FR2282318A1 - Tete de liaison - Google Patents

Tete de liaison

Info

Publication number
FR2282318A1
FR2282318A1 FR7517705A FR7517705A FR2282318A1 FR 2282318 A1 FR2282318 A1 FR 2282318A1 FR 7517705 A FR7517705 A FR 7517705A FR 7517705 A FR7517705 A FR 7517705A FR 2282318 A1 FR2282318 A1 FR 2282318A1
Authority
FR
France
Prior art keywords
link head
link
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7517705A
Other languages
English (en)
French (fr)
Inventor
Gerald C Smith
Dennis L Ellingson
Colin A Johnson
Seong K Rhee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendix Corp
Original Assignee
Bendix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
Publication of FR2282318A1 publication Critical patent/FR2282318A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/025—Bonding tips therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electronic Switches (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7517705A 1974-08-23 1975-06-06 Tete de liaison Withdrawn FR2282318A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/499,890 US3943323A (en) 1974-08-23 1974-08-23 Bonding apparatus

Publications (1)

Publication Number Publication Date
FR2282318A1 true FR2282318A1 (fr) 1976-03-19

Family

ID=23987180

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7517705A Withdrawn FR2282318A1 (fr) 1974-08-23 1975-06-06 Tete de liaison

Country Status (8)

Country Link
US (1) US3943323A (enExample)
JP (1) JPS5125768A (enExample)
CA (1) CA1025060A (enExample)
DE (1) DE2529014A1 (enExample)
FR (1) FR2282318A1 (enExample)
IL (1) IL47367A0 (enExample)
NL (1) NL7507180A (enExample)
SE (1) SE7508492L (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4090656A (en) * 1974-01-25 1978-05-23 Bunker Ramo Corporation Soldering iron and method for soldering a plurality of wires to a connector
US4117306A (en) * 1977-07-18 1978-09-26 International Telephone & Telegraph Corp. Pouch sealing device
US4220845A (en) * 1978-10-02 1980-09-02 Burroughs Corporation Flat cable soldering apparatus
JPS5595393A (en) * 1978-12-25 1980-07-19 Fujitsu Ltd Soldering device
US4284466A (en) * 1979-12-17 1981-08-18 Western Electric Co., Inc. Bonding head
US4896019A (en) * 1985-12-09 1990-01-23 Hyun Kim T Electric soldering iron for simultaneously soldering or desoldering a row of integrated circuit leads
WO1989006581A1 (en) * 1985-12-09 1989-07-27 Henry Kim Means and method for soldering and desoldering electronic components
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
DE3824865A1 (de) * 1988-07-21 1990-01-25 Productech Gmbh Herstellen von loetflaechen
DE3824866A1 (de) * 1988-07-21 1990-01-25 Productech Gmbh Auftragen von flussmitteln
EP0367081A3 (en) * 1988-10-31 1991-03-27 National Semiconductor Corporation Outer lead bonding device
DE69018220T2 (de) * 1989-12-20 1995-07-27 Sumitomo Electric Industries Verbindungswerkzeug.
JPH0652747B2 (ja) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 断熱装置
US5182427A (en) * 1990-09-20 1993-01-26 Metcal, Inc. Self-regulating heater utilizing ferrite-type body
US5490786A (en) * 1994-03-25 1996-02-13 Itt Corporation Termination of contact tails to PC board
US5650081A (en) * 1994-06-29 1997-07-22 Zevatech, Inc. Thermode solder blade with electric heater greater than four ohms
US6040562A (en) * 1997-11-13 2000-03-21 Kabushiki Kaisha Kyushu Nissho Structure for uniform heating in a heating device
US6147326A (en) * 1998-09-25 2000-11-14 Seagate Technology, Inc. Soldering device with a plurality of spaced soldering tips and method of use
US6957686B2 (en) * 2003-06-23 2005-10-25 Mpi Incorporated Heated blades for wax melting
CN107671410B (zh) * 2016-08-01 2023-06-30 深圳长城开发科技股份有限公司 一种双排焊接头

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1120987A (en) * 1912-02-12 1914-12-15 Gen Electric Heating device.
US3099084A (en) * 1958-09-04 1963-07-30 Thuillier Marie Charles Alfred Method of manufacturing bits for soldering irons
US3136878A (en) * 1960-06-23 1964-06-09 Itt Soldering iron
US3569665A (en) * 1969-03-28 1971-03-09 Armstrong Cork Co Fixed temperature, rapid response, high energy heating device
US3582610A (en) * 1969-05-26 1971-06-01 Aerojet General Co Flat pack heater

Also Published As

Publication number Publication date
NL7507180A (nl) 1976-02-25
SE7508492L (sv) 1976-02-24
CA1025060A (en) 1978-01-24
US3943323A (en) 1976-03-09
IL47367A0 (en) 1975-07-28
JPS5125768A (enExample) 1976-03-02
DE2529014A1 (de) 1976-03-04

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Legal Events

Date Code Title Description
ST Notification of lapse