FR2556132B1 - METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT - Google Patents

METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT

Info

Publication number
FR2556132B1
FR2556132B1 FR8319206A FR8319206A FR2556132B1 FR 2556132 B1 FR2556132 B1 FR 2556132B1 FR 8319206 A FR8319206 A FR 8319206A FR 8319206 A FR8319206 A FR 8319206A FR 2556132 B1 FR2556132 B1 FR 2556132B1
Authority
FR
France
Prior art keywords
assembling
housing
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8319206A
Other languages
French (fr)
Other versions
FR2556132A1 (en
Inventor
Philippe Darbon
Fernand Grivon
Alain Wicker
Yvon Lazennec
Elisabeth Martinez
Jean-Jacques Banquet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceraver SA
Original Assignee
Ceraver SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceraver SA filed Critical Ceraver SA
Priority to FR8319206A priority Critical patent/FR2556132B1/en
Publication of FR2556132A1 publication Critical patent/FR2556132A1/en
Application granted granted Critical
Publication of FR2556132B1 publication Critical patent/FR2556132B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8319206A 1983-12-01 1983-12-01 METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT Expired FR2556132B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8319206A FR2556132B1 (en) 1983-12-01 1983-12-01 METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8319206A FR2556132B1 (en) 1983-12-01 1983-12-01 METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT

Publications (2)

Publication Number Publication Date
FR2556132A1 FR2556132A1 (en) 1985-06-07
FR2556132B1 true FR2556132B1 (en) 1987-05-07

Family

ID=9294743

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8319206A Expired FR2556132B1 (en) 1983-12-01 1983-12-01 METHOD FOR ASSEMBLING A HOUSING OF A SEMICONDUCTOR COMPONENT

Country Status (1)

Country Link
FR (1) FR2556132B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951327A (en) * 1975-01-28 1976-04-20 The United States Of America As Represented By The United States Energy Research And Development Administration Ceramic to metal seal
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4328921A (en) * 1980-06-02 1982-05-11 Cominco Ltd. Attachment of solder preform to a cover for a sealed container

Also Published As

Publication number Publication date
FR2556132A1 (en) 1985-06-07

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Legal Events

Date Code Title Description
ST Notification of lapse