FR2538164B1 - ENCAPSULATION PROCESS AND INTEGRATED CIRCUIT IN A PACKAGE ENCAPSULATED BY THIS PROCESS - Google Patents
ENCAPSULATION PROCESS AND INTEGRATED CIRCUIT IN A PACKAGE ENCAPSULATED BY THIS PROCESSInfo
- Publication number
- FR2538164B1 FR2538164B1 FR8221400A FR8221400A FR2538164B1 FR 2538164 B1 FR2538164 B1 FR 2538164B1 FR 8221400 A FR8221400 A FR 8221400A FR 8221400 A FR8221400 A FR 8221400A FR 2538164 B1 FR2538164 B1 FR 2538164B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- package encapsulated
- encapsulation
- encapsulation process
- encapsulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/491—Disposition
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01094—Plutonium [Pu]
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- H01L2924/013—Alloys
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8221400A FR2538164B1 (en) | 1982-12-21 | 1982-12-21 | ENCAPSULATION PROCESS AND INTEGRATED CIRCUIT IN A PACKAGE ENCAPSULATED BY THIS PROCESS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8221400A FR2538164B1 (en) | 1982-12-21 | 1982-12-21 | ENCAPSULATION PROCESS AND INTEGRATED CIRCUIT IN A PACKAGE ENCAPSULATED BY THIS PROCESS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2538164A1 FR2538164A1 (en) | 1984-06-22 |
FR2538164B1 true FR2538164B1 (en) | 1985-06-07 |
Family
ID=9280326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8221400A Expired FR2538164B1 (en) | 1982-12-21 | 1982-12-21 | ENCAPSULATION PROCESS AND INTEGRATED CIRCUIT IN A PACKAGE ENCAPSULATED BY THIS PROCESS |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2538164B1 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1907075B2 (en) * | 1969-02-13 | 1974-07-04 | Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg | Process for the production of small semiconductor rectifiers |
US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
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1982
- 1982-12-21 FR FR8221400A patent/FR2538164B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2538164A1 (en) | 1984-06-22 |
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Legal Events
Date | Code | Title | Description |
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CD | Change of name or company name | ||
ST | Notification of lapse |