FR2534108B1 - IMPROVED HERMETIC SEALING METHOD AND APPARATUS - Google Patents

IMPROVED HERMETIC SEALING METHOD AND APPARATUS

Info

Publication number
FR2534108B1
FR2534108B1 FR8315739A FR8315739A FR2534108B1 FR 2534108 B1 FR2534108 B1 FR 2534108B1 FR 8315739 A FR8315739 A FR 8315739A FR 8315739 A FR8315739 A FR 8315739A FR 2534108 B1 FR2534108 B1 FR 2534108B1
Authority
FR
France
Prior art keywords
sealing method
hermetic sealing
improved hermetic
improved
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8315739A
Other languages
French (fr)
Other versions
FR2534108A1 (en
Inventor
Sumner Harold Wolfson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Burr Brown Research Corp
Original Assignee
Burr Brown Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burr Brown Research Corp filed Critical Burr Brown Research Corp
Publication of FR2534108A1 publication Critical patent/FR2534108A1/en
Application granted granted Critical
Publication of FR2534108B1 publication Critical patent/FR2534108B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
FR8315739A 1982-09-30 1983-09-28 IMPROVED HERMETIC SEALING METHOD AND APPARATUS Expired FR2534108B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42859382A 1982-09-30 1982-09-30

Publications (2)

Publication Number Publication Date
FR2534108A1 FR2534108A1 (en) 1984-04-06
FR2534108B1 true FR2534108B1 (en) 1987-02-06

Family

ID=23699582

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8315739A Expired FR2534108B1 (en) 1982-09-30 1983-09-28 IMPROVED HERMETIC SEALING METHOD AND APPARATUS

Country Status (4)

Country Link
JP (1) JPS5979553A (en)
DE (1) DE3335574A1 (en)
FR (1) FR2534108B1 (en)
GB (1) GB2127740B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process
US4771151A (en) * 1984-10-05 1988-09-13 Metcal, Inc. Self-heating lid for soldering to a box
US4611398A (en) * 1984-10-09 1986-09-16 Gte Products Corporation Integrated circuit package
US4788404A (en) * 1985-06-20 1988-11-29 Metcal, Inc. Self-soldering flexible circuit connector
US5175409A (en) * 1985-06-20 1992-12-29 Metcal, Inc. Self-soldering flexible circuit connector
JPH05217121A (en) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
WO2005050751A2 (en) * 2003-11-12 2005-06-02 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
US8173995B2 (en) 2005-12-23 2012-05-08 E. I. Du Pont De Nemours And Company Electronic device including an organic active layer and process for forming the electronic device
GB2480650A (en) * 2010-05-26 2011-11-30 Nokia Corp Re-sealable electronic equipment container

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
JPS5420141A (en) * 1977-07-11 1979-02-15 Mitsubishi Chem Ind Ltd Method and composition for preventing gastro-intestinal diseases of cattle
JPS5646547A (en) * 1979-09-21 1981-04-27 Hitachi Ltd Airtight sealing of integrated circuit
US4507907A (en) * 1981-09-02 1985-04-02 Burr-Brown Corporation Expendable heater sealing process
GB2127740B (en) * 1982-09-30 1985-10-23 Burr Brown Res Corp Improved hermetic sealing process

Also Published As

Publication number Publication date
FR2534108A1 (en) 1984-04-06
GB8313729D0 (en) 1983-06-22
GB2127740A (en) 1984-04-18
JPS5979553A (en) 1984-05-08
DE3335574A1 (en) 1984-05-10
GB2127740B (en) 1985-10-23

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Legal Events

Date Code Title Description
ST Notification of lapse