FR2333351A1 - Dispositif d'application sous pression et de blocage pour elements semi-conducteurs - Google Patents
Dispositif d'application sous pression et de blocage pour elements semi-conducteursInfo
- Publication number
- FR2333351A1 FR2333351A1 FR7635809A FR7635809A FR2333351A1 FR 2333351 A1 FR2333351 A1 FR 2333351A1 FR 7635809 A FR7635809 A FR 7635809A FR 7635809 A FR7635809 A FR 7635809A FR 2333351 A1 FR2333351 A1 FR 2333351A1
- Authority
- FR
- France
- Prior art keywords
- locking device
- semiconductor elements
- pressure application
- pressure
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CS7500008082A CS180334B1 (en) | 1975-11-28 | 1975-11-28 | Power semiconducting disc elements suppressing and jigging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2333351A1 true FR2333351A1 (fr) | 1977-06-24 |
Family
ID=5430929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7635809A Pending FR2333351A1 (fr) | 1975-11-28 | 1976-11-26 | Dispositif d'application sous pression et de blocage pour elements semi-conducteurs |
Country Status (9)
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH616537A5 (US07847105-20101207-C00016.png) * | 1978-01-17 | 1980-03-31 | Bbc Brown Boveri & Cie | |
| US5549155A (en) * | 1995-04-18 | 1996-08-27 | Thermacore, Inc. | Integrated circuit cooling apparatus |
| TW335503B (en) * | 1996-02-23 | 1998-07-01 | Semiconductor Energy Lab Kk | Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2108123A1 (US07847105-20101207-C00016.png) * | 1970-09-30 | 1972-05-12 | Licentia Gmbh | |
| DE2224040A1 (de) * | 1970-09-30 | 1973-11-22 | Licentia Gmbh | Spannvorrichtung fuer scheibenfoermige halbleiterbauelemente |
| DE2310581A1 (de) * | 1973-03-02 | 1974-09-19 | Licentia Gmbh | Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelementes zwischen zwei kuehlkoerpern |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE628175A (US07847105-20101207-C00016.png) * | 1961-08-04 | 1900-01-01 | ||
| CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
| DE1514477C3 (de) * | 1965-06-10 | 1975-06-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiteranordnung mit einer Anzahl von Halbleiterbauelementen |
| GB1260657A (en) * | 1968-11-26 | 1972-01-19 | Westinghouse Brake & Signal | Improvements relating to mountings for rectifier devices |
| US3688159A (en) * | 1970-10-28 | 1972-08-29 | Cutler Hammer Inc | Compression mounted scr clamp with heat sink means |
| US3715632A (en) * | 1971-01-08 | 1973-02-06 | Gen Electric | Liquid cooled semiconductor device clamping assembly |
| US3743893A (en) * | 1971-05-27 | 1973-07-03 | Mitsubishi Electric Corp | Fluid cooled compression bonded semiconductor device structure |
| SU439034A1 (ru) * | 1972-06-07 | 1974-08-05 | Предприятие П/Я Р-6517 | Устройство дл охлаждени |
| US3808471A (en) * | 1972-10-26 | 1974-04-30 | Borg Warner | Expandible pressure mounted semiconductor assembly |
-
1975
- 1975-11-28 CS CS7500008082A patent/CS180334B1/cs unknown
-
1976
- 1976-10-26 DD DD7600195456A patent/DD127720A1/xx unknown
- 1976-10-27 PL PL1976193305A patent/PL99632B1/xx unknown
- 1976-10-28 CH CH1362176A patent/CH596669A5/xx not_active IP Right Cessation
- 1976-10-29 DE DE19762649824 patent/DE2649824A1/de active Pending
- 1976-11-05 SE SE7612392A patent/SE7612392L/xx unknown
- 1976-11-24 GB GB48952/76A patent/GB1511100A/en not_active Expired
- 1976-11-26 US US05/745,201 patent/US4104677A/en not_active Expired - Lifetime
- 1976-11-26 FR FR7635809A patent/FR2333351A1/fr active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2108123A1 (US07847105-20101207-C00016.png) * | 1970-09-30 | 1972-05-12 | Licentia Gmbh | |
| DE2224040A1 (de) * | 1970-09-30 | 1973-11-22 | Licentia Gmbh | Spannvorrichtung fuer scheibenfoermige halbleiterbauelemente |
| DE2310581A1 (de) * | 1973-03-02 | 1974-09-19 | Licentia Gmbh | Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelementes zwischen zwei kuehlkoerpern |
Also Published As
| Publication number | Publication date |
|---|---|
| SE7612392L (sv) | 1977-05-29 |
| US4104677A (en) | 1978-08-01 |
| DE2649824A1 (de) | 1977-06-30 |
| CS180334B1 (en) | 1977-12-30 |
| DD127720A1 (de) | 1977-10-12 |
| PL99632B1 (pl) | 1978-07-31 |
| GB1511100A (en) | 1978-05-17 |
| CH596669A5 (US07847105-20101207-C00016.png) | 1978-03-15 |
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| FR2333351A1 (fr) | Dispositif d'application sous pression et de blocage pour elements semi-conducteurs |