FR2155058A5 - - Google Patents

Info

Publication number
FR2155058A5
FR2155058A5 FR7135882A FR7135882A FR2155058A5 FR 2155058 A5 FR2155058 A5 FR 2155058A5 FR 7135882 A FR7135882 A FR 7135882A FR 7135882 A FR7135882 A FR 7135882A FR 2155058 A5 FR2155058 A5 FR 2155058A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7135882A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THERMONIC SA
Original Assignee
THERMONIC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THERMONIC SA filed Critical THERMONIC SA
Priority to FR7135882A priority Critical patent/FR2155058A5/fr
Application granted granted Critical
Publication of FR2155058A5 publication Critical patent/FR2155058A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR7135882A 1971-10-05 1971-10-05 Expired FR2155058A5 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7135882A FR2155058A5 (enExample) 1971-10-05 1971-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7135882A FR2155058A5 (enExample) 1971-10-05 1971-10-05

Publications (1)

Publication Number Publication Date
FR2155058A5 true FR2155058A5 (enExample) 1973-05-18

Family

ID=9083954

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7135882A Expired FR2155058A5 (enExample) 1971-10-05 1971-10-05

Country Status (1)

Country Link
FR (1) FR2155058A5 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108738229A (zh) * 2018-08-21 2018-11-02 深圳市泽华永盛技术有限公司 一种基板上的连接线路结构及其电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108738229A (zh) * 2018-08-21 2018-11-02 深圳市泽华永盛技术有限公司 一种基板上的连接线路结构及其电子设备

Similar Documents

Publication Publication Date Title
ATA136472A (enExample)
AR196074A1 (enExample)
AU2691671A (enExample)
AU2485671A (enExample)
AU2894671A (enExample)
AU2726271A (enExample)
AU2941471A (enExample)
AU2684071A (enExample)
AU2952271A (enExample)
AU2564071A (enExample)
AU2907471A (enExample)
AU2940971A (enExample)
AU3025871A (enExample)
AU2577671A (enExample)
AR199640Q (enExample)
AU2880771A (enExample)
AU2456871A (enExample)
AU2669471A (enExample)
AU2503871A (enExample)
AU2836771A (enExample)
AU2885171A (enExample)
AU2473671A (enExample)
AU2755871A (enExample)
AU2486471A (enExample)
AU2837671A (enExample)

Legal Events

Date Code Title Description
ST Notification of lapse