FR2359910B1 - - Google Patents

Info

Publication number
FR2359910B1
FR2359910B1 FR7723280A FR7723280A FR2359910B1 FR 2359910 B1 FR2359910 B1 FR 2359910B1 FR 7723280 A FR7723280 A FR 7723280A FR 7723280 A FR7723280 A FR 7723280A FR 2359910 B1 FR2359910 B1 FR 2359910B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7723280A
Other languages
French (fr)
Other versions
FR2359910A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2359910A1 publication Critical patent/FR2359910A1/fr
Application granted granted Critical
Publication of FR2359910B1 publication Critical patent/FR2359910B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
FR7723280A 1976-07-28 1977-07-28 Installation pour revetir des articles localement par voie galvanique Granted FR2359910A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU762387555A SU642382A1 (ru) 1976-07-28 1976-07-28 Установка дл локального гальванопокрыти

Publications (2)

Publication Number Publication Date
FR2359910A1 FR2359910A1 (fr) 1978-02-24
FR2359910B1 true FR2359910B1 (en:Method) 1983-03-04

Family

ID=20671015

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7723280A Granted FR2359910A1 (fr) 1976-07-28 1977-07-28 Installation pour revetir des articles localement par voie galvanique

Country Status (9)

Country Link
US (1) US4126533A (en:Method)
CH (1) CH631492A5 (en:Method)
CS (1) CS188791B1 (en:Method)
DD (1) DD132676A1 (en:Method)
DE (1) DE2733720C3 (en:Method)
FR (1) FR2359910A1 (en:Method)
GB (1) GB1526648A (en:Method)
HU (1) HU176991B (en:Method)
SU (1) SU642382A1 (en:Method)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4364328A (en) * 1979-06-01 1982-12-21 Nippon Kokan Kabushiki Kaisha Apparatus for continuous dip-plating on one-side of steel strip
JPS5696098A (en) * 1979-12-29 1981-08-03 Electroplating Eng Of Japan Co Plating apparatus
DE3015282C2 (de) * 1980-04-21 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen
JPS5819170Y2 (ja) * 1980-08-16 1983-04-19 征一郎 相合 半導体ウェハ−のめっき装置
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
FR2516554B1 (fr) * 1981-11-17 1985-10-11 Radiall Sa Procede et machine pour le depot d'un metal de recouvrement sur une zone d'une piece metallique
US4404079A (en) * 1982-02-08 1983-09-13 National Semiconductor Corporation Plating mask support
GB2157674B (en) * 1984-07-05 1988-06-29 Electroglass Ltd Forehearths
ATE184923T1 (de) * 1996-04-01 1999-10-15 Sonopress Prod Galvanische abscheidungszelle mit einem trägerhalter
EP0913500B1 (de) * 1996-04-01 2002-07-03 Sono press, PRODUKTIONSGESELLSCHAFT FÜR TON- UND INFORMATIONSTRÄGER mbH Galvanische Abscheidungszelle mit Justiervorrichtung
CA2572786A1 (en) * 1997-04-04 1998-10-15 University Of Southern California Method for electrochemical fabrication including etching to remove flash
US7259640B2 (en) * 2001-12-03 2007-08-21 Microfabrica Miniature RF and microwave components and methods for fabricating such components
US9614266B2 (en) 2001-12-03 2017-04-04 Microfabrica Inc. Miniature RF and microwave components and methods for fabricating such components
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US8613846B2 (en) 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
TWI297045B (en) * 2003-05-07 2008-05-21 Microfabrica Inc Methods and apparatus for forming multi-layer structures using adhered masks
US10297421B1 (en) 2003-05-07 2019-05-21 Microfabrica Inc. Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
CN106414814B (zh) * 2013-10-03 2019-07-09 Neo工业有限责任公司 用于制备与电镀工作辊的系统及方法
CN104294341B (zh) * 2014-01-10 2017-02-08 河南航天精工制造有限公司 用于对套筒类零件局部电镀的工装
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
CN112144092B (zh) * 2020-09-21 2021-08-24 顶群科技(深圳)有限公司 一种整流器配件电镀装置
CN112853439A (zh) * 2021-01-07 2021-05-28 江西元宗科技有限公司 一种铝合金管材存放架局部镀金设备
CN113174623B (zh) * 2021-04-27 2022-11-22 中国工程物理研究院核物理与化学研究所 一种小型薄平板工件多区域电镀装置
CN113529148B (zh) * 2021-07-23 2023-11-03 杨桂昌 一种电镀系统及电镀方法
CN115261941B (zh) * 2022-07-21 2025-07-29 重庆臻宝实业有限公司 一种铝合金局部膜层修复装置及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB775359A (en) * 1953-02-12 1957-05-22 Wmf Wuerttemberg Metallwaren Improvements relating to electro-deposition
US3745105A (en) * 1970-11-18 1973-07-10 Auric Corp Apparatus for selective electroplating of sheets
US3752755A (en) * 1971-07-15 1973-08-14 F Krafft Deburring apparatus
US3763027A (en) * 1971-10-12 1973-10-02 Oxy Metal Finishing Corp Sparger
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4029564A (en) * 1976-03-26 1977-06-14 Electroplating Engineers Of Japan, Limited High speed plating device for rectangular sheets

Also Published As

Publication number Publication date
DD132676A1 (de) 1978-10-18
US4126533A (en) 1978-11-21
SU642382A1 (ru) 1979-01-15
DE2733720B2 (de) 1979-10-25
FR2359910A1 (fr) 1978-02-24
CH631492A5 (de) 1982-08-13
DE2733720C3 (de) 1980-07-03
GB1526648A (en) 1978-09-27
DE2733720A1 (de) 1978-02-02
CS188791B1 (en) 1979-03-30
HU176991B (hu) 1981-06-28

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Legal Events

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