FR2137227B2 - - Google Patents

Info

Publication number
FR2137227B2
FR2137227B2 FR7117736A FR7117736A FR2137227B2 FR 2137227 B2 FR2137227 B2 FR 2137227B2 FR 7117736 A FR7117736 A FR 7117736A FR 7117736 A FR7117736 A FR 7117736A FR 2137227 B2 FR2137227 B2 FR 2137227B2
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7117736A
Other languages
French (fr)
Other versions
FR2137227A2 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VAYDA PIERRE ANDRE CA
Original Assignee
VAYDA PIERRE ANDRE CA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VAYDA PIERRE ANDRE CA filed Critical VAYDA PIERRE ANDRE CA
Priority to FR7117736A priority Critical patent/FR2137227B2/fr
Priority to GB937672A priority patent/GB1387693A/en
Publication of FR2137227A2 publication Critical patent/FR2137227A2/fr
Application granted granted Critical
Publication of FR2137227B2 publication Critical patent/FR2137227B2/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005Punching of holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189Pressing leads, bumps or a die through an insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
FR7117736A 1971-03-03 1971-05-17 Expired FR2137227B2 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR7117736A FR2137227B2 (enrdf_load_stackoverflow) 1971-05-17 1971-05-17
GB937672A GB1387693A (en) 1971-03-03 1972-02-29 Method and apparatus for machining boards and the like for printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7117736A FR2137227B2 (enrdf_load_stackoverflow) 1971-05-17 1971-05-17

Publications (2)

Publication Number Publication Date
FR2137227A2 FR2137227A2 (enrdf_load_stackoverflow) 1972-12-29
FR2137227B2 true FR2137227B2 (enrdf_load_stackoverflow) 1973-11-30

Family

ID=9077142

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7117736A Expired FR2137227B2 (enrdf_load_stackoverflow) 1971-03-03 1971-05-17

Country Status (1)

Country Link
FR (1) FR2137227B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2748768B2 (ja) * 1992-03-19 1998-05-13 株式会社日立製作所 薄膜多層配線基板およびその製造方法

Also Published As

Publication number Publication date
FR2137227A2 (enrdf_load_stackoverflow) 1972-12-29

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