FR2498873B1 - - Google Patents
Info
- Publication number
- FR2498873B1 FR2498873B1 FR8101223A FR8101223A FR2498873B1 FR 2498873 B1 FR2498873 B1 FR 2498873B1 FR 8101223 A FR8101223 A FR 8101223A FR 8101223 A FR8101223 A FR 8101223A FR 2498873 B1 FR2498873 B1 FR 2498873B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8101223A FR2498873A1 (fr) | 1981-01-23 | 1981-01-23 | Procede de fabrication de circuits imprimes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8101223A FR2498873A1 (fr) | 1981-01-23 | 1981-01-23 | Procede de fabrication de circuits imprimes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2498873A1 FR2498873A1 (fr) | 1982-07-30 |
| FR2498873B1 true FR2498873B1 (US07696358-20100413-C00002.png) | 1984-08-31 |
Family
ID=9254438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8101223A Granted FR2498873A1 (fr) | 1981-01-23 | 1981-01-23 | Procede de fabrication de circuits imprimes |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2498873A1 (US07696358-20100413-C00002.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2566611A1 (fr) * | 1984-06-25 | 1985-12-27 | Rhone Poulenc Rech | Nouveaux circuits imprimes injectes et procede d'obtention |
| US4989317A (en) * | 1988-11-21 | 1991-02-05 | Hewlett-Packard Company | Method for making tab circuit electrical connector supporting multiple components thereon |
| DE19601388A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Leiterplatten-Trägervorrichtung |
| JP3633252B2 (ja) | 1997-01-10 | 2005-03-30 | イビデン株式会社 | プリント配線板及びその製造方法 |
| EP1667502B1 (en) * | 1997-02-28 | 2013-03-13 | Ibiden Co., Ltd. | Method of manufacturing a printed wiring board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1445569A (fr) * | 1965-05-18 | 1966-07-15 | Thomson Houston Comp Francaise | Perfectionnements aux réalisations de câblages imprimés et de leurs interconnexions |
| US3475284A (en) * | 1966-04-18 | 1969-10-28 | Friden Inc | Manufacture of electric circuit modules |
| HU168090B (US07696358-20100413-C00002.png) * | 1973-11-15 | 1976-02-28 | ||
| US3876460A (en) * | 1974-01-24 | 1975-04-08 | Plessey Inc | Fine-line thick-film substrate fabrication |
-
1981
- 1981-01-23 FR FR8101223A patent/FR2498873A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2498873A1 (fr) | 1982-07-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |