FR2505367B1 - - Google Patents

Info

Publication number
FR2505367B1
FR2505367B1 FR8109226A FR8109226A FR2505367B1 FR 2505367 B1 FR2505367 B1 FR 2505367B1 FR 8109226 A FR8109226 A FR 8109226A FR 8109226 A FR8109226 A FR 8109226A FR 2505367 B1 FR2505367 B1 FR 2505367B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8109226A
Other languages
French (fr)
Other versions
FR2505367A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR8109226A priority Critical patent/FR2505367A1/fr
Publication of FR2505367A1 publication Critical patent/FR2505367A1/fr
Application granted granted Critical
Publication of FR2505367B1 publication Critical patent/FR2505367B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR8109226A 1981-05-08 1981-05-08 Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride Granted FR2505367A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8109226A FR2505367A1 (fr) 1981-05-08 1981-05-08 Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8109226A FR2505367A1 (fr) 1981-05-08 1981-05-08 Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride

Publications (2)

Publication Number Publication Date
FR2505367A1 FR2505367A1 (fr) 1982-11-12
FR2505367B1 true FR2505367B1 (enrdf_load_html_response) 1983-07-18

Family

ID=9258233

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8109226A Granted FR2505367A1 (fr) 1981-05-08 1981-05-08 Procede d'etamage d'une couche conductrice disposee sur un dielectrique et son application a un circuit multicouches pour circuit hybride

Country Status (1)

Country Link
FR (1) FR2505367A1 (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1257401A (en) * 1986-09-03 1989-07-11 Stanley D. Entwistle Multi-point solder paste application
US5429293A (en) * 1994-12-19 1995-07-04 Motorola, Inc. Soldering process
US5803344A (en) * 1996-09-09 1998-09-08 Delco Electronics Corp. Dual-solder process for enhancing reliability of thick-film hybrid circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3292240A (en) * 1963-08-08 1966-12-20 Ibm Method of fabricating microminiature functional components
FR1402767A (fr) * 1963-08-08 1965-06-11 Ibm Procédé et appareil pour la fabrication d'éléments fonctionnels microminiaturisés
DE2410849B2 (de) * 1974-03-07 1979-12-06 Blaupunkt-Werke Gmbh, 3200 Hildesheim Verfahren zum Auflöten von Miniatur-Bauelementen
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern
FR2317850A1 (fr) * 1975-07-11 1977-02-04 Siderurgie Fse Inst Rech Dispositif pour l'etamage des circuits imprimes
FR2458202B1 (fr) * 1976-07-21 1985-10-25 Shipley Co Procede, matiere et appareil de fabrication de circuits imprimes

Also Published As

Publication number Publication date
FR2505367A1 (fr) 1982-11-12

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Legal Events

Date Code Title Description
ST Notification of lapse