FR2341946A1 - COOLING DEVICE FOR A SEMICONDUCTOR COMPONENT COOLED BY LIQUID - Google Patents

COOLING DEVICE FOR A SEMICONDUCTOR COMPONENT COOLED BY LIQUID

Info

Publication number
FR2341946A1
FR2341946A1 FR7704453A FR7704453A FR2341946A1 FR 2341946 A1 FR2341946 A1 FR 2341946A1 FR 7704453 A FR7704453 A FR 7704453A FR 7704453 A FR7704453 A FR 7704453A FR 2341946 A1 FR2341946 A1 FR 2341946A1
Authority
FR
France
Prior art keywords
liquid
cooling device
semiconductor component
component cooled
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7704453A
Other languages
French (fr)
Other versions
FR2341946B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2341946A1 publication Critical patent/FR2341946A1/en
Application granted granted Critical
Publication of FR2341946B1 publication Critical patent/FR2341946B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7704453A 1976-02-17 1977-02-16 COOLING DEVICE FOR A SEMICONDUCTOR COMPONENT COOLED BY LIQUID Granted FR2341946A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762606157 DE2606157C2 (en) 1976-02-17 1976-02-17 Connection of a cooling box of a cooling device with a cooling liquid supply line or drainage line

Publications (2)

Publication Number Publication Date
FR2341946A1 true FR2341946A1 (en) 1977-09-16
FR2341946B1 FR2341946B1 (en) 1982-04-09

Family

ID=5970025

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7704453A Granted FR2341946A1 (en) 1976-02-17 1977-02-16 COOLING DEVICE FOR A SEMICONDUCTOR COMPONENT COOLED BY LIQUID

Country Status (5)

Country Link
AT (1) AT348063B (en)
CH (1) CH594289A5 (en)
DE (1) DE2606157C2 (en)
FR (1) FR2341946A1 (en)
GB (1) GB1536794A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3617611A1 (en) * 1986-05-24 1987-11-26 Licentia Gmbh Thermally conductive and electrically insulating interlayer for the build-up and fixing of semiconductor elements, and arrangement using such interlayers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160302C3 (en) * 1971-12-04 1975-07-17 Siemens Ag Cooling box for installation in disc cell stacks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NV171/69 *

Also Published As

Publication number Publication date
DE2606157C2 (en) 1983-11-10
ATA104577A (en) 1978-06-15
AT348063B (en) 1979-01-25
DE2606157A1 (en) 1977-08-18
GB1536794A (en) 1978-12-20
FR2341946B1 (en) 1982-04-09
CH594289A5 (en) 1978-01-13

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Legal Events

Date Code Title Description
ST Notification of lapse