FR2570221A1 - Bars with integrated circuits for various boards - Google Patents

Abstract

Bars with integrated circuits or miniature electronic components for various boards, composed of IC DIL packages 1 or 10, whose connections 2 are connected at 3 to contacts 4 on multilayer buses 5. These assemblies of components are protected by a sheath 6 or 11 made of plastic which facilitates the on-line cooling of the elements. The shape and length of the bars is variable. They are enclosed in a casing made of a composite material constituted by two parts 7 and 9 connected by rivets 8.

Description

 The present invention relates to bars with integrated circuits for various panels, that is to say missile fins, inspection panels on the fuselage or the wings of airplanes, the closure panels of landing gear housings, the air brakes, flaps and also supports and missile launchers mounted on the wings.

 With the ICs (Integrated Circuits) electronics has become essential in all the control, piloting, navigation and command systems of airplanes and missiles. The mini-turization of the very large number of electronic components has made it possible to greatly reduce the volume of the boxes of electronic equipment.

 If you look closely at a modern combat aircraft, where: by opening the dozens of doors or inspection panels on the fuselage and the wings, you can see many electronic boxes linked together by cables.

 Formerly in aeronautical construction, the sheets and profiles of light alloys formed the entire structure of planes and missiles. Recently high performance composite materials have started to replace elements of traditional riveted construction and whole panels are made of eomposite materials, plastic materials forced by fiberglass, carbon, kevlar, etc.

 In the construction of missiles; a large part of the fuselage is occupied by the electronic part, and the fins, the surface of which is very large, often contain nothing. the tens of thousands of missiles were built well before the enormous progress brought by C.Ie and microcomputing.

The bars with integrated circuits for panels which know the invention aim at modernizing existing and future airplanes and missiles: 1 / In the case of thousands of existing missiles, the filling
surround conventional fins with fins with system
me incorporated microelectronics can facilitate the struggle of
CCME futureS.

2 / It is difficult to find room in an existing plane
both to add additional electronic equipment
at most we can replace existing ones
by miniaturized equipment less bulky. There are, however, many traditional inspection doors or panels which can be replaced by panels made of composite materials with incorporated electronic systems. Whatever the complexity of cabal logic assemblies and existing systems, it is possible to add sets of ICs

with microprocessors, where there is still room, for example to complete all the radar equipment placed; in the front part of the fuselage of a combat aircraft, it is easy to replace the classic riveted inspection panels, by composite panels with incorporated systems. 1 3 / For the construction of future planes, it is good to repair
shooting electronic equipment in two parts:
- electronic equipment in cases,
electronic equipment in composite panels,
and thus be able to reduce the volume and weight of aircraft.

4 / The construction of future missiles can include two
separate and complementary electronic assemblies:
- fixed and durable electronic equipment fitted
in the fuselage of the missile, - variable electronic equipment, easy to modify
pdur-modernize the missiles and incorporated in the fins
your composite materials.

 MICRO-COMPUTERS is making such rapid progress and there are so many miniaturized components, constantly more efficient and more complex, than to make panels that it is easy to compose with hundreds or thousands of CIs and miniaturized components, l use of bars is the main object of the invention.

 Currently the electronic equipment boxes include between ten and twenty plug-in cards, each card having a very variable number of components and ICs. What is done now to study and make a card, can just as easily be adapted to study and make bars of different shape and length.

 If it is easy to remove a card from a box, it must be just as easy to remove a bar from a panel, this is why you want to use the surface of the composite panel to directly attach components to it. miniaturized would have complicated study and maintenance operations. However, removing a bar from a panel means being able to test and also program a sub-assembly comprising ten or up to a hundred electronic components.

 One of the great advantages of the bars is the same as that of the modules: their replacement is easy, quick and at a price reduced to the maximum. test equipment in the factory manufacturing of components must guarantee the quality of the Cl.

The bus test equipment must verify a sub-assembly; those testing a panel must verify an entire system, even a system.

The accompanying drawings illustrate, by way of example, embodiments of the IC bars, in accordance with the present invention. Other characteristics and advantages will emerge from the descriptions which will follow, made with reference to the drawings, giving by way of indication but in no way limiting, the embodiments of the invention. It is necessary to specify that the bars described are achievable with all miniaturized components, Integrated Circuits,
Hybrid Circuits, Resistors, Capacities, Memories, @@@@
electricity generators, multi-film conductors, reJ systems
. cooling, connection pins etc.

On the figures of the boards we can see: - Fig.l is a section of a bar of reduced form, and the
Fig. 2 that of a bar normal to une.ran-gée-de 01.

- Fig.3 is the section of a bar with two rows of components
sants and Fig.4 that of a bar with three rows.

- Fig. 5 is a cross section of a bar with two ran
PCBs connected to two multi-film conductors.

All these figures are on a 10/1 scale, that is to say that 10 mm on the drawings represent only 1 mm in reality because the integrated circuits are miniaturized to the maximum possible, true admirable records of precision and complete. xity. These bars 10 to 30 mm wide, 5 to 15 mm thick, 100 to 500 mm long, can have 5 to 100 casings
or various components of a computer sub-assembly.

- Fig. 6 is the plan view of an open missile fin
following "AA" in Fig.7. This fin is shown on the
Fig. 8 of a missile. The dimension of a missile fin can vary between 100 to 500 n mm high, 300 to 1000 mm of loni and a thickness of 8 to 40 mm.

the design of a missile fin panel is relatively simple and limited to that of a system and a 1 carcass made of composite material. II ga four fins or pani
new plans.

the design of inspection panels or doors for fuselage or airplane wings can be identical, with bars;
similar, although the shape of the panels is a coArb surface in space, of variable thickness, whose internal face and external face are different and must be used as a case. composite materials can be molded with great precision and are ideal for creating surfaces in space suitable for containing sets of integrated circuit bars and electronic components. The same is true for the shutters, the
I missile launcher, weapon racks and tanks under let
wings of a combat aircraft.

Each bar is part of a set of many
different bars, supplemented by size components
normal, not miniaturized. These components must be fixed
in specific places, often near the attachment points
panels to the missile body, or to the carcass of 11 aircraft,
near the connection points of the cables.

The detailed description, the goals and the means of
this invention will now be easier to understand,
after detailed examination of each of the figures.

- Fig.l is the section of an "A" shaped bar which is suitable
for the edge of a missile fin, with a CI box
DIP 5.54 mm wide, 4.80 mm high in 1 with
16 connection branches 2 welded in 2 to sockets 4 of
a multi-layer bus 5. The assembly is slid into an oven
plastic bucket 6. This bar is mounted in a fin
missile with both sides 7 and 9 made of composite material
are tightened by a rivet 8.

- Fig.2 shows in section a "C" bar which is also suitable
for the edge of a missile fin as in the figure,
but which can also be laid flat in a flat panel.

The CI box here is a DIP with 40 cone branches
xions 10 connected to a multi-layer bus 5. The width is here
much larger hence the shape of the plastic sheath 11.

Fig.3 is a section of a bar with two rows of CI DIP boxes at 12 and 13 which may be of unequal width as in the figure, or of the same width. The multilayer bus 14 here will have four rows of parallel connections 2.

It is easy to imagine a bar with three rows of DIPs, but even more would be difficult to accommodate in the plastic sheath 15 in the shape of an "E" or "F".

The bar is protected inside a construction in two
parts 16 and 17 made of composite material.

Fig. 4 is a section through an H-shaped bar with at
center a row of CI 18 DIP boxes, and on both sides
electronic components 19 and 20 mounted vertically
on the multi-layer bus 21. The plastic sheath 22 is in
"I" shape, this is to leave enough space around the
conductors 2 for efficient circulation cooling i
tion of air. This is to show the importance of
cooling as the conductors are underlined in black
in all the figures.

Fig. 5 is a section through a bar which contains two mul buses
tiacouches 25 and 24 with two rows of boxes in the middle
of CI 25 and 26 called "Flat Packs. This figure allows you to imagine
-ner two other types of bars with a single row or with
three rows of integrated circuits, or with larger components, for example magnetic bubble memories.

The plastic sheath 27 always has a shape which
facilitates cooling by heat dissipation of
conductors.

Fig. 6 shows bars 28 and 29 mounted in parallel in
a missile fin 30 made of composite material. These bars
of integrated circuits are connected to a central bus 31 by the multi-layer needles buses 32. The central unit 33 is provided for all the special components whose number and shape do not allow the composition of bars, whose role is specific, for example power supply, coding, decoding, cooling, testing, programming, simulation. the connections 34 are provided to connect the assembly
computer from the fin to the body of the electronic system in the missile.

- Fig. 7 shows the top view of the fin with the section
following "AA" which can be seen in FIG. 6 in detail.

- Fig. 8 shows a missile of classical shape, the part of which
main electronics 35 remains in the missile body.

This part includes electronic and mechanical components.
only basic systems which are not susceptible to evolution
luer with future CME and CCME control measures. By
against in the four fins 36 will be contained the sets of microcomputers which can make the missile pluF "intelligent" and able to adapt very quickly to CM and CCME.

This adaptation can be of two types: a / Modernization-of the old missiles by micro-informati
sation with the replacement of the old fins by
fins according to the invention; b / During the direct engagement phase in CME area and. CCME, the missile is prepared, by an urgent micro-programming
specific combat conditions. The missile can re
receive ultimate procedural and CCME instructions,
just before launch, from the command post.

This invention can upgrade old missiles by a relatively easy operation to replace the fins. What is true for missiles is particularly true for older combat aircraft, where the volume available for placing electronic boxes is too limited, and the replacement of many panels in riveted metal constructions is relatively easy to do. A combat aircraft like the American F-15 has around 200 inspection doors with an area of 53 m2, so this is the possibility of being able to place around 500,000 / 5 cm2 = 100,000 CI.
It is obvious that during the 15 to 20 years of service of an aircraft such as the P-15 or the MIRAGE 2000, it will be necessary to be able to modernize the electronic equipment several times, and for this add between 10,000 and 50 000 CI, or 100 to 1000 bars of CI according to the invention, in various panels or inspection doors. The advantage of composite material panels is the lightness and therefore the possibility of adding a significant weight of bars with components on IC.

Claims (3)

1 / Bars with miniaturized electronic components, circuits  integrated I, hybrid circuits for material panels  light composites, characterized by a line of components  fixed by connections 2 to the connecting sockets 4 of a  multi-film circuit 5 by welding 3, assembly being slid  in a sheath 6 of "A" or "C" shape which has the purpose  to facilitate cooling by air circulation0 2 / Bar according to claim 1, characterized by a length  variable heat, depending on the number of electronic components  that of the bar and constituting an easy electronic module  to build, program, test and replace with another better one.  Bars according to claims 1 and 2 characterized by  two lines of miniature electronic components 12 -and 13  with the same center distance between connections 2 or with a different center distance,  the sleeve 15 of extruded plastic having the shape of an "E"  or an "F".  Bars according to claims 1 and 2 characterized by  a central line of Cl 18 electronic components with  on each side a line of components 19 and 20 of greater height, resistors, inductors, capacitors, tran-  sistors, diodes, the sheath 22 having the "H" shape,  5 / Bars according to claims 1 -and 2 characterized by  electronic IC components having the form "Flat Pack  25 or 26 connected to a lower multi-layer circuit 24 and another upper, the plastic sheath 27 having the bottom .- me of an I ". 6 / Bars according to claims 1, 2, 5, characterized by  two or three lines of components in the same sleeve  extruded plastic, the shape of the bars being much more  flat and more suitable for flat panels 7 / Bars according to claims 1 to 6, characterized by  grouping them into one or more sub-assemblies  laughter of two panels of composite material 7 and 9 tight  by rivets 8 or screws, these two panels being able to cons  set up a missile fin, or a visit door of  aircraft fuselage, aerodynamic flap, wing panel  part 33 being reserved for electronic components  specific and to the wiring 21 of connection between modules0