FR2303443A1 - LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS - Google Patents
LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESSInfo
- Publication number
- FR2303443A1 FR2303443A1 FR7605864A FR7605864A FR2303443A1 FR 2303443 A1 FR2303443 A1 FR 2303443A1 FR 7605864 A FR7605864 A FR 7605864A FR 7605864 A FR7605864 A FR 7605864A FR 2303443 A1 FR2303443 A1 FR 2303443A1
- Authority
- FR
- France
- Prior art keywords
- large surface
- embodiment process
- hybrid microcircuit
- surface hybrid
- microcircuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55478775A | 1975-03-03 | 1975-03-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2303443A1 true FR2303443A1 (en) | 1976-10-01 |
Family
ID=24214717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7605864A Withdrawn FR2303443A1 (en) | 1975-03-03 | 1976-03-02 | LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS |
Country Status (4)
Country | Link |
---|---|
FR (1) | FR2303443A1 (en) |
GB (1) | GB1504663A (en) |
IL (1) | IL49060A (en) |
SE (1) | SE405195B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0003138A1 (en) * | 1978-01-13 | 1979-07-25 | Siemens Aktiengesellschaft | Wide band amplifier comprising an amplifying part and a feedback part |
EP0374007A1 (en) * | 1988-12-16 | 1990-06-20 | Thomson-Csf | Sealed encapsulation device for electronic components |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018110752A1 (en) * | 2018-05-04 | 2019-11-07 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Method for producing a connection contact |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2118752A5 (en) * | 1970-12-18 | 1972-07-28 | Hitachi Ltd |
-
1976
- 1976-02-09 GB GB4947/76A patent/GB1504663A/en not_active Expired
- 1976-02-18 IL IL49060A patent/IL49060A/en unknown
- 1976-02-23 SE SE7602160A patent/SE405195B/en unknown
- 1976-03-02 FR FR7605864A patent/FR2303443A1/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2118752A5 (en) * | 1970-12-18 | 1972-07-28 | Hitachi Ltd |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0003138A1 (en) * | 1978-01-13 | 1979-07-25 | Siemens Aktiengesellschaft | Wide band amplifier comprising an amplifying part and a feedback part |
EP0374007A1 (en) * | 1988-12-16 | 1990-06-20 | Thomson-Csf | Sealed encapsulation device for electronic components |
FR2640846A1 (en) * | 1988-12-16 | 1990-06-22 | Thomson Csf | HERMETIC ENCAPSULATION DEVICE FOR ELECTRONIC COMPONENTS |
Also Published As
Publication number | Publication date |
---|---|
SE405195B (en) | 1978-11-20 |
IL49060A0 (en) | 1976-04-30 |
SE7602160L (en) | 1976-09-06 |
GB1504663A (en) | 1978-03-22 |
IL49060A (en) | 1977-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |