FR2088564A1 - - Google Patents

Info

Publication number
FR2088564A1
FR2088564A1 FR7117480A FR7117480A FR2088564A1 FR 2088564 A1 FR2088564 A1 FR 2088564A1 FR 7117480 A FR7117480 A FR 7117480A FR 7117480 A FR7117480 A FR 7117480A FR 2088564 A1 FR2088564 A1 FR 2088564A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7117480A
Other languages
French (fr)
Other versions
FR2088564B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19702023680 external-priority patent/DE2023680C3/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2088564A1 publication Critical patent/FR2088564A1/fr
Application granted granted Critical
Publication of FR2088564B1 publication Critical patent/FR2088564B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
FR7117480A 1970-05-14 1971-05-14 Expired FR2088564B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19702023680 DE2023680C3 (en) 1970-05-14 1970-05-14 Arrangement for making contact with semiconductor components and method for producing the same
DE19702057126 DE2057126C3 (en) 1970-05-14 1970-11-20 Arrangement and method for contacting semiconductor components

Publications (2)

Publication Number Publication Date
FR2088564A1 true FR2088564A1 (en) 1972-01-07
FR2088564B1 FR2088564B1 (en) 1977-08-05

Family

ID=34227360

Family Applications (2)

Application Number Title Priority Date Filing Date
FR7117480A Expired FR2088564B1 (en) 1970-05-14 1971-05-14
FR7141084A Expired FR2115206B2 (en) 1970-05-14 1971-11-17

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR7141084A Expired FR2115206B2 (en) 1970-05-14 1971-11-17

Country Status (3)

Country Link
DE (1) DE2057126C3 (en)
FR (2) FR2088564B1 (en)
NL (1) NL7115991A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108761A (en) * 1981-12-23 1983-06-28 Toshiba Corp Electronic component part

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6703605A (en) * 1966-03-09 1967-09-11
FR1534329A (en) * 1966-08-16 1968-07-26 Signetics Corp Integrated circuit assembly process
NL6808931A (en) * 1967-06-30 1968-12-31
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
DE1917399A1 (en) * 1969-04-03 1970-10-08 Siemens Ag Arrangement with semiconductor bodies containing at least two electrical switching elements or integrated electrical circuits
FR2039895A5 (en) * 1969-03-26 1971-01-15 Siemens Ag

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6703605A (en) * 1966-03-09 1967-09-11
FR1534329A (en) * 1966-08-16 1968-07-26 Signetics Corp Integrated circuit assembly process
US3486223A (en) * 1967-04-27 1969-12-30 Philco Ford Corp Solder bonding
NL6808931A (en) * 1967-06-30 1968-12-31
FR2039895A5 (en) * 1969-03-26 1971-01-15 Siemens Ag
DE1917399A1 (en) * 1969-04-03 1970-10-08 Siemens Ag Arrangement with semiconductor bodies containing at least two electrical switching elements or integrated electrical circuits

Also Published As

Publication number Publication date
FR2088564B1 (en) 1977-08-05
DE2057126A1 (en) 1972-05-25
DE2057126B2 (en) 1975-03-27
NL7115991A (en) 1972-05-24
DE2057126C3 (en) 1975-11-06
FR2115206B2 (en) 1977-11-25
FR2115206A2 (en) 1972-07-07

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Legal Events

Date Code Title Description
ST Notification of lapse