FR2500215B1 - - Google Patents

Info

Publication number
FR2500215B1
FR2500215B1 FR8102862A FR8102862A FR2500215B1 FR 2500215 B1 FR2500215 B1 FR 2500215B1 FR 8102862 A FR8102862 A FR 8102862A FR 8102862 A FR8102862 A FR 8102862A FR 2500215 B1 FR2500215 B1 FR 2500215B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8102862A
Other languages
French (fr)
Other versions
FR2500215A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8102862A priority Critical patent/FR2500215A1/fr
Publication of FR2500215A1 publication Critical patent/FR2500215A1/fr
Application granted granted Critical
Publication of FR2500215B1 publication Critical patent/FR2500215B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR8102862A 1981-02-13 1981-02-13 Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif Granted FR2500215A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8102862A FR2500215A1 (fr) 1981-02-13 1981-02-13 Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8102862A FR2500215A1 (fr) 1981-02-13 1981-02-13 Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif

Publications (2)

Publication Number Publication Date
FR2500215A1 FR2500215A1 (fr) 1982-08-20
FR2500215B1 true FR2500215B1 (ja) 1985-01-25

Family

ID=9255173

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8102862A Granted FR2500215A1 (fr) 1981-02-13 1981-02-13 Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif

Country Status (1)

Country Link
FR (1) FR2500215A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564243B1 (fr) * 1984-05-11 1987-02-20 Europ Composants Electron Boitier a dissipation thermique d'encapsulation de circuits electriques
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
US5349498A (en) * 1992-12-23 1994-09-20 Hughes Aircraft Company Integral extended surface cooling of power modules
WO1995008844A1 (de) * 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Kühlvorrichtung für ein leistungshalbleitermodul
DE4416616C2 (de) * 1994-05-11 1997-05-22 Fichtel & Sachs Ag Gehäuse
US6674164B1 (en) * 1999-04-26 2004-01-06 Aerovironment, Inc. System for uniformly interconnecting and cooling
JP5105801B2 (ja) * 2006-09-05 2012-12-26 株式会社東芝 半導体装置
JP5024600B2 (ja) * 2007-01-11 2012-09-12 アイシン・エィ・ダブリュ株式会社 発熱体冷却構造及びその構造を備えた駆動装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1393198A (fr) * 1951-01-28 1965-03-19 Siemens Ag Redresseur à courant fort
DE1439239A1 (de) * 1951-01-28 1968-10-17 Siemens Ag Hochstrom-Gleichrichteranlage
CH414871A (de) * 1964-06-19 1966-06-15 Bbc Brown Boveri & Cie Kühlanordnung mit Flüssigkeitskühlung von Halbleiterelementen
FR1437208A (fr) * 1964-06-19 1966-04-29 Bbc Brown Boveri & Cie Dispositif à semi-conducteurs avec refroidissement par liquide
GB1306224A (ja) * 1969-02-24 1973-02-07
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements

Also Published As

Publication number Publication date
FR2500215A1 (fr) 1982-08-20

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