FR2447663B1 - - Google Patents

Info

Publication number
FR2447663B1
FR2447663B1 FR7902422A FR7902422A FR2447663B1 FR 2447663 B1 FR2447663 B1 FR 2447663B1 FR 7902422 A FR7902422 A FR 7902422A FR 7902422 A FR7902422 A FR 7902422A FR 2447663 B1 FR2447663 B1 FR 2447663B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7902422A
Other languages
French (fr)
Other versions
FR2447663A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De Dietrich et Cie SA
Original Assignee
De Dietrich et Cie SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Dietrich et Cie SA filed Critical De Dietrich et Cie SA
Priority to FR7902422A priority Critical patent/FR2447663A1/fr
Publication of FR2447663A1 publication Critical patent/FR2447663A1/fr
Application granted granted Critical
Publication of FR2447663B1 publication Critical patent/FR2447663B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR7902422A 1979-01-25 1979-01-25 Plaquette en tole emaillee pour circuit imprime Granted FR2447663A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7902422A FR2447663A1 (fr) 1979-01-25 1979-01-25 Plaquette en tole emaillee pour circuit imprime

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7902422A FR2447663A1 (fr) 1979-01-25 1979-01-25 Plaquette en tole emaillee pour circuit imprime

Publications (2)

Publication Number Publication Date
FR2447663A1 FR2447663A1 (fr) 1980-08-22
FR2447663B1 true FR2447663B1 (hu) 1982-07-16

Family

ID=9221400

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7902422A Granted FR2447663A1 (fr) 1979-01-25 1979-01-25 Plaquette en tole emaillee pour circuit imprime

Country Status (1)

Country Link
FR (1) FR2447663A1 (hu)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1526911A (fr) * 1965-10-26 1968-05-31 English Electric Leo Marconi C Tableaux de connexions électriques notamment pour calculatrices électroniques
US3296099A (en) * 1966-05-16 1967-01-03 Western Electric Co Method of making printed circuits

Also Published As

Publication number Publication date
FR2447663A1 (fr) 1980-08-22

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Legal Events

Date Code Title Description
ST Notification of lapse