FR2512275B3 - - Google Patents
Info
- Publication number
- FR2512275B3 FR2512275B3 FR8211867A FR8211867A FR2512275B3 FR 2512275 B3 FR2512275 B3 FR 2512275B3 FR 8211867 A FR8211867 A FR 8211867A FR 8211867 A FR8211867 A FR 8211867A FR 2512275 B3 FR2512275 B3 FR 2512275B3
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W70/24—
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- H10W74/114—
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- H10W76/136—
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- H10W76/47—
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- H10W72/00—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3134307 | 1981-08-29 | ||
| DE3146227 | 1981-11-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2512275A3 FR2512275A3 (fr) | 1983-03-04 |
| FR2512275B3 true FR2512275B3 (Direct) | 1983-07-22 |
Family
ID=25795649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8211867A Granted FR2512275A3 (fr) | 1981-08-29 | 1982-07-06 | Dispositif redresseur de courant avec plaquette a diode a semi-conducteur |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4532539A (Direct) |
| FR (1) | FR2512275A3 (Direct) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5005069A (en) * | 1990-04-30 | 1991-04-02 | Motorola Inc. | Rectifier and method |
| US5243217A (en) * | 1990-11-03 | 1993-09-07 | Fuji Electric Co., Ltd. | Sealed semiconductor device with protruding portion |
| US5172213A (en) * | 1991-05-23 | 1992-12-15 | At&T Bell Laboratories | Molded circuit package having heat dissipating post |
| FR2737618B1 (fr) * | 1995-08-02 | 1997-10-24 | Valeo Equip Electr Moteur | Alternateur comportant des pieces d'adaptation pour diodes de pont redresseur, notamment pour vehicule automobile, et piece d'adaptation pour un tel alternateur |
| DE19549202B4 (de) * | 1995-12-30 | 2006-05-04 | Robert Bosch Gmbh | Gleichrichterdiode |
| US5729052A (en) * | 1996-06-20 | 1998-03-17 | International Business Machines Corporation | Integrated ULSI heatsink |
| US6160309A (en) * | 1999-03-25 | 2000-12-12 | Le; Hiep | Press-fit semiconductor package |
| KR100361695B1 (ko) * | 2000-04-03 | 2002-11-22 | 주식회사 케이이씨 | 정류 다이오드 제조방법 |
| JP2002359328A (ja) * | 2001-03-29 | 2002-12-13 | Hitachi Ltd | 半導体装置 |
| DE10141603A1 (de) * | 2001-08-24 | 2003-03-06 | Bosch Gmbh Robert | Verfahren zum Befestigen eines elektrischen Elements sowie Baueinheit mit danach befestigtem elektrischen Element |
| CN103177959A (zh) * | 2011-12-23 | 2013-06-26 | 贵州雅光电子科技股份有限公司 | 防止应力作用在芯片上的二极管及其制作方法 |
| US9312742B2 (en) | 2013-03-01 | 2016-04-12 | Hamilton Sundstrand Corporation | Connector and spring assembly for a generator |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2917286A (en) * | 1956-11-13 | 1959-12-15 | Siemens Edison Swan Ltd | Electronic equipment |
| US3247896A (en) * | 1963-12-27 | 1966-04-26 | Ibm | Component heat removal device |
| US3375415A (en) * | 1964-07-17 | 1968-03-26 | Motorola Inc | High current rectifier |
| US3449506A (en) * | 1967-05-11 | 1969-06-10 | Int Rectifier Corp | Aluminum rectifier base having copper insert |
| DE1764287C3 (de) * | 1967-05-16 | 1980-04-03 | Mitsubishi Denki K.K., Tokio | Halbleiterbauelement mit wärmeableitender Platte |
| US3793570A (en) * | 1968-09-26 | 1974-02-19 | Gen Motors Corp | Compact power semiconductor device and method of making same |
| DE1944515A1 (de) * | 1969-09-02 | 1971-03-04 | Siemens Ag | Halbleiterbauelement mit Kunststoffuellung |
| DE2042333A1 (de) * | 1970-08-26 | 1972-03-02 | Siemens Ag | Verfahren zum gasdichten Verschließen von Halbleiterbauelementen |
| DE2060933C3 (de) * | 1970-12-10 | 1978-08-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Sockel für ein Halbleiterbauelementgehäuse und Verfahren zu seiner Herstellung |
| JPS542067A (en) * | 1977-06-07 | 1979-01-09 | Hitachi Ltd | Semiconductor device |
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1982
- 1982-07-06 FR FR8211867A patent/FR2512275A3/fr active Granted
- 1982-07-26 US US06/401,919 patent/US4532539A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4532539A (en) | 1985-07-30 |
| FR2512275A3 (fr) | 1983-03-04 |