FR2487580B1 - - Google Patents

Info

Publication number
FR2487580B1
FR2487580B1 FR8016124A FR8016124A FR2487580B1 FR 2487580 B1 FR2487580 B1 FR 2487580B1 FR 8016124 A FR8016124 A FR 8016124A FR 8016124 A FR8016124 A FR 8016124A FR 2487580 B1 FR2487580 B1 FR 2487580B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8016124A
Other languages
French (fr)
Other versions
FR2487580A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Le Materiel Telephonique Thomson CSF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Le Materiel Telephonique Thomson CSF filed Critical Le Materiel Telephonique Thomson CSF
Priority to FR8016124A priority Critical patent/FR2487580A1/fr
Publication of FR2487580A1 publication Critical patent/FR2487580A1/fr
Application granted granted Critical
Publication of FR2487580B1 publication Critical patent/FR2487580B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
FR8016124A 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication Granted FR2487580A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8016124A FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8016124A FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2487580A1 FR2487580A1 (fr) 1982-01-29
FR2487580B1 true FR2487580B1 (ref) 1984-02-17

Family

ID=9244392

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8016124A Granted FR2487580A1 (fr) 1980-07-22 1980-07-22 Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2487580A1 (ref)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090503A3 (en) * 1982-03-25 1985-05-22 Texas Instruments Incorporated Apparatus and method of packaging a semiconductor device
FR2734984B1 (fr) * 1995-05-29 1997-08-22 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
FR2734983B1 (fr) * 1995-05-29 1997-07-04 Sgs Thomson Microelectronics Utilisation d'un micromodule comme boitier de montage en surface et procede correspondant
JPH1065085A (ja) * 1996-06-28 1998-03-06 Siemens Ag パワーパッケージ内で使用するためのリードフレーム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure

Also Published As

Publication number Publication date
FR2487580A1 (fr) 1982-01-29

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Legal Events

Date Code Title Description
ST Notification of lapse