FR2493602A1 - Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule - Google Patents

Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule Download PDF

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Publication number
FR2493602A1
FR2493602A1 FR8023381A FR8023381A FR2493602A1 FR 2493602 A1 FR2493602 A1 FR 2493602A1 FR 8023381 A FR8023381 A FR 8023381A FR 8023381 A FR8023381 A FR 8023381A FR 2493602 A1 FR2493602 A1 FR 2493602A1
Authority
FR
France
Prior art keywords
base
external
positioning
connections
base according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8023381A
Other languages
English (en)
French (fr)
Other versions
FR2493602B1 (https=
Inventor
Jean Doyen
Philippe Morel
Jean-Claude Resneau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8023381A priority Critical patent/FR2493602A1/fr
Priority to US06/315,269 priority patent/US4425575A/en
Publication of FR2493602A1 publication Critical patent/FR2493602A1/fr
Application granted granted Critical
Publication of FR2493602B1 publication Critical patent/FR2493602B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Die Bonding (AREA)
FR8023381A 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule Granted FR2493602A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8023381A FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule
US06/315,269 US4425575A (en) 1980-10-31 1981-10-26 Base for encapsulating components with coplanar electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8023381A FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule

Publications (2)

Publication Number Publication Date
FR2493602A1 true FR2493602A1 (fr) 1982-05-07
FR2493602B1 FR2493602B1 (https=) 1982-12-03

Family

ID=9247562

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8023381A Granted FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule

Country Status (2)

Country Link
US (1) US4425575A (https=)
FR (1) FR2493602A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
GB8701951D0 (en) * 1987-01-29 1987-03-04 M O Valve Co Ltd Integrated circuit package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2098403A1 (https=) * 1970-07-15 1972-03-10 Trw Inc
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
FR2317852A1 (fr) * 1975-07-07 1977-02-04 Nat Semiconductor Corp Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban
DE2718267A1 (de) * 1977-04-25 1978-11-02 Heraeus Gmbh W C Verfahren und vorrichtung zum herstellen von leiterrahmen fuer halbleiteranordnungen

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2098403A1 (https=) * 1970-07-15 1972-03-10 Trw Inc
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
FR2317852A1 (fr) * 1975-07-07 1977-02-04 Nat Semiconductor Corp Ruban d'interconnexion pour liaison d'ensemble de dispositifs semi-conducteurs et procede de fabrication d'un tel ruban
DE2718267A1 (de) * 1977-04-25 1978-11-02 Heraeus Gmbh W C Verfahren und vorrichtung zum herstellen von leiterrahmen fuer halbleiteranordnungen

Also Published As

Publication number Publication date
US4425575A (en) 1984-01-10
FR2493602B1 (https=) 1982-12-03

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