FR2411902A1 - Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating - Google Patents

Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

Info

Publication number
FR2411902A1
FR2411902A1 FR7738202A FR7738202A FR2411902A1 FR 2411902 A1 FR2411902 A1 FR 2411902A1 FR 7738202 A FR7738202 A FR 7738202A FR 7738202 A FR7738202 A FR 7738202A FR 2411902 A1 FR2411902 A1 FR 2411902A1
Authority
FR
France
Prior art keywords
substrate
metallised
composite material
textured
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7738202A
Other languages
French (fr)
Inventor
Miguel Coll-Palagos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stauffer Chemical Co
Original Assignee
Stauffer Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stauffer Chemical Co filed Critical Stauffer Chemical Co
Priority to FR7738202A priority Critical patent/FR2411902A1/en
Publication of FR2411902A1 publication Critical patent/FR2411902A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/70—Carriers or collectors characterised by shape or form
    • H01M4/80—Porous plates, e.g. sintered carriers
    • H01M4/808—Foamed, spongy materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1841—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

A substrate is metallised by (a) coating a (textured) substrate with a non-conductive hydrophilic composite material (I) to a thickness of 0.05-5 mils; (b) electrolessly plating with a conductive metal; and (c) electroplating with the desired metal. Also claimed is a method where after step (c), the substrate (textured) is removed from the metal. (I) comprises >=1 film forming component (A) and >=1 water-insol. hydrophilic component (B), the weight ratio of A:B being 3:10 - 10:1 and being soluble in a solvent without phase sepn. The substrate is pref. a cellular, three-dimensional network of macroscopic, interconnected cells, esp. of a solid organic material, e.g. reticulated polyurethane foam. The textured substrate is pref. used to make an embossing plate. Method is used to form metallised foams or textured surfaces for use on embossing rolls, for embossing e.g. plastics or leather. The metallised foam prod. can be compressed to a desired filling factor for use in heat exchangers, regenerators, catalyst supports, battery plates electrodes, etc. Coating with composite material eliminates the need for cleaning and etching steps normal in prior art.
FR7738202A 1977-12-19 1977-12-19 Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating Withdrawn FR2411902A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7738202A FR2411902A1 (en) 1977-12-19 1977-12-19 Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7738202A FR2411902A1 (en) 1977-12-19 1977-12-19 Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

Publications (1)

Publication Number Publication Date
FR2411902A1 true FR2411902A1 (en) 1979-07-13

Family

ID=9199003

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7738202A Withdrawn FR2411902A1 (en) 1977-12-19 1977-12-19 Metallised foams and embossing plates mfr. - by activating substrate with non-conductive hydrophilic composite material, electroless plating with conductive metal and electroplating

Country Status (1)

Country Link
FR (1) FR2411902A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004020696A2 (en) * 2002-08-21 2004-03-11 Infineon Technologies Ag Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2443488A1 (en) * 1973-10-25 1975-04-30 Akad Wissenschaften Ddr METALLIZED BODIES AND METHOD OF MANUFACTURING THEREOF

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2443488A1 (en) * 1973-10-25 1975-04-30 Akad Wissenschaften Ddr METALLIZED BODIES AND METHOD OF MANUFACTURING THEREOF

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/64 *
EXBK/72 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004020696A2 (en) * 2002-08-21 2004-03-11 Infineon Technologies Ag Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam
WO2004020696A3 (en) * 2002-08-21 2005-01-20 Infineon Technologies Ag Method for producing a foam metallic structure, metallic foam, and arrangement consisting of a carrier substrate and metallic foam
US7192509B2 (en) 2002-08-21 2007-03-20 Infineon Technologies Ag Process for producing a metal structure in foam form, a metal foam, and an arrangement having a carrier substrate and a metal foam

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Legal Events

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ST Notification of lapse