FR2080949A1 - - Google Patents

Info

Publication number
FR2080949A1
FR2080949A1 FR7103418A FR7103418A FR2080949A1 FR 2080949 A1 FR2080949 A1 FR 2080949A1 FR 7103418 A FR7103418 A FR 7103418A FR 7103418 A FR7103418 A FR 7103418A FR 2080949 A1 FR2080949 A1 FR 2080949A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7103418A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Group Services Ltd
Sperry Corp
Original Assignee
Sperry Rand Ltd
Sperry Rand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sperry Rand Ltd, Sperry Rand Corp filed Critical Sperry Rand Ltd
Publication of FR2080949A1 publication Critical patent/FR2080949A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49087—Resistor making with envelope or housing
    • Y10T29/49089—Filling with powdered insulation
    • Y10T29/49091—Filling with powdered insulation with direct compression of powdered insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
FR7103418A 1970-02-02 1971-02-02 Withdrawn FR2080949A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US793170A 1970-02-02 1970-02-02

Publications (1)

Publication Number Publication Date
FR2080949A1 true FR2080949A1 (fr) 1971-11-26

Family

ID=21728883

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7103418A Withdrawn FR2080949A1 (fr) 1970-02-02 1971-02-02

Country Status (4)

Country Link
US (1) US3616532A (fr)
JP (1) JPS5138422B1 (fr)
FR (1) FR2080949A1 (fr)
GB (1) GB1342832A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2464010A1 (fr) * 1979-08-18 1981-02-27 Int Computers Ltd Structure de circuit a plusieurs couches et son procede de production
FR2614494A1 (fr) * 1987-04-22 1988-10-28 Power Compact Procede d'assemblage de circuits de puissance et de circuits de commande sur plusieurs niveaux sur un meme module et module ainsi obtenu

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732379A (en) * 1971-03-23 1973-05-08 Bell Telephone Labor Inc Distribution board
SE391415B (sv) * 1971-07-14 1977-02-14 Ideal Ind Forbindningsdon
US4035577A (en) * 1973-06-04 1977-07-12 Thomas & Betts Corporation Tubular ferrule
SE444060B (sv) * 1975-04-09 1986-03-17 Raychem Corp Anordning for hopkoppling eller reparation av ror eller andra substrat
JPS5611706Y2 (fr) * 1976-03-19 1981-03-17
GB1599999A (en) * 1977-01-24 1981-10-14 Raychem Ltd Heat-recoverable articles
GB1599997A (en) * 1977-01-24 1981-10-14 Raychem Ltd Coil connector
GB1599998A (en) * 1977-01-24 1981-10-14 Raychem Ltd Dimensionally recoverable articles
DD131612B1 (de) * 1977-04-01 1980-02-27 Hermann Viehweger Anordnung zur durchkontaktierung von leiterplatten
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US5007841A (en) * 1983-05-31 1991-04-16 Trw Inc. Integrated-circuit chip interconnection system
US4574331A (en) * 1983-05-31 1986-03-04 Trw Inc. Multi-element circuit construction
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS6284973U (fr) * 1985-11-19 1987-05-30
US4992053A (en) * 1989-07-05 1991-02-12 Labinal Components And Systems, Inc. Electrical connectors
US5672062A (en) * 1991-01-30 1997-09-30 Labinal Components And Systems, Inc. Electrical connectors
US5013249A (en) * 1986-06-19 1991-05-07 Labinal Components And Systems, Inc. Electrical connectors
US5597313A (en) * 1986-06-19 1997-01-28 Labinal Components And Systems, Inc. Electrical connectors
US4885662A (en) * 1988-08-12 1989-12-05 Leonard A. Alkov Circuit module connection system
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US4922376A (en) * 1989-04-10 1990-05-01 Unistructure, Inc. Spring grid array interconnection for active microelectronic elements
US5127837A (en) * 1989-06-09 1992-07-07 Labinal Components And Systems, Inc. Electrical connectors and IC chip tester embodying same
US5485351A (en) * 1989-06-09 1996-01-16 Labinal Components And Systems, Inc. Socket assembly for integrated circuit chip package
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
DE69233259T2 (de) * 1991-12-31 2004-08-26 Tessera, Inc. Mehrlageschaltungsherstellung und Stuktur mit Anpassungsmöglichkeit und Komponenten dafür
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
JP2513443B2 (ja) * 1993-06-11 1996-07-03 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層回路基板組立体
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5382169A (en) * 1994-01-14 1995-01-17 Labinal Components And Systems, Inc. Electrical connectors
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5590460A (en) 1994-07-19 1997-01-07 Tessera, Inc. Method of making multilayer circuit
JP2002509639A (ja) * 1994-11-15 2002-03-26 フォームファクター，インコーポレイテッド 超小型電子素子の相互接続要素
JP3653131B2 (ja) * 1995-12-28 2005-05-25 日本発条株式会社 導電性接触子
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6247228B1 (en) * 1996-08-12 2001-06-19 Tessera, Inc. Electrical connection with inwardly deformable contacts
US6188028B1 (en) 1997-06-09 2001-02-13 Tessera, Inc. Multilayer structure with interlocking protrusions
US5968670A (en) * 1997-08-12 1999-10-19 International Business Machines Corporation Enhanced ceramic ball grid array using in-situ solder stretch with spring
US6335222B1 (en) * 1997-09-18 2002-01-01 Tessera, Inc. Microelectronic packages with solder interconnections
GB2330009B (en) * 1997-09-27 2001-11-28 Nec Technologies Method of electrically connecting a component to a PCB
US6354845B1 (en) * 2000-06-01 2002-03-12 Lucent Technologies Inc. Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates
ATE546086T1 (de) * 2001-06-18 2012-03-15 Given Imaging Ltd In-vivo-sensorvorrichtung mit einer leiterplatte aus starren und flexiblen abschnitten
US20040132320A1 (en) * 2002-12-20 2004-07-08 Dittmann Larry E. Land grid array connector
US7833151B2 (en) * 2002-12-26 2010-11-16 Given Imaging Ltd. In vivo imaging device with two imagers
US8500630B2 (en) 2004-06-30 2013-08-06 Given Imaging Ltd. In vivo device with flexible circuit board and method for assembly thereof
US20060104057A1 (en) * 2004-10-28 2006-05-18 Jerome Avron Device and method for in-vivo illumination
IL167782A (en) * 2005-03-31 2011-12-29 Given Imaging Ltd Antenna for an in vitro imaging system
JP2010045246A (ja) * 2008-08-14 2010-02-25 Fujitsu Ltd 基板ユニットとその製造方法
US8516691B2 (en) 2009-06-24 2013-08-27 Given Imaging Ltd. Method of assembly of an in vivo imaging device with a flexible circuit board
US20140262498A1 (en) * 2013-03-13 2014-09-18 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Interconnect Device and Assemblies Made Therewith
CN109699144A (zh) * 2017-10-23 2019-04-30 成都安驭科技有限公司 一种叠加型集成印刷电路板的安装结构
US10834828B2 (en) * 2018-01-26 2020-11-10 International Business Machines Corporation Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2464010A1 (fr) * 1979-08-18 1981-02-27 Int Computers Ltd Structure de circuit a plusieurs couches et son procede de production
FR2614494A1 (fr) * 1987-04-22 1988-10-28 Power Compact Procede d'assemblage de circuits de puissance et de circuits de commande sur plusieurs niveaux sur un meme module et module ainsi obtenu
EP0289439A1 (fr) * 1987-04-22 1988-11-02 POWER COMPACT, Société Anonyme: Procédé d'assemblage de circuits de puissance et de circuits de commande sur plusieurs niveaux sur un même module et module ainsi obtenu
US4858074A (en) * 1987-04-22 1989-08-15 Power Compact, Societe Anonyme Method of assembling power circuits and control circuits on several levels in the same module and a module thus obtained

Also Published As

Publication number Publication date
DE2103767A1 (de) 1971-08-19
GB1342832A (en) 1974-01-03
DE2103767B2 (de) 1976-01-02
JPS5138422B1 (fr) 1976-10-21
US3616532A (en) 1971-11-02

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Legal Events

Date Code Title Description
ST Notification of lapse