FR2182133B3 - - Google Patents

Info

Publication number
FR2182133B3
FR2182133B3 FR7315132A FR7315132A FR2182133B3 FR 2182133 B3 FR2182133 B3 FR 2182133B3 FR 7315132 A FR7315132 A FR 7315132A FR 7315132 A FR7315132 A FR 7315132A FR 2182133 B3 FR2182133 B3 FR 2182133B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7315132A
Other languages
French (fr)
Other versions
FR2182133A1 (sv
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722220682 external-priority patent/DE2220682C3/de
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2182133A1 publication Critical patent/FR2182133A1/fr
Application granted granted Critical
Publication of FR2182133B3 publication Critical patent/FR2182133B3/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7315132A 1972-04-27 1973-04-26 Expired FR2182133B3 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722220682 DE2220682C3 (de) 1972-04-27 Kühlvorrichtung für ein scheibenförmiges, gekapseltes Halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2182133A1 FR2182133A1 (sv) 1973-12-07
FR2182133B3 true FR2182133B3 (sv) 1976-07-23

Family

ID=5843453

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315132A Expired FR2182133B3 (sv) 1972-04-27 1973-04-26

Country Status (4)

Country Link
AT (1) AT320797B (sv)
CH (1) CH549869A (sv)
FR (1) FR2182133B3 (sv)
IT (1) IT980359B (sv)

Also Published As

Publication number Publication date
DE2220682A1 (de) 1973-11-08
AT320797B (de) 1975-02-25
CH549869A (de) 1974-05-31
FR2182133A1 (sv) 1973-12-07
DE2220682B2 (de) 1975-06-05
IT980359B (it) 1974-09-30

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Legal Events

Date Code Title Description
ST Notification of lapse