FR2496987B1 - - Google Patents
Info
- Publication number
- FR2496987B1 FR2496987B1 FR8027448A FR8027448A FR2496987B1 FR 2496987 B1 FR2496987 B1 FR 2496987B1 FR 8027448 A FR8027448 A FR 8027448A FR 8027448 A FR8027448 A FR 8027448A FR 2496987 B1 FR2496987 B1 FR 2496987B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8027448A FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
| GB8135867A GB2090058B (en) | 1980-12-24 | 1981-11-27 | An electrode structure for a semiconductor wafer |
| SE8107624A SE8107624L (sv) | 1980-12-24 | 1981-12-18 | Elektrod for halvledarbricka |
| DE19813151113 DE3151113A1 (de) | 1980-12-24 | 1981-12-23 | "elektroden fuer leistungs-halbleiterzelle" |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8027448A FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2496987A1 FR2496987A1 (fr) | 1982-06-25 |
| FR2496987B1 true FR2496987B1 (member.php) | 1984-02-03 |
Family
ID=9249477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8027448A Granted FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE3151113A1 (member.php) |
| FR (1) | FR2496987A1 (member.php) |
| GB (1) | GB2090058B (member.php) |
| SE (1) | SE8107624L (member.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5305338A (en) * | 1990-09-25 | 1994-04-19 | Mitsubishi Denki Kabushiki Kaisha | Switch device for laser |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO118754B (member.php) * | 1964-04-20 | 1970-02-09 | Asea Ab | |
| US3566958A (en) * | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
| US3746947A (en) * | 1969-03-15 | 1973-07-17 | Mitsubishi Electric Corp | Semiconductor device |
-
1980
- 1980-12-24 FR FR8027448A patent/FR2496987A1/fr active Granted
-
1981
- 1981-11-27 GB GB8135867A patent/GB2090058B/en not_active Expired
- 1981-12-18 SE SE8107624A patent/SE8107624L/ not_active Application Discontinuation
- 1981-12-23 DE DE19813151113 patent/DE3151113A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2496987A1 (fr) | 1982-06-25 |
| SE8107624L (sv) | 1982-06-25 |
| DE3151113A1 (de) | 1982-08-19 |
| GB2090058B (en) | 1985-08-21 |
| GB2090058A (en) | 1982-06-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |