strips of polystyrene, other plastic, paper or cardboard |
| DE2235022A1 (en) * | 1972-07-17 | 1974-02-14 | Kernforschung Gmbh Ges Fuer | OPTOELECTRONIC DEVICE |
| JPS5837978A (en) * | 1981-08-31 | 1983-03-05 | Ricoh Co Ltd | Photo coupler |
| JPS5839075A (en) * | 1981-08-31 | 1983-03-07 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
| EP0081827A2 (en) * | 1981-12-11 | 1983-06-22 | Sanyo Electric Co., Ltd. | Semiconductor optical logic device |
| EP0103032A1 (en) * | 1982-09-09 | 1984-03-21 | General Electric Company | Semiconductor optocoupler |
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| DE2111472A1 (en) * | 1971-03-10 | 1972-09-28 | Kdm Motoren K B Kindermann | Foil cutting machine - producing dust free strips of polystyrene, other plastic, paper or cardboard |
| DE2235022A1 (en) * | 1972-07-17 | 1974-02-14 | Kernforschung Gmbh Ges Fuer | OPTOELECTRONIC DEVICE |
| JPS5837978A (en) * | 1981-08-31 | 1983-03-05 | Ricoh Co Ltd | Photo coupler |
| JPS5839075A (en) * | 1981-08-31 | 1983-03-07 | Matsushita Electric Ind Co Ltd | Electronic circuit device |
| EP0081827A2 (en) * | 1981-12-11 | 1983-06-22 | Sanyo Electric Co., Ltd. | Semiconductor optical logic device |
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| ELEKTRONIK, vol. 30, no. 24, décembre 1981, pages 49-54, Munich, DE; K.-P.WILCZEK et al.: "Planare Optokoppler in Schichtschaltungen" * |
| PATENTS ABSTRACTS OF JAPAN, vol. 7, no. 119 (E-177)[1264], 24 mai 1983; & JP - A - 58 37 978 (RICOH K.K.) 05-03-1983 * |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001004963A1 (en) * | 1999-07-09 | 2001-01-18 | Osram Opto Semiconductors Gmbh & Co. Ohg | Encapsulation of a device |
| US6888237B1 (en) | 1999-07-09 | 2005-05-03 | Osram Gmbh | Encapsulation of a device |
| US6949825B1 (en) | 1999-07-09 | 2005-09-27 | Osram Opto Semiconductor Gmbh & Co. Ohg | Laminates for encapsulating devices |
| US7214570B2 (en) | 1999-07-09 | 2007-05-08 | Osram Gmbh | Encapsulating a device |
| US7262441B2 (en) | 1999-07-09 | 2007-08-28 | Osram Opto Semiconductors Gmbh & Co. Ohg | Laminates for encapsulating devices |
| GB2441801A (en) * | 2006-09-15 | 2008-03-19 | Raymonde Gene Clifford Artus | Optical interconnection of components within a housing which has a reflective surface |
| GB2441801B (en) * | 2006-09-15 | 2008-08-13 | Raymonde Gene Clifford Artus | A component assembly |
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