FR2368207A1 - MOLDED FRAME FOR PRINTED CIRCUIT PLATES - Google Patents
MOLDED FRAME FOR PRINTED CIRCUIT PLATESInfo
- Publication number
- FR2368207A1 FR2368207A1 FR7726215A FR7726215A FR2368207A1 FR 2368207 A1 FR2368207 A1 FR 2368207A1 FR 7726215 A FR7726215 A FR 7726215A FR 7726215 A FR7726215 A FR 7726215A FR 2368207 A1 FR2368207 A1 FR 2368207A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- molded frame
- molded
- approximately
- circuit plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
Abstract
a. Cadre moulé pour plaques à circuit imprimé. b. Il est réalisé par moulage à partir d'une matière plastique qui est non hygroscopique, resistante aux températures élevées, non toxique et ininflammable et qui présente une résistance à la flexion d'environ 1898 kg/cm**2, une résistance à la traction d'environ 1335 kg/cm**2 et un coefficient de dilatation thermique linéaire d'environ 2,41 x 10**-5 cm/cm/ degrés C. Le cadre à plaques est moulé de façon à ce qu'il comprenne des passages d'air et des trous pour broches de connexion et il est renforcé d'au moins une nervure et de plusieurs pièces rapportées de compression métalliques. c. Application dans les avions et engins spatiaux.at. Molded frame for printed circuit boards. b. It is made by molding from a plastic material which is non-hygroscopic, resistant to high temperatures, non-toxic and non-flammable and which has a flexural strength of about 1898 kg / cm ** 2, a tensile strength of approximately 1335 kg / cm ** 2 and a coefficient of linear thermal expansion of approximately 2.41 x 10 ** - 5 cm / cm / degrees C. The plate frame is molded so that it includes air passages and connection pin holes and is reinforced with at least one rib and several metal compression inserts. vs. Application in airplanes and spacecraft.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73297576A | 1976-10-18 | 1976-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2368207A1 true FR2368207A1 (en) | 1978-05-12 |
Family
ID=24945681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7726215A Pending FR2368207A1 (en) | 1976-10-18 | 1977-08-29 | MOLDED FRAME FOR PRINTED CIRCUIT PLATES |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5350466A (en) |
CA (1) | CA1078527A (en) |
DE (1) | DE2738620A1 (en) |
FR (1) | FR2368207A1 (en) |
GB (1) | GB1554506A (en) |
IL (1) | IL51947A (en) |
NO (1) | NO773483L (en) |
SE (1) | SE7711677L (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0248949A2 (en) * | 1986-06-11 | 1987-12-16 | Tektronix, Inc. | Carrier tray for circuit board |
FR2634098A1 (en) * | 1988-07-11 | 1990-01-12 | Gen Electric | ELECTRONIC CIRCUIT MODULE PROVIDED WITH COOLING |
FR2651636A1 (en) * | 1989-09-06 | 1991-03-08 | Segem | Modular electronic rack with built-in forced cooling |
WO1991010345A2 (en) * | 1989-12-22 | 1991-07-11 | The Foxboro Company | Lightweight sealed circuit board assembly |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106076A (en) * | 1976-07-12 | 1978-08-08 | Ncr Corporation | Electrical component and bus element assembly |
DE3038719C2 (en) * | 1980-10-14 | 1984-01-26 | Nixdorf Computer Ag, 4790 Paderborn | Subracks for electronic assemblies |
DE3221200A1 (en) * | 1981-06-05 | 1982-12-30 | Lucas Industries P.L.C., Birmingham, West Midlands | HOUSING ARRANGEMENT FOR ELECTRIC POWER CIRCUITS |
JPS59180466U (en) * | 1983-05-20 | 1984-12-01 | ソニー株式会社 | wiring board |
SE0004737D0 (en) | 2000-12-20 | 2000-12-20 | Ericsson Telefon Ab L M | Guide and support structure |
US6512672B1 (en) * | 2000-12-29 | 2003-01-28 | Cisco Technology, Inc. | Modular air flow distribution system |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2015361A1 (en) * | 1970-03-31 | 1971-10-21 | Siemens Ag | Rack assembly for electrical or electronic equipment |
US3899721A (en) * | 1974-03-20 | 1975-08-12 | Bell Telephone Labor Inc | Printed circuit card guide |
DE2454508A1 (en) * | 1974-11-16 | 1976-05-26 | Applic Elettro Telefoniche S P | Plug-in circuit board assembly for telephony - has lateral guide arms with contacts and base connector block |
-
1977
- 1977-04-25 GB GB17145/77A patent/GB1554506A/en not_active Expired
- 1977-04-26 CA CA277,007A patent/CA1078527A/en not_active Expired
- 1977-04-26 IL IL51947A patent/IL51947A/en unknown
- 1977-06-04 JP JP6622177A patent/JPS5350466A/en active Pending
- 1977-08-26 DE DE19772738620 patent/DE2738620A1/en active Pending
- 1977-08-29 FR FR7726215A patent/FR2368207A1/en active Pending
- 1977-10-12 NO NO773483A patent/NO773483L/en unknown
- 1977-10-17 SE SE7711677A patent/SE7711677L/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2015361A1 (en) * | 1970-03-31 | 1971-10-21 | Siemens Ag | Rack assembly for electrical or electronic equipment |
US3899721A (en) * | 1974-03-20 | 1975-08-12 | Bell Telephone Labor Inc | Printed circuit card guide |
DE2454508A1 (en) * | 1974-11-16 | 1976-05-26 | Applic Elettro Telefoniche S P | Plug-in circuit board assembly for telephony - has lateral guide arms with contacts and base connector block |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0248949A2 (en) * | 1986-06-11 | 1987-12-16 | Tektronix, Inc. | Carrier tray for circuit board |
EP0248949A3 (en) * | 1986-06-11 | 1989-07-12 | Tektronix, Inc. | Carrier tray for circuit board |
FR2634098A1 (en) * | 1988-07-11 | 1990-01-12 | Gen Electric | ELECTRONIC CIRCUIT MODULE PROVIDED WITH COOLING |
FR2651636A1 (en) * | 1989-09-06 | 1991-03-08 | Segem | Modular electronic rack with built-in forced cooling |
WO1991010345A2 (en) * | 1989-12-22 | 1991-07-11 | The Foxboro Company | Lightweight sealed circuit board assembly |
WO1991010345A3 (en) * | 1989-12-22 | 1991-08-22 | Foxboro Co | Lightweight sealed circuit board assembly |
Also Published As
Publication number | Publication date |
---|---|
IL51947A (en) | 1978-10-31 |
SE7711677L (en) | 1978-04-19 |
DE2738620A1 (en) | 1978-04-20 |
JPS5350466A (en) | 1978-05-08 |
GB1554506A (en) | 1979-10-24 |
IL51947A0 (en) | 1977-06-30 |
NO773483L (en) | 1978-04-19 |
CA1078527A (en) | 1980-05-27 |
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