FR2086327A1 - - Google Patents

Info

Publication number
FR2086327A1
FR2086327A1 FR7114590A FR7114590A FR2086327A1 FR 2086327 A1 FR2086327 A1 FR 2086327A1 FR 7114590 A FR7114590 A FR 7114590A FR 7114590 A FR7114590 A FR 7114590A FR 2086327 A1 FR2086327 A1 FR 2086327A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7114590A
Other languages
French (fr)
Other versions
FR2086327B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPINNER GmbH ELEKTROTECH DT
Spinner GmbH
Original Assignee
SPINNER GmbH ELEKTROTECH DT
Spinner GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SPINNER GmbH ELEKTROTECH DT, Spinner GmbH filed Critical SPINNER GmbH ELEKTROTECH DT
Publication of FR2086327A1 publication Critical patent/FR2086327A1/fr
Application granted granted Critical
Publication of FR2086327B1 publication Critical patent/FR2086327B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
    • H01B11/1834—Construction of the insulation between the conductors
    • H01B11/1856—Discontinuous insulation
    • H01B11/186—Discontinuous insulation having the shape of a disc
FR7114590A 1970-04-24 1971-04-23 Expired FR2086327B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2020173A DE2020173C3 (en) 1970-04-24 1970-04-24 Insulating support arrangement in coaxial lines

Publications (2)

Publication Number Publication Date
FR2086327A1 true FR2086327A1 (en) 1971-12-31
FR2086327B1 FR2086327B1 (en) 1974-05-31

Family

ID=5769276

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7114590A Expired FR2086327B1 (en) 1970-04-24 1971-04-23

Country Status (4)

Country Link
US (1) US3760306A (en)
DE (1) DE2020173C3 (en)
FR (1) FR2086327B1 (en)
GB (1) GB1322852A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2644282A1 (en) * 1989-03-07 1990-09-14 Spinner Gmbh Elektrotech SUPPORT SYSTEM FOR INSULATING MATERIAL IN A COAXIAL LINE
EP1939974A1 (en) * 2006-12-30 2008-07-02 Rohm and Haas Electronic Materials LLC Three-dimensional microstructures and methods of formation thereof
US8542079B2 (en) 2007-03-20 2013-09-24 Nuvotronics, Llc Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9312589B2 (en) 2003-03-04 2016-04-12 Nuvotronics, Inc. Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section
US9505613B2 (en) 2011-06-05 2016-11-29 Nuvotronics, Inc. Devices and methods for solder flow control in three-dimensional microstructures
US9515364B1 (en) 2006-12-30 2016-12-06 Nuvotronics, Inc. Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume
US9583856B2 (en) 2011-06-06 2017-02-28 Nuvotronics, Inc. Batch fabricated microconnectors
US9608303B2 (en) 2013-01-26 2017-03-28 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US10002818B2 (en) 2007-03-20 2018-06-19 Nuvotronics, Inc. Integrated electronic components and methods of formation thereof
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10497511B2 (en) 2009-11-23 2019-12-03 Cubic Corporation Multilayer build processes and devices thereof
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2319183A1 (en) * 1975-07-22 1977-02-18 Comp Generale Electricite DEVICE FOR MAINTAINING THE GAP BETWEEN TWO ELECTRIC CONDUCTORS
US4161704A (en) * 1977-01-21 1979-07-17 Uniform Tubes, Inc. Coaxial cable and method of making the same
JPS5485389A (en) * 1977-12-21 1979-07-06 Kouenerugii Butsurigaku Kenkiy Insulated coaxial vacuum terminal
GB2093261B (en) * 1981-02-13 1984-11-28 Pirelli General Plc Electric cable
US4370511A (en) * 1981-03-17 1983-01-25 Westinghouse Electric Corp. Flexible gas insulated transmission line having regions of reduced electric field
WO2006065669A1 (en) * 2004-12-13 2006-06-22 Intest Corporation Signal module with reduced reflections
JP5083081B2 (en) * 2008-07-11 2012-11-28 富士通株式会社 Coaxial connector and high-frequency signal transmission method
JP5639194B2 (en) * 2010-01-22 2014-12-10 ヌボトロニクス，エルエルシー Thermal control
US8917150B2 (en) * 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1490633A1 (en) * 1964-08-20 1969-07-03 Siemens Ag Coaxial line section with inner conductor holder

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE27956C (en) * W. RlD-DERSTAD Hauptmann in Stockholm, Blasieholmstorg 11 Cards to war games
US2623122A (en) * 1947-01-02 1952-12-23 Polytechnic Inst Brooklyn Individually matched bead supports for coaxial cables
US2774944A (en) * 1948-10-01 1956-12-18 Siemens Ag Spacer disk arrangement for coaxial cables or the like
DE1064586B (en) * 1954-09-08 1959-09-03 Siemens Ag Termination or transition plugs for coaxial high-frequency lines and methods of manufacturing the same
DE1099021B (en) * 1954-11-30 1961-02-09 Siemens Ag Coaxial high-frequency transmission line with disc-shaped spacers sprayed onto the inner conductor at intervals
DE1040631B (en) * 1956-03-23 1958-10-09 Georg Spinner Dipl Ing Insulating support for coaxial lines for decimeter and centimeter waves
DE1160520B (en) * 1960-02-05 1964-01-02 Georg Spinner Dipl Ing Process for the production of reflection-free insulating supports for coaxial lines
CH483142A (en) * 1967-10-06 1969-12-15 Felten & Guilleaume Carlswerk Termination on a liquid cooled coaxial high frequency power cable

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1490633A1 (en) * 1964-08-20 1969-07-03 Siemens Ag Coaxial line section with inner conductor holder

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2644282A1 (en) * 1989-03-07 1990-09-14 Spinner Gmbh Elektrotech SUPPORT SYSTEM FOR INSULATING MATERIAL IN A COAXIAL LINE
US9312589B2 (en) 2003-03-04 2016-04-12 Nuvotronics, Inc. Coaxial waveguide microstructure having center and outer conductors configured in a rectangular cross-section
US10074885B2 (en) 2003-03-04 2018-09-11 Nuvotronics, Inc Coaxial waveguide microstructures having conductors formed by plural conductive layers
EP1939974A1 (en) * 2006-12-30 2008-07-02 Rohm and Haas Electronic Materials LLC Three-dimensional microstructures and methods of formation thereof
US9515364B1 (en) 2006-12-30 2016-12-06 Nuvotronics, Inc. Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume
US10431521B2 (en) 2007-03-20 2019-10-01 Cubic Corporation Integrated electronic components and methods of formation thereof
US8542079B2 (en) 2007-03-20 2013-09-24 Nuvotronics, Llc Coaxial transmission line microstructure including an enlarged coaxial structure for transitioning to an electrical connector
US9000863B2 (en) 2007-03-20 2015-04-07 Nuvotronics, Llc. Coaxial transmission line microstructure with a portion of increased transverse dimension and method of formation thereof
US9570789B2 (en) 2007-03-20 2017-02-14 Nuvotronics, Inc Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof
US10002818B2 (en) 2007-03-20 2018-06-19 Nuvotronics, Inc. Integrated electronic components and methods of formation thereof
US8659371B2 (en) 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US10497511B2 (en) 2009-11-23 2019-12-03 Cubic Corporation Multilayer build processes and devices thereof
US9505613B2 (en) 2011-06-05 2016-11-29 Nuvotronics, Inc. Devices and methods for solder flow control in three-dimensional microstructures
US9583856B2 (en) 2011-06-06 2017-02-28 Nuvotronics, Inc. Batch fabricated microconnectors
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
US9608303B2 (en) 2013-01-26 2017-03-28 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US10193203B2 (en) 2013-03-15 2019-01-29 Nuvotronics, Inc Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
US10257951B2 (en) 2013-03-15 2019-04-09 Nuvotronics, Inc Substrate-free interconnected electronic mechanical structural systems
US10361471B2 (en) 2013-03-15 2019-07-23 Nuvotronics, Inc Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
US9888600B2 (en) 2013-03-15 2018-02-06 Nuvotronics, Inc Substrate-free interconnected electronic mechanical structural systems
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US10310009B2 (en) 2014-01-17 2019-06-04 Nuvotronics, Inc Wafer scale test interface unit and contactors
US10511073B2 (en) 2014-12-03 2019-12-17 Cubic Corporation Systems and methods for manufacturing stacked circuits and transmission lines
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10553511B2 (en) 2017-12-01 2020-02-04 Cubic Corporation Integrated chip scale packages

Also Published As

Publication number Publication date
DE2020173B2 (en) 1980-04-10
DE2020173A1 (en) 1971-11-11
FR2086327B1 (en) 1974-05-31
GB1322852A (en) 1973-07-11
US3760306A (en) 1973-09-18
DE2020173C3 (en) 1981-01-08

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Legal Events

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