FR2163443B1 - - Google Patents

Info

Publication number
FR2163443B1
FR2163443B1 FR7240428A FR7240428A FR2163443B1 FR 2163443 B1 FR2163443 B1 FR 2163443B1 FR 7240428 A FR7240428 A FR 7240428A FR 7240428 A FR7240428 A FR 7240428A FR 2163443 B1 FR2163443 B1 FR 2163443B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7240428A
Other languages
French (fr)
Other versions
FR2163443A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2163443A1 publication Critical patent/FR2163443A1/fr
Application granted granted Critical
Publication of FR2163443B1 publication Critical patent/FR2163443B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR7240428A 1971-12-13 1972-11-08 Expired FR2163443B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20733571A 1971-12-13 1971-12-13

Publications (2)

Publication Number Publication Date
FR2163443A1 FR2163443A1 (en) 1973-07-27
FR2163443B1 true FR2163443B1 (en) 1976-06-04

Family

ID=22770099

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7240428A Expired FR2163443B1 (en) 1971-12-13 1972-11-08

Country Status (3)

Country Link
JP (1) JPS4865457A (en)
DE (1) DE2257845A1 (en)
FR (1) FR2163443B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256588A (en) * 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
US3325881A (en) * 1963-01-08 1967-06-20 Sperry Rand Corp Electrical circuit board fabrication

Also Published As

Publication number Publication date
DE2257845A1 (en) 1973-06-28
JPS4865457A (en) 1973-09-08
FR2163443A1 (en) 1973-07-27

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Legal Events

Date Code Title Description
ST Notification of lapse