FR2204887A1 - - Google Patents
Info
- Publication number
- FR2204887A1 FR2204887A1 FR7337774A FR7337774A FR2204887A1 FR 2204887 A1 FR2204887 A1 FR 2204887A1 FR 7337774 A FR7337774 A FR 7337774A FR 7337774 A FR7337774 A FR 7337774A FR 2204887 A1 FR2204887 A1 FR 2204887A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30104272 US3800191A (en) | 1972-10-26 | 1972-10-26 | Expandible pressure mounted semiconductor assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2204887A1 true FR2204887A1 (cg-RX-API-DMAC7.html) | 1974-05-24 |
Family
ID=23161685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7337774A Withdrawn FR2204887A1 (cg-RX-API-DMAC7.html) | 1972-10-26 | 1973-10-23 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3800191A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS4974337A (cg-RX-API-DMAC7.html) |
| AU (1) | AU6028873A (cg-RX-API-DMAC7.html) |
| CA (1) | CA984521A (cg-RX-API-DMAC7.html) |
| DE (1) | DE2348171A1 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2204887A1 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1415414A (cg-RX-API-DMAC7.html) |
| IT (1) | IT995590B (cg-RX-API-DMAC7.html) |
| ZA (1) | ZA737229B (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006138655A3 (en) * | 2005-06-16 | 2007-03-01 | Delta Design Inc | Apparatus and method for controlling die force in a semiconductor device testing assembly |
| WO2023222958A1 (fr) | 2022-05-20 | 2023-11-23 | Stellantis Auto Sas | Dispositif de contrôle de l'alimentation électrique d'un connecteur externe couplé temporairement à un connecteur de recharge d'un système |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3999105A (en) * | 1974-04-19 | 1976-12-21 | International Business Machines Corporation | Liquid encapsulated integrated circuit package |
| US3909678A (en) * | 1974-04-19 | 1975-09-30 | Ibm | Packaging structure for a plurality of wafer type integrated circuit elements |
| JPS5121136A (ja) * | 1974-08-14 | 1976-02-20 | Mitsubishi Electric Corp | Mitsupugataseiryusochi |
| US4603344A (en) * | 1984-07-30 | 1986-07-29 | Sundstrand Corporation | Rotating rectifier assembly |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE620870A (cg-RX-API-DMAC7.html) * | 1961-08-04 | 1900-01-01 | ||
| US3313987A (en) * | 1964-04-22 | 1967-04-11 | Int Rectifier Corp | Compression bonded semiconductor device |
| DE1614640B1 (de) * | 1967-10-26 | 1971-12-02 | Siemens Ag | Gleichrichteranordnung |
| DE1914790A1 (de) * | 1969-03-22 | 1970-10-01 | Siemens Ag | Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen |
| US3573574A (en) * | 1969-08-12 | 1971-04-06 | Gen Motors Corp | Controlled rectifier mounting assembly |
| SE350874B (cg-RX-API-DMAC7.html) * | 1970-03-05 | 1972-11-06 | Asea Ab | |
| SE340321B (cg-RX-API-DMAC7.html) * | 1970-03-23 | 1971-11-15 | Asea Ab | |
| US3652903A (en) * | 1971-02-01 | 1972-03-28 | Gen Electric | Fluid cooled pressure assembly |
| JPS4718967U (cg-RX-API-DMAC7.html) * | 1971-03-31 | 1972-11-02 |
-
1972
- 1972-10-26 US US30104272 patent/US3800191A/en not_active Expired - Lifetime
-
1973
- 1973-09-11 ZA ZA737229A patent/ZA737229B/xx unknown
- 1973-09-11 CA CA180,811A patent/CA984521A/en not_active Expired
- 1973-09-13 AU AU60288/73A patent/AU6028873A/en not_active Expired
- 1973-09-18 GB GB4383173A patent/GB1415414A/en not_active Expired
- 1973-09-25 DE DE19732348171 patent/DE2348171A1/de active Pending
- 1973-10-01 JP JP10943373A patent/JPS4974337A/ja active Pending
- 1973-10-04 IT IT2973973A patent/IT995590B/it active
- 1973-10-23 FR FR7337774A patent/FR2204887A1/fr not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006138655A3 (en) * | 2005-06-16 | 2007-03-01 | Delta Design Inc | Apparatus and method for controlling die force in a semiconductor device testing assembly |
| US7605581B2 (en) | 2005-06-16 | 2009-10-20 | Delta Design, Inc. | Apparatus and method for controlling die force in a semiconductor device testing assembly |
| WO2023222958A1 (fr) | 2022-05-20 | 2023-11-23 | Stellantis Auto Sas | Dispositif de contrôle de l'alimentation électrique d'un connecteur externe couplé temporairement à un connecteur de recharge d'un système |
Also Published As
| Publication number | Publication date |
|---|---|
| ZA737229B (en) | 1974-09-25 |
| AU6028873A (en) | 1975-03-13 |
| IT995590B (it) | 1975-11-20 |
| GB1415414A (en) | 1975-11-26 |
| JPS4974337A (cg-RX-API-DMAC7.html) | 1974-07-18 |
| US3800191A (en) | 1974-03-26 |
| CA984521A (en) | 1976-02-24 |
| DE2348171A1 (de) | 1974-05-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |