FR2210013B1 - - Google Patents

Info

Publication number
FR2210013B1
FR2210013B1 FR7338179A FR7338179A FR2210013B1 FR 2210013 B1 FR2210013 B1 FR 2210013B1 FR 7338179 A FR7338179 A FR 7338179A FR 7338179 A FR7338179 A FR 7338179A FR 2210013 B1 FR2210013 B1 FR 2210013B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7338179A
Other languages
French (fr)
Other versions
FR2210013A1 (US06878557-20050412-C00065.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2210013A1 publication Critical patent/FR2210013A1/fr
Application granted granted Critical
Publication of FR2210013B1 publication Critical patent/FR2210013B1/fr
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/085Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312Organic layers, e.g. photoresist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
FR7338179A 1972-12-11 1973-10-15 Expired FR2210013B1 (US06878557-20050412-C00065.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00314050A US3827908A (en) 1972-12-11 1972-12-11 Method for improving photoresist adherence

Publications (2)

Publication Number Publication Date
FR2210013A1 FR2210013A1 (US06878557-20050412-C00065.png) 1974-07-05
FR2210013B1 true FR2210013B1 (US06878557-20050412-C00065.png) 1977-09-09

Family

ID=23218346

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7338179A Expired FR2210013B1 (US06878557-20050412-C00065.png) 1972-12-11 1973-10-15

Country Status (8)

Country Link
US (1) US3827908A (US06878557-20050412-C00065.png)
JP (1) JPS5147574B2 (US06878557-20050412-C00065.png)
CA (1) CA1002820A (US06878557-20050412-C00065.png)
CH (1) CH585919A5 (US06878557-20050412-C00065.png)
FR (1) FR2210013B1 (US06878557-20050412-C00065.png)
GB (1) GB1451375A (US06878557-20050412-C00065.png)
IT (1) IT1001747B (US06878557-20050412-C00065.png)
NL (1) NL7314991A (US06878557-20050412-C00065.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4497889A (en) * 1972-03-16 1985-02-05 E. I. Du Pont De Nemours And Company Release compound in negative acting photopolymerizable element
US4259430A (en) * 1974-05-01 1981-03-31 International Business Machines Corporation Photoresist O-quinone diazide containing composition and resist mask formation process
DE2529054C2 (de) * 1975-06-30 1982-04-29 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zur Herstellung eines zur Vorlage negativen Resistbildes
DE2547905C2 (de) * 1975-10-25 1985-11-21 Hoechst Ag, 6230 Frankfurt Lichtempfindliches Aufzeichnungsmaterial
DE2626419C2 (de) * 1976-06-12 1982-10-21 Ibm Deutschland Gmbh, 7000 Stuttgart Lichtempfindliches Gemisch
US4173470A (en) * 1977-11-09 1979-11-06 Bell Telephone Laboratories, Incorporated Novolak photoresist composition and preparation thereof
US4212935A (en) * 1978-02-24 1980-07-15 International Business Machines Corporation Method of modifying the development profile of photoresists
US4485167A (en) * 1980-10-06 1984-11-27 E. I. Du Pont De Nemours And Company Aqueous developable photopolymerizable elements
US4517281A (en) * 1980-10-06 1985-05-14 E. I. Du Pont De Nemours And Company Development process for aqueous developable photopolymerizable elements
EP0096096B1 (de) * 1982-06-14 1987-09-16 Ibm Deutschland Gmbh Verfahren zur Einstellung des Kantenwinkels in Polysilicium
US4431685A (en) * 1982-07-02 1984-02-14 International Business Machines Corporation Decreasing plated metal defects
US4608281A (en) * 1982-09-28 1986-08-26 Exxon Research And Engineering Co. Improvements in sensitivity of a positive polymer resist having a glass transition temperature through control of a molecular weight distribution and prebaked temperature
US4604305A (en) * 1982-09-28 1986-08-05 Exxon Research And Engineering Co. Improvements in contrast of a positive polymer resist having a glass transition temperature through control of the molecular weight distribution and prebaked temperature
NL8203980A (nl) * 1982-10-15 1984-05-01 Philips Nv Werkwijze voor de fotolithografische behandeling van een substraat.
US4464458A (en) * 1982-12-30 1984-08-07 International Business Machines Corporation Process for forming resist masks utilizing O-quinone diazide and pyrene
US4564584A (en) * 1983-12-30 1986-01-14 Ibm Corporation Photoresist lift-off process for fabricating semiconductor devices
JPS614143U (ja) * 1984-06-09 1986-01-11 川崎重工業株式会社 電気炉排ガスによるスクラップ予熱系における脱臭装置
US4732858A (en) * 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
JPH07120914A (ja) * 1993-10-21 1995-05-12 Hoechst Japan Ltd ポジ型ホトレジスト組成物

Also Published As

Publication number Publication date
CH585919A5 (US06878557-20050412-C00065.png) 1977-03-15
FR2210013A1 (US06878557-20050412-C00065.png) 1974-07-05
GB1451375A (en) 1976-09-29
US3827908A (en) 1974-08-06
NL7314991A (US06878557-20050412-C00065.png) 1974-06-13
JPS5147574B2 (US06878557-20050412-C00065.png) 1976-12-15
DE2361436A1 (de) 1974-06-12
CA1002820A (en) 1977-01-04
IT1001747B (it) 1976-04-30
JPS4990082A (US06878557-20050412-C00065.png) 1974-08-28
DE2361436B2 (de) 1977-05-05

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Legal Events

Date Code Title Description
ST Notification of lapse