FR2136900B1 - - Google Patents

Info

Publication number
FR2136900B1
FR2136900B1 FR717116632A FR7116632A FR2136900B1 FR 2136900 B1 FR2136900 B1 FR 2136900B1 FR 717116632 A FR717116632 A FR 717116632A FR 7116632 A FR7116632 A FR 7116632A FR 2136900 B1 FR2136900 B1 FR 2136900B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR717116632A
Other languages
French (fr)
Other versions
FR2136900A1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ARTISTIQUE FRANCAISE SOC
Original Assignee
ARTISTIQUE FRANCAISE SOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ARTISTIQUE FRANCAISE SOC filed Critical ARTISTIQUE FRANCAISE SOC
Priority to FR717116632A priority Critical patent/FR2136900B1/fr
Publication of FR2136900A1 publication Critical patent/FR2136900A1/fr
Application granted granted Critical
Publication of FR2136900B1 publication Critical patent/FR2136900B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
FR717116632A 1971-05-07 1971-05-07 Expired FR2136900B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR717116632A FR2136900B1 (de) 1971-05-07 1971-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR717116632A FR2136900B1 (de) 1971-05-07 1971-05-07

Publications (2)

Publication Number Publication Date
FR2136900A1 FR2136900A1 (de) 1972-12-29
FR2136900B1 true FR2136900B1 (de) 1973-05-11

Family

ID=9076662

Family Applications (1)

Application Number Title Priority Date Filing Date
FR717116632A Expired FR2136900B1 (de) 1971-05-07 1971-05-07

Country Status (1)

Country Link
FR (1) FR2136900B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608125C3 (de) * 1976-02-27 1983-02-03 TE KA DE Felten & Guilleaume Fernmeldeanlagen GmbH, 8500 Nürnberg Einsatz für Gestelle der elektrischen Übertragungstechnik
DE4026020C1 (en) * 1990-08-17 1991-12-12 Hella Kg Hueck & Co, 4780 Lippstadt, De Transportable battery charging appts. esp. for vehicle - has ventilation holes in opposite sidewalls between cooling ribs of power section and panel for operating elements and display
DE19712723A1 (de) * 1997-03-26 1998-10-01 Ego Elektro Geraetebau Gmbh Kühlkörper
DE29915465U1 (de) * 1999-09-03 2001-01-18 Schneider-Clauss GmbH & Co. KG Metallwarenfabrikation, 50677 Köln Kühlelement
AT413163B (de) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog Kühlvorrichtung für einen chip sowie verfahren zur herstellung

Also Published As

Publication number Publication date
FR2136900A1 (de) 1972-12-29

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Legal Events

Date Code Title Description
ST Notification of lapse