FR2534040B1 - Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche - Google Patents

Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche

Info

Publication number
FR2534040B1
FR2534040B1 FR8216599A FR8216599A FR2534040B1 FR 2534040 B1 FR2534040 B1 FR 2534040B1 FR 8216599 A FR8216599 A FR 8216599A FR 8216599 A FR8216599 A FR 8216599A FR 2534040 B1 FR2534040 B1 FR 2534040B1
Authority
FR
France
Prior art keywords
reactor
dry etching
resins used
associated method
stabilization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8216599A
Other languages
English (en)
Other versions
FR2534040A1 (fr
Inventor
Barbara Charlet
Louise Peccoud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR8216599A priority Critical patent/FR2534040B1/fr
Publication of FR2534040A1 publication Critical patent/FR2534040A1/fr
Application granted granted Critical
Publication of FR2534040B1 publication Critical patent/FR2534040B1/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31058—After-treatment of organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Optical Integrated Circuits (AREA)
FR8216599A 1982-10-04 1982-10-04 Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche Expired FR2534040B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8216599A FR2534040B1 (fr) 1982-10-04 1982-10-04 Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8216599A FR2534040B1 (fr) 1982-10-04 1982-10-04 Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche

Publications (2)

Publication Number Publication Date
FR2534040A1 FR2534040A1 (fr) 1984-04-06
FR2534040B1 true FR2534040B1 (fr) 1988-05-13

Family

ID=9277946

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8216599A Expired FR2534040B1 (fr) 1982-10-04 1982-10-04 Reacteur et procede associe pour traitement de stabilisation de resines utilisees notamment en gravure seche

Country Status (1)

Country Link
FR (1) FR2534040B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2566544B1 (fr) * 1984-06-26 1994-08-26 Efcis Procede de durcissement de motifs de resine photosensible positive, apres developpement photolithographique
SG118134A1 (en) * 2001-05-18 2006-01-27 Fuji Photo Film Co Ltd Master medium cleaning method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4187331A (en) * 1978-08-24 1980-02-05 International Business Machines Corp. Fluorine plasma resist image hardening
JPS55134175A (en) * 1979-04-06 1980-10-18 Hitachi Ltd Microwave plasma etching unit

Also Published As

Publication number Publication date
FR2534040A1 (fr) 1984-04-06

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Legal Events

Date Code Title Description
ST Notification of lapse