FR2545987B1 - Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase - Google Patents

Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase

Info

Publication number
FR2545987B1
FR2545987B1 FR8307796A FR8307796A FR2545987B1 FR 2545987 B1 FR2545987 B1 FR 2545987B1 FR 8307796 A FR8307796 A FR 8307796A FR 8307796 A FR8307796 A FR 8307796A FR 2545987 B1 FR2545987 B1 FR 2545987B1
Authority
FR
France
Prior art keywords
base
producing
support
resulting
pad mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8307796A
Other languages
English (en)
Other versions
FR2545987A1 (fr
Inventor
Raymond Henry
Michel Heitzmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8307796A priority Critical patent/FR2545987B1/fr
Publication of FR2545987A1 publication Critical patent/FR2545987A1/fr
Application granted granted Critical
Publication of FR2545987B1 publication Critical patent/FR2545987B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8307796A 1983-05-10 1983-05-10 Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase Expired FR2545987B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8307796A FR2545987B1 (fr) 1983-05-10 1983-05-10 Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8307796A FR2545987B1 (fr) 1983-05-10 1983-05-10 Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase

Publications (2)

Publication Number Publication Date
FR2545987A1 FR2545987A1 (fr) 1984-11-16
FR2545987B1 true FR2545987B1 (fr) 1986-10-17

Family

ID=9288753

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8307796A Expired FR2545987B1 (fr) 1983-05-10 1983-05-10 Procede de realisation d'une embase plane a partir d'un pave monte sur un support, embase en resultant et utilisation d'une telle embase

Country Status (1)

Country Link
FR (1) FR2545987B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59208893D1 (de) * 1992-01-23 1997-10-16 Siemens Ag Halbleitermodul mit hoher Isolations- und Wärmefähigkeit
FR2714254B1 (fr) * 1993-12-20 1996-03-08 Aerospatiale Elément de transfert thermique, utilisable notamment en électronique comme support de circuit imprimé ou de composant et son procédé de fabrication.

Also Published As

Publication number Publication date
FR2545987A1 (fr) 1984-11-16

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Legal Events

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ST Notification of lapse