FR2123443A1 - - Google Patents

Info

Publication number
FR2123443A1
FR2123443A1 FR7202597A FR7202597A FR2123443A1 FR 2123443 A1 FR2123443 A1 FR 2123443A1 FR 7202597 A FR7202597 A FR 7202597A FR 7202597 A FR7202597 A FR 7202597A FR 2123443 A1 FR2123443 A1 FR 2123443A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7202597A
Other languages
French (fr)
Other versions
FR2123443B1 (en:Method
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olivetti SpA
Original Assignee
Olivetti SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olivetti SpA filed Critical Olivetti SpA
Publication of FR2123443A1 publication Critical patent/FR2123443A1/fr
Application granted granted Critical
Publication of FR2123443B1 publication Critical patent/FR2123443B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7202597A 1971-01-29 1972-01-26 Expired FR2123443B1 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT6729671 1971-01-29

Publications (2)

Publication Number Publication Date
FR2123443A1 true FR2123443A1 (en:Method) 1972-09-08
FR2123443B1 FR2123443B1 (en:Method) 1979-01-05

Family

ID=11301232

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7202597A Expired FR2123443B1 (en:Method) 1971-01-29 1972-01-26

Country Status (5)

Country Link
US (1) US3789341A (en:Method)
DE (1) DE2204363A1 (en:Method)
FR (1) FR2123443B1 (en:Method)
GB (1) GB1371284A (en:Method)
SU (1) SU465809A3 (en:Method)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4271426A (en) * 1978-08-10 1981-06-02 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
US4461524A (en) * 1982-06-07 1984-07-24 Teledyne Industries, Inc. Frame type electrical connector for leadless integrated circuit packages
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
US4630174A (en) * 1983-10-31 1986-12-16 Kaufman Lance R Circuit package with external circuit board and connection
US4696525A (en) * 1985-12-13 1987-09-29 Amp Incorporated Socket for stacking integrated circuit packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2806188A (en) * 1954-05-12 1957-09-10 John J Kastner Crystal diode
US3641254A (en) * 1969-06-27 1972-02-08 W S Electronic Services Corp Microcircuit package and method of making same
US3627901A (en) * 1969-12-19 1971-12-14 Texas Instruments Inc Composite electronic device package-connector unit
US3575546A (en) * 1970-02-24 1971-04-20 James P Liautaud Header and shell encasement for electronic components and the like
US3700788A (en) * 1971-01-28 1972-10-24 Coars Porcelain Co Electrical component package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
SU465809A3 (ru) 1975-03-30
FR2123443B1 (en:Method) 1979-01-05
US3789341A (en) 1974-01-29
DE2204363A1 (de) 1972-08-03
GB1371284A (en) 1974-10-23

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Legal Events

Date Code Title Description
ST Notification of lapse