FR2516309B1 - - Google Patents
Info
- Publication number
- FR2516309B1 FR2516309B1 FR8120838A FR8120838A FR2516309B1 FR 2516309 B1 FR2516309 B1 FR 2516309B1 FR 8120838 A FR8120838 A FR 8120838A FR 8120838 A FR8120838 A FR 8120838A FR 2516309 B1 FR2516309 B1 FR 2516309B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
- H10D88/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8120838A FR2516309A1 (fr) | 1981-11-06 | 1981-11-06 | Procede de fabrication d'un inverseur cmos forme de deux transistors empiles et auto-alignes par rapport a la grille de l'inverseur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8120838A FR2516309A1 (fr) | 1981-11-06 | 1981-11-06 | Procede de fabrication d'un inverseur cmos forme de deux transistors empiles et auto-alignes par rapport a la grille de l'inverseur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2516309A1 FR2516309A1 (fr) | 1983-05-13 |
| FR2516309B1 true FR2516309B1 (enExample) | 1983-12-23 |
Family
ID=9263765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8120838A Granted FR2516309A1 (fr) | 1981-11-06 | 1981-11-06 | Procede de fabrication d'un inverseur cmos forme de deux transistors empiles et auto-alignes par rapport a la grille de l'inverseur |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2516309A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4921813A (en) * | 1988-10-17 | 1990-05-01 | Motorola, Inc. | Method for making a polysilicon transistor |
| US6472232B1 (en) * | 2000-02-22 | 2002-10-29 | International Business Machines Corporation | Semiconductor temperature monitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4142926A (en) * | 1977-02-24 | 1979-03-06 | Intel Corporation | Self-aligning double polycrystalline silicon etching process |
-
1981
- 1981-11-06 FR FR8120838A patent/FR2516309A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2516309A1 (fr) | 1983-05-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |