FR2303443A1 - LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS - Google Patents

LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS

Info

Publication number
FR2303443A1
FR2303443A1 FR7605864A FR7605864A FR2303443A1 FR 2303443 A1 FR2303443 A1 FR 2303443A1 FR 7605864 A FR7605864 A FR 7605864A FR 7605864 A FR7605864 A FR 7605864A FR 2303443 A1 FR2303443 A1 FR 2303443A1
Authority
FR
France
Prior art keywords
large surface
embodiment process
hybrid microcircuit
surface hybrid
microcircuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7605864A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of FR2303443A1 publication Critical patent/FR2303443A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0091Housing specially adapted for small components
    • H05K5/0095Housing specially adapted for small components hermetically-sealed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304Protecting a component during manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7605864A 1975-03-03 1976-03-02 LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS Withdrawn FR2303443A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55478775A 1975-03-03 1975-03-03

Publications (1)

Publication Number Publication Date
FR2303443A1 true FR2303443A1 (en) 1976-10-01

Family

ID=24214717

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7605864A Withdrawn FR2303443A1 (en) 1975-03-03 1976-03-02 LARGE SURFACE HYBRID MICROCIRCUIT AND ITS EMBODIMENT PROCESS

Country Status (4)

Country Link
FR (1) FR2303443A1 (en)
GB (1) GB1504663A (en)
IL (1) IL49060A (en)
SE (1) SE405195B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0003138A1 (en) * 1978-01-13 1979-07-25 Siemens Aktiengesellschaft Wide band amplifier comprising an amplifying part and a feedback part
EP0374007A1 (en) * 1988-12-16 1990-06-20 Thomson-Csf Sealed encapsulation device for electronic components

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018110752A1 (en) * 2018-05-04 2019-11-07 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Method for producing a connection contact

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118752A5 (en) * 1970-12-18 1972-07-28 Hitachi Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118752A5 (en) * 1970-12-18 1972-07-28 Hitachi Ltd

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0003138A1 (en) * 1978-01-13 1979-07-25 Siemens Aktiengesellschaft Wide band amplifier comprising an amplifying part and a feedback part
EP0374007A1 (en) * 1988-12-16 1990-06-20 Thomson-Csf Sealed encapsulation device for electronic components
FR2640846A1 (en) * 1988-12-16 1990-06-22 Thomson Csf HERMETIC ENCAPSULATION DEVICE FOR ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
SE405195B (en) 1978-11-20
IL49060A0 (en) 1976-04-30
SE7602160L (en) 1976-09-06
GB1504663A (en) 1978-03-22
IL49060A (en) 1977-11-30

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Legal Events

Date Code Title Description
ST Notification of lapse