FR2430095B1 - - Google Patents
Info
- Publication number
- FR2430095B1 FR2430095B1 FR7916689A FR7916689A FR2430095B1 FR 2430095 B1 FR2430095 B1 FR 2430095B1 FR 7916689 A FR7916689 A FR 7916689A FR 7916689 A FR7916689 A FR 7916689A FR 2430095 B1 FR2430095 B1 FR 2430095B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH714678A CH630490A5 (en) | 1978-06-30 | 1978-06-30 | HOUSING FOR A SEMICONDUCTOR HIGH-PERFORMANCE COMPONENT. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2430095A1 FR2430095A1 (en) | 1980-01-25 |
FR2430095B1 true FR2430095B1 (en) | 1983-12-09 |
Family
ID=4320669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7916689A Granted FR2430095A1 (en) | 1978-06-30 | 1979-06-28 | HIGH POWER SEMICONDUCTOR COMPONENT PACKAGE |
Country Status (6)
Country | Link |
---|---|
US (1) | US4426659A (en) |
JP (1) | JPS559498A (en) |
CH (1) | CH630490A5 (en) |
DE (1) | DE2831153A1 (en) |
FR (1) | FR2430095A1 (en) |
GB (1) | GB2024514B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5635443A (en) | 1979-08-31 | 1981-04-08 | Toshiba Corp | Semiconductor device |
DE3308720A1 (en) * | 1983-03-11 | 1984-09-13 | Siemens AG, 1000 Berlin und 8000 München | SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING |
DE3308661A1 (en) * | 1983-03-11 | 1984-09-20 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | SEMICONDUCTOR ELEMENT |
JPH0693468B2 (en) * | 1988-08-09 | 1994-11-16 | 株式会社東芝 | Pressure contact type semiconductor device |
DE8909244U1 (en) * | 1989-07-31 | 1989-09-21 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
JPH0760893B2 (en) * | 1989-11-06 | 1995-06-28 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
JPH0744191B2 (en) * | 1989-12-15 | 1995-05-15 | 三菱電機株式会社 | Semiconductor device and electrode block therefor |
DE9114268U1 (en) * | 1991-11-15 | 1992-01-09 | Siemens Ag, 8000 Muenchen, De | |
JP4085536B2 (en) * | 1998-11-09 | 2008-05-14 | 株式会社日本自動車部品総合研究所 | ELECTRIC DEVICE, ITS MANUFACTURING METHOD, AND PRESSURE SEMICONDUCTOR DEVICE |
JP2015056487A (en) * | 2013-09-11 | 2015-03-23 | 株式会社東芝 | Semiconductor device |
DE112019006791T5 (en) * | 2019-02-01 | 2022-01-13 | Mitsubishi Electric Corporation | SEMICONDUCTOR UNIT |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1968698U (en) * | 1966-01-22 | 1967-09-21 | Siemens Ag | SEMICONDUCTOR COMPONENT. |
DE2014289A1 (en) * | 1970-03-25 | 1971-10-14 | Semikron Gleichrichterbau | Disc-shaped semiconductor component and method for its manufacture |
JPS5343080Y2 (en) * | 1973-06-18 | 1978-10-17 | ||
JPS5529444Y2 (en) * | 1975-10-14 | 1980-07-14 | ||
JPS5254284U (en) * | 1975-10-15 | 1977-04-19 | ||
CH601917A5 (en) * | 1976-10-27 | 1978-07-14 | Bbc Brown Boveri & Cie | |
JPS5354971A (en) * | 1976-10-28 | 1978-05-18 | Mitsubishi Electric Corp | Semiconductor device |
-
1978
- 1978-06-30 CH CH714678A patent/CH630490A5/en not_active IP Right Cessation
- 1978-07-15 DE DE19782831153 patent/DE2831153A1/en not_active Ceased
-
1979
- 1979-06-28 JP JP8083979A patent/JPS559498A/en active Granted
- 1979-06-28 FR FR7916689A patent/FR2430095A1/en active Granted
- 1979-06-28 GB GB7922549A patent/GB2024514B/en not_active Expired
-
1981
- 1981-04-08 US US06/252,208 patent/US4426659A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2024514B (en) | 1983-01-06 |
GB2024514A (en) | 1980-01-09 |
CH630490A5 (en) | 1982-06-15 |
DE2831153A1 (en) | 1980-01-10 |
FR2430095A1 (en) | 1980-01-25 |
US4426659A (en) | 1984-01-17 |
JPS6410938B2 (en) | 1989-02-22 |
JPS559498A (en) | 1980-01-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |