FR2546878B1 - SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD - Google Patents

SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD

Info

Publication number
FR2546878B1
FR2546878B1 FR8308992A FR8308992A FR2546878B1 FR 2546878 B1 FR2546878 B1 FR 2546878B1 FR 8308992 A FR8308992 A FR 8308992A FR 8308992 A FR8308992 A FR 8308992A FR 2546878 B1 FR2546878 B1 FR 2546878B1
Authority
FR
France
Prior art keywords
applications
support plate
thermal conductivity
expansion coefficient
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8308992A
Other languages
French (fr)
Other versions
FR2546878A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR8308992A priority Critical patent/FR2546878B1/en
Publication of FR2546878A1 publication Critical patent/FR2546878A1/en
Application granted granted Critical
Publication of FR2546878B1 publication Critical patent/FR2546878B1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
    • C04B35/80—Fibres, filaments, whiskers, platelets, or the like
    • C04B35/83—Carbon fibres in a carbon matrix
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/628—Coating the powders or the macroscopic reinforcing agents
    • C04B35/62844—Coating fibres
    • C04B35/62857—Coating fibres with non-oxide ceramics
    • C04B35/62873—Carbon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/645—Pressure sintering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3817—Carbides
    • C04B2235/3826—Silicon carbides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/405—Iron group metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
    • C04B2235/421—Boron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/608—Green bodies or pre-forms with well-defined density
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/614—Gas infiltration of green bodies or pre-forms
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/616—Liquid infiltration of green bodies or pre-forms
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/77—Density
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/95—Products characterised by their size, e.g. microceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • C04B2235/9615—Linear firing shrinkage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
FR8308992A 1983-05-31 1983-05-31 SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD Expired FR2546878B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8308992A FR2546878B1 (en) 1983-05-31 1983-05-31 SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8308992A FR2546878B1 (en) 1983-05-31 1983-05-31 SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD

Publications (2)

Publication Number Publication Date
FR2546878A1 FR2546878A1 (en) 1984-12-07
FR2546878B1 true FR2546878B1 (en) 1988-04-08

Family

ID=9289344

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8308992A Expired FR2546878B1 (en) 1983-05-31 1983-05-31 SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD

Country Status (1)

Country Link
FR (1) FR2546878B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115521613A (en) * 2021-06-25 2022-12-27 中微半导体设备(上海)股份有限公司 Heat-conducting and electric-conducting elastic composite material, preparation method thereof and semiconductor processing device

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68929046T2 (en) * 1988-04-28 1999-12-23 Mitsubishi Heavy Ind Ltd Carbon fiber reinforced carbon composites, processes for their manufacture and their use as inner walls of nuclear fusion reactors
JPH0791660B2 (en) * 1989-08-30 1995-10-04 株式会社日立製作所 Ground equipment with heat-resistant walls for environmental protection
EP0471552B1 (en) * 1990-08-14 1997-07-02 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
JP2505065B2 (en) * 1990-10-04 1996-06-05 三菱電機株式会社 Semiconductor device and manufacturing method thereof
JP2590603B2 (en) * 1990-10-09 1997-03-12 三菱電機株式会社 Substrates for mounting electronic components
FR2704479B1 (en) * 1993-04-30 1995-06-02 Thomson Csf Carbon fiber composite plates in a copper matrix and their manufacturing processes.
FR2714254B1 (en) * 1993-12-20 1996-03-08 Aerospatiale Heat transfer element, usable in particular in electronics as a printed circuit or component support and its manufacturing process.
EP0673900A3 (en) * 1994-03-25 1996-07-17 Goodrich Co B F Carbon/carbon composites and electrical apparatus containing the same.
FR2758146A1 (en) * 1997-01-09 1998-07-10 Aerospatiale Composite carbon@ fibre reinforced materials with mixed carbon@-metal matrix
FR2760760B1 (en) * 1997-01-09 1999-07-30 Aerospatiale USE OF A COMPOSITE MATERIAL WITH CARBON REINFORCEMENT AND MIXED CARBON-METAL MATRIX FOR THE PRODUCTION OF COMPONENTS OF PLATFORMS, SATELLITES AND SPACE MACHINES
EP0931781A1 (en) * 1998-01-08 1999-07-28 AEROSPATIALE Société Nationale Industrielle Use of a carbon reinforced and mixed carbon-metal matrix composite for the realisation of components of platforms, satellites and engines in space
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6340796B1 (en) * 1999-06-02 2002-01-22 Northrop Grumman Corporation Printed wiring board structure with integral metal matrix composite core
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
FR2951047B1 (en) 2009-10-07 2011-12-09 Valeo Etudes Electroniques POWER ELECTRONIC MODULE AND METHOD OF MANUFACTURING THE MODULE
CN107586117B (en) * 2017-03-15 2020-10-16 鲁东大学 Method for toughening alumina ceramic material by carbon fiber

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2724131C2 (en) * 1977-05-27 1982-06-09 C. Conradty Nürnberg GmbH & Co KG, 8505 Röthenbach Plate-shaped carbon body and method for its manufacture
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device
FR2459557A1 (en) * 1979-06-15 1981-01-09 Lerouzix Jean METAL SUPPORT FOR ELECTRONIC COMPONENT INTERCONNECTION NETWORK AND METHOD OF MANUFACTURING THE SAME
JPS57130441A (en) * 1981-02-06 1982-08-12 Hitachi Ltd Integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115521613A (en) * 2021-06-25 2022-12-27 中微半导体设备(上海)股份有限公司 Heat-conducting and electric-conducting elastic composite material, preparation method thereof and semiconductor processing device
CN115521613B (en) * 2021-06-25 2024-03-12 中微半导体设备(上海)股份有限公司 Heat-conducting and electricity-conducting elastic composite material, preparation method thereof and semiconductor processing device

Also Published As

Publication number Publication date
FR2546878A1 (en) 1984-12-07

Similar Documents

Publication Publication Date Title
FR2546878B1 (en) SUPPORT PLATE FOR A LIGHT CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AND EXPANSION COEFFICIENT SUITABLE FOR ALL APPLICATIONS IN THE ELECTRONIC FIELD
DE3587481T2 (en) Circuit substrate with high thermal conductivity.
FR2603740B1 (en) COMBINATION OF A CERAMIC SUBSTRATE SUPPORTING ELECTRONIC COMPONENTS AND A THERMAL DISSIPATOR THEREFOR
FI883075A0 (en) Thermosetting silicone composition and method for coating the substrate with the composition
DE3856475D1 (en) Monocrystalline thin film substrate
DE69526003T2 (en) Optical device with substrate and waveguide structure with thermally adapted interfaces
DE69210886T2 (en) Substrate with thin film elements
DE3584915D1 (en) SEMICONDUCTOR MATERIAL AND SUBSTRATE.
DE3784213D1 (en) ELECTRONIC APPARATUS WITH A CERAMIC SUBSTRATE.
DE3854082D1 (en) Workstation computer with electronic calendar support.
DE69118226D1 (en) Electrical thin-film component with polymer substrate
DE3888465D1 (en) Liquid crystal substrate with active matrix.
DK93090A (en) TRANSPORTING COOLING SYSTEM AND PROCEDURE TO INCREASE THE HEATING CAPACITY OF SUCH A COOLING SYSTEM IN A HEATING PERIOD
EP0414499A3 (en) Semiconductor structure with closely coupled substrate temperature sense element
DE69025955T3 (en) HIGH TEMPERATURE DIFFUSION FURNACE
DE3762868D1 (en) POLYMETHACRYLATE MOLDS WITH HIGH THERMAL RESISTANCE AND HIGH THERMAL STABILITY.
DE69300907T2 (en) Ceramic multilayer substrate with gradient contact holes.
DE69024684T2 (en) Ceramic substrate with built-in LC circuit
IT1232865B (en) CERAMIC REPAIR PROCESS AND EQUIPMENT
IT8553578V0 (en) TRIPOD SUPPORT, IN PARTICULAR FOR FILM CAMERA AND SIMILAR
DE69118488D1 (en) Active matrix substrate
DE69132764T2 (en) Semiconductor device with reflective layer
BR9000267A (en) CUREABLE AND SUBSTRATE COMPOSITION
DE58906295D1 (en) Silicon naphthalocyanines with unsaturated ligands and optical recording medium.
DK598985A (en) SUBSTRATE CONTAINING THE POLYPROPYLINE AND PRODUCTS OF THIS

Legal Events

Date Code Title Description
TP Transmission of property
CA Change of address
TP Transmission of property
ST Notification of lapse