FR2549496B1 - METHOD AND APPARATUS FOR CONTROLLING A SPRAY COATING - Google Patents
METHOD AND APPARATUS FOR CONTROLLING A SPRAY COATINGInfo
- Publication number
- FR2549496B1 FR2549496B1 FR8411474A FR8411474A FR2549496B1 FR 2549496 B1 FR2549496 B1 FR 2549496B1 FR 8411474 A FR8411474 A FR 8411474A FR 8411474 A FR8411474 A FR 8411474A FR 2549496 B1 FR2549496 B1 FR 2549496B1
- Authority
- FR
- France
- Prior art keywords
- controlling
- spray coating
- spray
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51524683A | 1983-07-19 | 1983-07-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2549496A1 FR2549496A1 (en) | 1985-01-25 |
FR2549496B1 true FR2549496B1 (en) | 1991-03-29 |
Family
ID=24050558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8411474A Expired - Fee Related FR2549496B1 (en) | 1983-07-19 | 1984-07-19 | METHOD AND APPARATUS FOR CONTROLLING A SPRAY COATING |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS6039161A (en) |
CA (1) | CA1242989A (en) |
DE (1) | DE3425659A1 (en) |
FR (1) | FR2549496B1 (en) |
GB (1) | GB2144888B (en) |
NL (1) | NL8402163A (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3331406A1 (en) * | 1983-08-31 | 1985-03-14 | Leybold-Heraeus GmbH, 5000 Köln | SPRAYING CATODE |
US4595482A (en) * | 1984-05-17 | 1986-06-17 | Varian Associates, Inc. | Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges |
US4875810A (en) * | 1985-10-21 | 1989-10-24 | Canon Kabushiki Kaisha | Apparatus for controlling fine particle flow |
JPH0726204B2 (en) * | 1986-04-16 | 1995-03-22 | 日本真空技術株式会社 | Deposition control device by sputtering |
DE3630737C1 (en) * | 1986-09-10 | 1987-11-05 | Philips & Du Pont Optical | Cathode sputtering device with a device for measuring a critical target removal |
JPS63125676A (en) * | 1986-11-13 | 1988-05-28 | Japan Aviation Electronics Ind Ltd | Film formation by sputtering |
CH669609A5 (en) * | 1986-12-23 | 1989-03-31 | Balzers Hochvakuum | |
JP2599395B2 (en) * | 1987-07-29 | 1997-04-09 | 三菱プレシジョン株式会社 | Tuned Dry Gyro |
JPH01116071A (en) * | 1987-10-28 | 1989-05-09 | Tokyo Electron Ltd | Sputtering device |
DE10154229B4 (en) | 2001-11-07 | 2004-08-05 | Applied Films Gmbh & Co. Kg | Device for the regulation of a plasma impedance |
JP5850713B2 (en) * | 2011-11-11 | 2016-02-03 | 株式会社アルバック | Magnetron sputtering apparatus and magnetron sputtering method |
CN104213089B (en) * | 2014-08-22 | 2016-06-29 | 京东方科技集团股份有限公司 | Magnetron sputtering apparatus and magnetically controlled sputter method |
GB201714646D0 (en) * | 2017-09-12 | 2017-10-25 | Spts Technologies Ltd | Saw device and method of manufacture |
DE102020128802A1 (en) | 2020-11-02 | 2022-05-05 | VON ARDENNE Asset GmbH & Co. KG | Method, control device and storage medium |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3956093A (en) * | 1974-12-16 | 1976-05-11 | Airco, Inc. | Planar magnetron sputtering method and apparatus |
FR2371009A1 (en) * | 1976-11-15 | 1978-06-09 | Commissariat Energie Atomique | METHOD FOR CONTROL OF LAYER DEPOSIT BY REACTIVE SPRAYING AND IMPLEMENTATION DEVICE |
US4166783A (en) * | 1978-04-17 | 1979-09-04 | Varian Associates, Inc. | Deposition rate regulation by computer control of sputtering systems |
US4299678A (en) * | 1979-07-23 | 1981-11-10 | Spin Physics, Inc. | Magnetic target plate for use in magnetron sputtering of magnetic films |
DE3047113A1 (en) * | 1980-12-13 | 1982-07-29 | Leybold-Heraeus GmbH, 5000 Köln | Cathode arrangement and control method for cathode sputtering systems with a magnet system for increasing the sputtering rate |
JPS583976A (en) * | 1981-06-29 | 1983-01-10 | Hitachi Ltd | Method and device for formation of film by sputtering |
US4401539A (en) * | 1981-01-30 | 1983-08-30 | Hitachi, Ltd. | Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure |
JPS5816068A (en) * | 1981-07-22 | 1983-01-29 | Hitachi Ltd | Target electrode structure for planer magnetron system spattering device |
JPS5887270A (en) * | 1981-11-18 | 1983-05-25 | Hitachi Ltd | Structural body of sputtering target of planar magnetron type |
-
1984
- 1984-07-04 CA CA000458138A patent/CA1242989A/en not_active Expired
- 1984-07-06 NL NL8402163A patent/NL8402163A/en not_active Application Discontinuation
- 1984-07-12 DE DE19843425659 patent/DE3425659A1/en not_active Ceased
- 1984-07-16 GB GB08418029A patent/GB2144888B/en not_active Expired
- 1984-07-16 JP JP14616984A patent/JPS6039161A/en active Pending
- 1984-07-19 FR FR8411474A patent/FR2549496B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2549496A1 (en) | 1985-01-25 |
GB2144888A (en) | 1985-03-13 |
DE3425659A1 (en) | 1985-01-31 |
NL8402163A (en) | 1985-02-18 |
JPS6039161A (en) | 1985-02-28 |
GB2144888B (en) | 1986-11-12 |
GB8418029D0 (en) | 1984-08-22 |
CA1242989A (en) | 1988-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |