FR2503977B1 - - Google Patents

Info

Publication number
FR2503977B1
FR2503977B1 FR8107297A FR8107297A FR2503977B1 FR 2503977 B1 FR2503977 B1 FR 2503977B1 FR 8107297 A FR8107297 A FR 8107297A FR 8107297 A FR8107297 A FR 8107297A FR 2503977 B1 FR2503977 B1 FR 2503977B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8107297A
Other languages
French (fr)
Other versions
FR2503977A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR8107297A priority Critical patent/FR2503977A1/fr
Publication of FR2503977A1 publication Critical patent/FR2503977A1/fr
Application granted granted Critical
Publication of FR2503977B1 publication Critical patent/FR2503977B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR8107297A 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support Granted FR2503977A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8107297A FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8107297A FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Publications (2)

Publication Number Publication Date
FR2503977A1 FR2503977A1 (fr) 1982-10-15
FR2503977B1 true FR2503977B1 (US08197722-20120612-C00093.png) 1985-01-18

Family

ID=9257279

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8107297A Granted FR2503977A1 (fr) 1981-04-10 1981-04-10 Procede de realisation d'une metallisation sur la tranche d'un support plat, et circuit electronique comportant un tel support

Country Status (1)

Country Link
FR (1) FR2503977A1 (US08197722-20120612-C00093.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI84214C (fi) * 1987-08-21 1991-10-25 Nokia Mobira Oy Anordning foer anslutning av en hybridkrets till en basplatta.
FR2638894A1 (fr) * 1988-11-04 1990-05-11 Thomson Csf Dispositif et procede de connexion et de fixation de composants
FI84948C (fi) * 1989-04-12 1992-02-10 Nokia Mobira Oy Ytkontaktdon foer radiofrekventa signaler.
FI89842C (fi) * 1989-04-12 1993-11-25 Nokia Mobira Oy Fjaedrande kontaktdon foer radiofrekventa signaler
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
EP0766507B1 (en) 1995-09-12 2013-03-20 Allen-Bradley Company, Inc. Circuit board having a window adapted to receive a single in-line package module
US5831218A (en) * 1996-06-28 1998-11-03 Motorola, Inc. Method and circuit board panel for circuit board manufacturing that prevents assembly-line delamination and sagging
CN1212820A (zh) * 1997-01-29 1999-03-31 摩托罗拉公司 用于复杂电路板制造过程中基本消除装配线剥离和下垂的方法和组合电路板
GB2346734B (en) * 1999-01-28 2003-09-24 Marconi Electronic Syst Ltd Optical interface arrangement
JP2003163430A (ja) * 2001-11-27 2003-06-06 Nec Corp プリント基板
US20060213685A1 (en) * 2002-06-27 2006-09-28 Wang Alan E Single or multi-layer printed circuit board with improved edge via design
JP2012174652A (ja) * 2011-02-24 2012-09-10 Yazaki Corp 車両用室内照明灯

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1208375B (de) * 1964-03-25 1966-01-05 Telefonbau Verfahren zur Verbindung von Leitungen beiderseitig bedruckter Leiterplatten
FR1481461A (fr) * 1965-06-01 1967-05-19 Philips Nv Plaque à câblage imprimé
GB1089925A (en) * 1965-10-08 1967-11-08 London Electrical Mfg Company Method of manufacturing mica or like capacitors
CA1063627A (en) * 1976-04-26 1979-10-02 Ross E. Stewart Tandem suspension assembly bushing
GB2031763B (en) * 1978-10-16 1982-07-28 Ultra Electronic Controls Ltd Connections between a flexible circuit board and a rigid member

Also Published As

Publication number Publication date
FR2503977A1 (fr) 1982-10-15

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Legal Events

Date Code Title Description
ST Notification of lapse