FR2144678A1 - - Google Patents

Info

Publication number
FR2144678A1
FR2144678A1 FR7222370A FR7222370A FR2144678A1 FR 2144678 A1 FR2144678 A1 FR 2144678A1 FR 7222370 A FR7222370 A FR 7222370A FR 7222370 A FR7222370 A FR 7222370A FR 2144678 A1 FR2144678 A1 FR 2144678A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7222370A
Other languages
French (fr)
Other versions
FR2144678B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2133843A external-priority patent/DE2133843A1/en
Priority claimed from DE2133877A external-priority patent/DE2133877A1/en
Priority claimed from DE2133876A external-priority patent/DE2133876A1/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2144678A1 publication Critical patent/FR2144678A1/fr
Application granted granted Critical
Publication of FR2144678B1 publication Critical patent/FR2144678B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14Substrate holders or susceptors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR7222370A 1971-07-07 1972-06-21 Expired FR2144678B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2133843A DE2133843A1 (en) 1971-07-07 1971-07-07 ARRANGEMENT FOR DIFFUSING DOCTANTS INTO SEMICONDUCTOR DISCS
DE2133877A DE2133877A1 (en) 1971-07-07 1971-07-07 ARRANGEMENT FOR DIFFUSING DOCTANTS INTO SEMICONDUCTOR DISCS
DE2133876A DE2133876A1 (en) 1971-07-07 1971-07-07 ARRANGEMENT FOR DIFFUSING DOPPANTS

Publications (2)

Publication Number Publication Date
FR2144678A1 true FR2144678A1 (en) 1973-02-16
FR2144678B1 FR2144678B1 (en) 1975-08-29

Family

ID=27183548

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7222370A Expired FR2144678B1 (en) 1971-07-07 1972-06-21

Country Status (4)

Country Link
FR (1) FR2144678B1 (en)
GB (1) GB1385730A (en)
IT (1) IT962430B (en)
NL (1) NL7206014A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2336796A1 (en) * 1975-12-22 1977-07-22 Siemens Ag PROCESS FOR THE THERMAL TREATMENT OF SEMICONDUCTOR DISCS
US4354453A (en) * 1979-01-12 1982-10-19 Matsushita Electric Industrial Co., Ltd. Substrate holder for liquid phase epitaxial growth
EP0612869A1 (en) * 1993-02-24 1994-08-31 STMicroelectronics S.A. Waferbasket for silicon wafers

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
WO1998035765A1 (en) * 1997-02-18 1998-08-20 Scp Global Technologies Multiple stage wet processing chamber
EP1297558B1 (en) * 2000-06-30 2011-04-20 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing and method of fabrication
US6450346B1 (en) 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
US20040188319A1 (en) * 2003-03-28 2004-09-30 Saint-Gobain Ceramics & Plastics, Inc. Wafer carrier having improved processing characteristics
DE102015004419A1 (en) * 2015-04-02 2016-10-06 Centrotherm Photovoltaics Ag Wafer boat and plasma treatment device for wafers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2336796A1 (en) * 1975-12-22 1977-07-22 Siemens Ag PROCESS FOR THE THERMAL TREATMENT OF SEMICONDUCTOR DISCS
US4354453A (en) * 1979-01-12 1982-10-19 Matsushita Electric Industrial Co., Ltd. Substrate holder for liquid phase epitaxial growth
EP0612869A1 (en) * 1993-02-24 1994-08-31 STMicroelectronics S.A. Waferbasket for silicon wafers
FR2702088A1 (en) * 1993-02-24 1994-09-02 Sgs Thomson Microelectronics Nacelle for silicon wafers.

Also Published As

Publication number Publication date
NL7206014A (en) 1973-01-09
IT962430B (en) 1973-12-20
GB1385730A (en) 1975-02-26
FR2144678B1 (en) 1975-08-29

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Legal Events

Date Code Title Description
ST Notification of lapse