FR2211750A1 - - Google Patents

Info

Publication number
FR2211750A1
FR2211750A1 FR7245558A FR7245558A FR2211750A1 FR 2211750 A1 FR2211750 A1 FR 2211750A1 FR 7245558 A FR7245558 A FR 7245558A FR 7245558 A FR7245558 A FR 7245558A FR 2211750 A1 FR2211750 A1 FR 2211750A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7245558A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2211750A1 publication Critical patent/FR2211750A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10Integrated device layouts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/20Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
FR7245558A 1971-12-20 1972-12-12 Withdrawn FR2211750A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20984671A 1971-12-20 1971-12-20

Publications (1)

Publication Number Publication Date
FR2211750A1 true FR2211750A1 (https=) 1974-07-19

Family

ID=22780556

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7245558A Withdrawn FR2211750A1 (https=) 1971-12-20 1972-12-12

Country Status (5)

Country Link
US (1) US3751720A (https=)
JP (1) JPS5329437B2 (https=)
DE (1) DE2258483C2 (https=)
FR (1) FR2211750A1 (https=)
GB (1) GB1372129A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4958210A (en) * 1976-07-06 1990-09-18 General Electric Company High voltage integrated circuits
JPS5828365Y2 (ja) * 1977-04-07 1983-06-21 富士通株式会社 集積回路装置
US4575744A (en) * 1983-09-16 1986-03-11 International Business Machines Corporation Interconnection of elements on integrated circuit substrate
US4746966A (en) * 1985-10-21 1988-05-24 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits
US4731643A (en) * 1985-10-21 1988-03-15 International Business Machines Corporation Logic-circuit layout for large-scale integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2668184A (en) * 1952-02-15 1954-02-02 Gen Electric Multiple photocell structure
US3221215A (en) * 1962-01-30 1965-11-30 Nippon Electric Co Device comprising a plurality of electrical components
US3287610A (en) * 1965-03-30 1966-11-22 Bendix Corp Compatible package and transistor for high frequency operation "compact"
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
US3609294A (en) * 1969-10-10 1971-09-28 Ncr Co Thermal printing head with thin film printing elements
US3606679A (en) * 1969-10-29 1971-09-21 Fairchild Camera Instr Co Method for interconnecting solid state devices such as integrated circuit chips

Also Published As

Publication number Publication date
GB1372129A (en) 1974-10-30
JPS4870489A (https=) 1973-09-25
DE2258483C2 (de) 1983-10-27
DE2258483A1 (de) 1973-07-05
JPS5329437B2 (https=) 1978-08-21
US3751720A (en) 1973-08-07

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Legal Events

Date Code Title Description
ST Notification of lapse