FR2184977A1 - - Google Patents

Info

Publication number
FR2184977A1
FR2184977A1 FR7317919A FR7317919A FR2184977A1 FR 2184977 A1 FR2184977 A1 FR 2184977A1 FR 7317919 A FR7317919 A FR 7317919A FR 7317919 A FR7317919 A FR 7317919A FR 2184977 A1 FR2184977 A1 FR 2184977A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7317919A
Other languages
French (fr)
Other versions
FR2184977B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of FR2184977A1 publication Critical patent/FR2184977A1/fr
Application granted granted Critical
Publication of FR2184977B1 publication Critical patent/FR2184977B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
FR7317919A 1972-05-18 1973-05-17 Expired FR2184977B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE651572 1972-05-18

Publications (2)

Publication Number Publication Date
FR2184977A1 true FR2184977A1 (enrdf_load_stackoverflow) 1973-12-28
FR2184977B1 FR2184977B1 (enrdf_load_stackoverflow) 1977-02-11

Family

ID=20268883

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7317919A Expired FR2184977B1 (enrdf_load_stackoverflow) 1972-05-18 1973-05-17

Country Status (3)

Country Link
DE (1) DE2324006A1 (enrdf_load_stackoverflow)
FR (1) FR2184977B1 (enrdf_load_stackoverflow)
GB (1) GB1425373A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2006538B (en) 1977-10-24 1982-03-17 Asahi Chemical Ind Thin-film microcircuit board and method for making the same
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3189978A (en) * 1962-04-27 1965-06-22 Rca Corp Method of making multilayer circuits
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN" VOLUME 14, NO. 10, MARS 1972, "LASER DRILLED HOLES IN FIRED CERAMICS" F.F.FUGARDI ET AL) *

Also Published As

Publication number Publication date
FR2184977B1 (enrdf_load_stackoverflow) 1977-02-11
AU5523573A (en) 1974-11-07
DE2324006A1 (de) 1973-12-06
GB1425373A (en) 1976-02-18

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Legal Events

Date Code Title Description
ST Notification of lapse