FR2413016B1 - - Google Patents

Info

Publication number
FR2413016B1
FR2413016B1 FR7739192A FR7739192A FR2413016B1 FR 2413016 B1 FR2413016 B1 FR 2413016B1 FR 7739192 A FR7739192 A FR 7739192A FR 7739192 A FR7739192 A FR 7739192A FR 2413016 B1 FR2413016 B1 FR 2413016B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7739192A
Other languages
French (fr)
Other versions
FR2413016A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7739192A priority Critical patent/FR2413016A1/fr
Publication of FR2413016A1 publication Critical patent/FR2413016A1/fr
Application granted granted Critical
Publication of FR2413016B1 publication Critical patent/FR2413016B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7739192A 1977-12-26 1977-12-26 Circuits imprimes multicouches a collecteur thermique incorpore Granted FR2413016A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7739192A FR2413016A1 (fr) 1977-12-26 1977-12-26 Circuits imprimes multicouches a collecteur thermique incorpore

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7739192A FR2413016A1 (fr) 1977-12-26 1977-12-26 Circuits imprimes multicouches a collecteur thermique incorpore

Publications (2)

Publication Number Publication Date
FR2413016A1 FR2413016A1 (fr) 1979-07-20
FR2413016B1 true FR2413016B1 (zh) 1981-06-26

Family

ID=9199336

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7739192A Granted FR2413016A1 (fr) 1977-12-26 1977-12-26 Circuits imprimes multicouches a collecteur thermique incorpore

Country Status (1)

Country Link
FR (1) FR2413016A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105657959A (zh) * 2015-09-22 2016-06-08 乐健集团有限公司 刚挠结合印刷电路板及制备刚挠结合印刷电路板的方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
DE3331112A1 (de) * 1983-08-30 1985-03-14 Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen Vorrichtung zur waermeabfuhr von leiterplatten
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
US5043845A (en) * 1989-10-16 1991-08-27 Eastman Kodak Company High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
DE59005035D1 (de) * 1990-12-12 1994-04-21 Siemens Ag Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte.
FR2671260B1 (fr) * 1990-12-27 1996-08-30 Telecommunications Sa Support de circuit imprime electrique a moyens de drainage thermique.
DE4204391A1 (de) * 1992-02-14 1993-08-19 Rheinmetall Gmbh Leiterkarte fuer eine leistungshalbleiter aufweisende leistungselektronikschaltung
US5280409A (en) * 1992-10-09 1994-01-18 Sun Microsystems, Inc. Heat sink and cover for tab integrated circuits
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
DE10335129B3 (de) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine
DE102007011811A1 (de) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Kupfer-Inlay für Leiterplatten
GB2460124A (en) * 2008-05-21 2009-11-25 Nujira Ltd Printed circuit board with co-planar plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2120197A5 (zh) * 1970-08-04 1972-08-18 Lannionnais Electronique
FR2207401B1 (zh) * 1972-11-22 1975-09-12 Cii
US4046442A (en) * 1975-05-07 1977-09-06 Burroughs Corporation Pluggable semiconductor device package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105657959A (zh) * 2015-09-22 2016-06-08 乐健集团有限公司 刚挠结合印刷电路板及制备刚挠结合印刷电路板的方法
CN105657959B (zh) * 2015-09-22 2019-05-21 乐健科技（珠海）有限公司 刚挠结合印刷电路板及制备刚挠结合印刷电路板的方法

Also Published As

Publication number Publication date
FR2413016A1 (fr) 1979-07-20

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Legal Events

Date Code Title Description
ST Notification of lapse