FR2464491B1 - - Google Patents
Info
- Publication number
- FR2464491B1 FR2464491B1 FR8011822A FR8011822A FR2464491B1 FR 2464491 B1 FR2464491 B1 FR 2464491B1 FR 8011822 A FR8011822 A FR 8011822A FR 8011822 A FR8011822 A FR 8011822A FR 2464491 B1 FR2464491 B1 FR 2464491B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5503279A | 1979-07-05 | 1979-07-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2464491A1 FR2464491A1 (en) | 1981-03-06 |
FR2464491B1 true FR2464491B1 (en) | 1985-02-08 |
Family
ID=21995121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8011822A Granted FR2464491A1 (en) | 1979-07-05 | 1980-05-28 | OPTICAL COUPLING MODULE APPLIED TO A PLANAR MOUNTED OPTOELECTRONIC DEVICE AND METHOD OF MAKING THE COUPLING |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5615083A (en) |
DE (1) | DE3022893A1 (en) |
FR (1) | FR2464491A1 (en) |
GB (1) | GB2052785B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503458A1 (en) * | 1981-04-02 | 1982-10-08 | Cit Alcatel | Optical head mfg. process for electroluminescent device - has unitary construction with U=shaped tin diffusion on substrate with stems holding fibre and device respectively |
JPS59501605A (en) * | 1982-09-09 | 1984-09-06 | プレツシ− オ−バ−シ−ズ リミテツド | optical device |
GB2126795B (en) * | 1982-09-09 | 1986-12-03 | Plessey Co Plc | Optical device |
JPS6064653U (en) * | 1983-10-11 | 1985-05-08 | 日立電線株式会社 | Optical transceiver device |
DE3337131A1 (en) * | 1983-10-12 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | FIBERGLASS THROUGH A WALL OPENING OF A HOUSING |
JPS61191642U (en) * | 1985-05-20 | 1986-11-28 | ||
GB2230349A (en) * | 1989-04-08 | 1990-10-17 | Oxley Dev Co Ltd | "fibre optic/led coupling". |
WO1996000920A1 (en) * | 1994-06-30 | 1996-01-11 | The Whitaker Corporation | Optoelectronic package and bidirectional optical transceiver for use therein |
DE19636162B4 (en) * | 1996-09-06 | 2006-04-20 | Dbt Gmbh | Connecting cable with at least one optical waveguide with terminally arranged connection elements |
TW200821652A (en) * | 2006-07-26 | 2008-05-16 | Tomoegawa Co Ltd | Optical connecting parts and optical connecting structure |
JP2008109048A (en) * | 2006-10-27 | 2008-05-08 | Toshiba Corp | Optical semiconductor device and optical transmitter |
US10551542B1 (en) * | 2018-12-11 | 2020-02-04 | Corning Incorporated | Light modules and devices incorporating light modules |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4144541A (en) * | 1977-01-27 | 1979-03-13 | Electric Power Research Institute, Inc. | Light-activated semiconductor device package unit |
US4207587A (en) * | 1977-05-26 | 1980-06-10 | Electric Power Research Institute, Inc. | Package for light-triggered thyristor |
US4131905A (en) * | 1977-05-26 | 1978-12-26 | Electric Power Research Institute, Inc. | Light-triggered thyristor and package therefore |
-
1980
- 1980-05-12 GB GB8015602A patent/GB2052785B/en not_active Expired
- 1980-05-12 JP JP6267680A patent/JPS5615083A/en active Granted
- 1980-05-28 FR FR8011822A patent/FR2464491A1/en active Granted
- 1980-06-19 DE DE19803022893 patent/DE3022893A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPS5615083A (en) | 1981-02-13 |
JPS6311788B2 (en) | 1988-03-16 |
FR2464491A1 (en) | 1981-03-06 |
DE3022893A1 (en) | 1981-01-22 |
GB2052785A (en) | 1981-01-28 |
GB2052785B (en) | 1983-10-19 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |