FR2197302A1 - Electronic components casing - with metal partitions lined with epoxy resin to obviate need for machining - Google Patents
Electronic components casing - with metal partitions lined with epoxy resin to obviate need for machiningInfo
- Publication number
- FR2197302A1 FR2197302A1 FR7230269A FR7230269A FR2197302A1 FR 2197302 A1 FR2197302 A1 FR 2197302A1 FR 7230269 A FR7230269 A FR 7230269A FR 7230269 A FR7230269 A FR 7230269A FR 2197302 A1 FR2197302 A1 FR 2197302A1
- Authority
- FR
- France
- Prior art keywords
- machining
- epoxy resin
- electronic components
- lined
- metal partitions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
A moulded metal casing partic. for electronic components e.g. printed circuit plates, comprises internal partitions with facing lateral grooves to receive and hold the plates and is characterised by the partitions having an outer unfinished moulded metal layer and an inner cold moulded synthetic plastic layer. The plastic is pref. an epoxy resin and its use obviates the need for machining while damping vibrations.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7230269A FR2197302A1 (en) | 1972-08-24 | 1972-08-24 | Electronic components casing - with metal partitions lined with epoxy resin to obviate need for machining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7230269A FR2197302A1 (en) | 1972-08-24 | 1972-08-24 | Electronic components casing - with metal partitions lined with epoxy resin to obviate need for machining |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2197302A1 true FR2197302A1 (en) | 1974-03-22 |
FR2197302B1 FR2197302B1 (en) | 1975-03-07 |
Family
ID=9103535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7230269A Granted FR2197302A1 (en) | 1972-08-24 | 1972-08-24 | Electronic components casing - with metal partitions lined with epoxy resin to obviate need for machining |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2197302A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0080538A1 (en) * | 1981-11-26 | 1983-06-08 | A.R.D. Technical Assistance And Engineering Services International Anstalt | Amplifier printed circuit board and mounting system therefor |
FR2521814A1 (en) * | 1982-02-16 | 1983-08-19 | Transrack | BAC FOR CIRCUIT BOARDS, IN PARTICULAR FOR BOXES AND BERRIES OF ELECTRONIC DEVICES |
DE3633800A1 (en) * | 1986-10-04 | 1988-04-14 | Endress Hauser Gmbh Co | DEVICE FOR RECEIVING, PROCESSING, RECEIVING AND PROMOTING ELECTRICAL SIGNALS |
EP0393236A1 (en) * | 1989-04-18 | 1990-10-24 | Mitsubishi Denki Kabushiki Kaisha | Electronic device housing with temperature management functions |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377515A (en) * | 1966-08-23 | 1968-04-09 | Potter Instrument Co Inc | Circuit card cage construction |
-
1972
- 1972-08-24 FR FR7230269A patent/FR2197302A1/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377515A (en) * | 1966-08-23 | 1968-04-09 | Potter Instrument Co Inc | Circuit card cage construction |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0080538A1 (en) * | 1981-11-26 | 1983-06-08 | A.R.D. Technical Assistance And Engineering Services International Anstalt | Amplifier printed circuit board and mounting system therefor |
FR2521814A1 (en) * | 1982-02-16 | 1983-08-19 | Transrack | BAC FOR CIRCUIT BOARDS, IN PARTICULAR FOR BOXES AND BERRIES OF ELECTRONIC DEVICES |
EP0087349A1 (en) * | 1982-02-16 | 1983-08-31 | Transrack | Frame for printed-circuit boards, especially for a rack or cabinet for electrical equipment |
DE3633800A1 (en) * | 1986-10-04 | 1988-04-14 | Endress Hauser Gmbh Co | DEVICE FOR RECEIVING, PROCESSING, RECEIVING AND PROMOTING ELECTRICAL SIGNALS |
EP0393236A1 (en) * | 1989-04-18 | 1990-10-24 | Mitsubishi Denki Kabushiki Kaisha | Electronic device housing with temperature management functions |
Also Published As
Publication number | Publication date |
---|---|
FR2197302B1 (en) | 1975-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |